IP Library Granted Patent US 8,686,828
Granted Patent B2
US 8,686,828 · App. 13/569,721 · Granted Apr 1, 2014

Resistor and method for making same

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Quick Facts
Patent No.
US 8,686,828
App. No.
13/569,721
Granted
Apr 1, 2014
Kind
B2
Abstract

A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Claims (30)

1. A metal strip resistor, comprising:

a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;

a first adhesion layer and a second adhesion layer spaced apart from the first adhesion layer sputtered onto a surface of the metal strip;

a first termination sputtered onto the first adhesion layer, and a second opposite termination sputtered onto the second adhesion layer;

plating on each of the first and second opposite terminations; and

an insulating material overlaying the metal strip between the first and second opposite terminations.

2. The metal strip resistor of claim 1 , wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.

3. The metal strip resistor of claim 1 , wherein the insulating material comprises a silicone polyester.

4. The metal strip resistor of claim 1 , wherein the metal strip resistor is an 0402 size (1.0 mm by 0.5 mm) chip resistor.

5. A metal strip resistor, comprising:

a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;

an adhesion layer sputtered to the metal strip;

first and second opposite terminations sputtered to the adhesion layer;

plating on each of the first and second opposite terminations; and

an insulating material overlaying the metal strip between the first and second opposite terminations.

6. The metal strip resistor of claim 5 , wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.

7. The metal strip resistor of claim 5 , wherein the insulating material comprises a silicone polyester.

8. The metal strip resistor of claim 5 , wherein the metal strip resistor is an 0402 size (1.0 mm by 0.5 mm) chip resistor.

9. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate, the method comprising:

mating a mask to the metal strip to cover portions of the metal strip;

sputtering an adhesion layer to the metal strip, the mask preventing the adhesion layer from depositing on the portions of the metal strip covered by the mask, the portions of the metal strip covered by the mask forming a pattern including first and second opposite terminations adhered to the adhesion layer;

coating an insulative material to the metal strip; and

adjusting resistance of the metal strip.

10. The method of claim 9 , wherein the adhesion layer comprises copper, titanium, and tungsten.

11. The method of claim 9 , wherein the adjusting resistance is performed using a punch tool.

12. The method of claim 9 , wherein the adjusting resistance is performed using a laser.

13. The method of claim 9 , wherein the insulative material is a silicone polyester.

14. The method of claim 9 , wherein the insulative material is applied using a blade.

15. The method of claim 9 , further comprising singulating the metal strip resistor.

16. The method of claim 9 , further comprising packaging the metal strip resistor in an 0402 size (1.0 mm by 0.5 mm) chip resistor package.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
CHANGE OF NAME Recorded Nov 19, 2015
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037147/0371 →
SECURITY AGREEMENT Recorded Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2012
From: SMITH, CLARK L.; BERTSCH, THOMAS L.; WYATT, TODD L.; VEIK, THOMAS L.; BRUNE, RODNEY
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 028750/0287 →