Stack die package
View Patent ↗In one embodiment, a stack die package can include a lead frame and a first die including a gate and a source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. The gate and source are flip chip coupled to the lead frame. The stack die package can include a second die including a gate and a drain that are located on a first surface of the second die and a source that is located on a second surface of the second die that is opposite the first surface. The source of the second die is facing the drain of the first die.
1. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.
2. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said source of said second die.
3. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.
4. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.
5. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.
6. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame and said source of said second die.
7. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame and said drain of said first die.
8. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.
9. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said source of said second die.
10. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.
11. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.
12. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.
13. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame and said source of said second die.
14. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame and said drain of said first die.
15. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die, said second die comprising Laterally Diffused Metal Oxide Semiconductor (LDMOS) technology;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.
16. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said source of said second die.
17. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.
18. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.
19. The stack die package of claim 18 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.
20. The stack die package of claim 18 , further comprising:
a third clip coupled to said lead frame and said source of said second die.