Complete power management system implemented in a single surface mount package
View Patent ↗A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.
1. An apparatus including:
a complete power management system comprising:
a controller integrated circuit;
a power transistor coupled to said controller integrated circuit;
a plurality of passive circuit components comprising at least one inductor component and wherein said controller integrated circuit, said power transistor and said plurality of passive circuit components are functionally coupled to implement said complete power management system; and
wherein said controller integrated circuit, said power transistor and said plurality of passive circuit components are disposed on a leadless surface mounted package, and
wherein each component of said plurality of passive circuit components is coupled between lead posts of a metal leadframe coupling said controller integrated circuit and said power transistor.
2. The apparatus of claim 1 wherein said leadless surface mounted package further comprises an exposed metal bottom.
3. The apparatus of claim 1 wherein said exposed metal bottom functions as a heat sink for thermal dissipation.
4. The apparatus as described in claim 1 wherein said plurality of passive circuit components further comprise a resistor component and a capacitor component.
5. The apparatus of claim 1 wherein said metal leadframe comprises copper.
6. The apparatus as described in claim 1 further comprising a diode.
7. The apparatus as described in claim 1 wherein said controller integrated circuit and power transistor are connected to a leadframe using metal clip bonding.
8. The apparatus as described in claim 1 wherein said complete power management system is a DC to DC converter.
9. The apparatus as described in claim 1 wherein said complete power management system is a motion control circuit.
10. The apparatus as described in claim 1 wherein said complete power management system is a smart power module.
11. The apparatus as described in claim 1 wherein said complete power management system comprises a constant current controller.
12. The apparatus as described in claim 1 wherein said controller integrated circuit and said power transistor are functionally coupled via non substrate couplings.
13. The apparatus as described in claim 6 wherein said diode is connected using metal clip bonding.
14. The apparatus as described in claim 7 wherein said metal clip comprises copper.
15. The apparatus as described in claim 8 wherein said leadless surface mounted package comprises a first package contact for accepting a DC input voltage and a second package contact for supplying a regulated DC output voltage.
16. The apparatus as described in claim 11 wherein said leadless surface mounted package comprises a first package contact for accepting a DC input voltage and a second package contact for supplying a constant output current.
17. A DC to DC converter system comprising:
a controller integrated circuit;
a power MOSFET transistor coupled to said controller integrated circuit; and
a plurality of passive circuit components comprising:
an inductor;
a resistor;
a capacitor, and
wherein said controller integrated circuit, said power MOSFET transistor and said plurality of passive circuit components are disposed on a leadless surface mounted package with exposed metal bottom, and
wherein at least one component of said plurality of passive circuit components is coupled between lead posts of a leadframe coupling said controller integrated circuit and said power MOSFET transistor.
18. The system as described in claim 17 wherein said exposed metal bottom functions as a heat sink for thermal dissipation.
19. The system as described in claim 17 further comprising a diode.
20. The system as described in claim 17 wherein said driver integrated circuit, controller integrated circuit and power MOSFET transistor are connected to a leadframe using metal clip bonding.
21. The system as described in claim 20 wherein said metal is copper.