IP Library Granted Patent US 8,378,772
Granted Patent B2
US 8,378,772 · App. 13/198,274 · Granted Feb 19, 2013

Inductor with thermally stable resistance

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Quick Facts
Patent No.
US 8,378,772
App. No.
13/198,274
Granted
Feb 19, 2013
Kind
B2
Abstract

An inductor includes an inductor body having a top surface and a first and second opposite end surfaces. There is a void through the inductor body between the first and second opposite end surfaces. A thermally stable resistive element positioned through the void and turned toward the top surface to forms surface mount terminals which can be used for Kelvin type sensing. Where the inductor body is formed of a ferrite, the inductor body includes a slot. The resistive element may be formed of a punched resistive strip and provide for a partial turn or multiple turns. The inductor may be formed of a distributed gap magnetic material formed around the resistive element. A method for manufacturing the inductor includes positioning an inductor body around a thermally stable resistive element such that terminals of the thermally stable resistive element extend from the inductor body.

Claims (38)

1. An inductor, comprising:

an inductor body having a top surface and a first and second opposite end surfaces;

a slot in the top surface of the inductor body;

a void through the inductor body between the first and second opposite end surfaces;

a thermally stable resistive element formed from a thermally stable alloy positioned through the void, at least portions of the thermally stable resistive element turned toward the slot in the top surface to form opposite surface mount terminals.

2. The inductor of claim 1 wherein the resistive element comprises nickel-chrome.

3. The inductor of claim 1 wherein the resistive element comprises manganese-copper.

4. An inductor, comprising:

an inductor body having a top surface and a first and second opposite end surfaces, a slot in the top surface of the inductor body;

a void through the inductor body between the first and second opposite end surfaces;

a thermally stable resistive element positioned through the void and turned toward the slot in the top surface of the inductor body to form opposite surface mount terminals.

5. The inductor of claim 4 wherein the opposite surface mount terminals include a larger terminal on each end for current and a smaller terminal on each end for current sensing.

6. The inductor of claim 4 wherein the opposite surface mount terminals being configured for Kelvin type measurements.

7. The inductor of claim 4 wherein the thermally stable resistive element comprises a non-ferrous metallic alloy comprising nickel and copper.

8. The inductor of claim 4 wherein the thermally stable resistive element comprises iron, chromium, and aluminum.

9. The inductor of claim 4 wherein the thermally stable resistive element is formed from a punched strip.

10. The inductor of claim 4 wherein the thermally stable resistive element is formed using an etching process.

11. The inductor of claim 4 wherein the thermally stable resistive element is formed using a machining process.

12. The inductor of claim 4 wherein the thermally stable resistive element comprises multiple turns.

13. The inductor of claim 4 wherein the thermally stable resistive element comprises a resistive material operatively connected to the conductive material with the surface mount terminals being formed of the conductive material.

14. The inductor of claim 13 wherein the conductive material is copper.

15. The inductor of claim 4 wherein the thermally stable resistive element having a low ohmic value of 0.2 milli-Ohms to 1 milli-Ohms.

16. The inductor of claim 4 wherein the thermally stable resistive element having a low temperature coefficient of resistance (TCR) of less than or equal to 100 parts per million per degree Celsius for the range of −55 to 125 degrees Celsius.

17. The inductor of claim 4 wherein the inductor has an inductance within the range of 50 nano-Henrys to 10 micro-Henrys.

18. The inductor of claim 4 wherein the resistive element is a nickel-chrome punched strip.

19. The inductor of claim 4 wherein the resistive element is a manganese-copper punched strip.

20. An inductor comprising:

a thermally stable resistive element;

an inductor body having a top surface and a first and second opposite end surfaces, a slot formed in the top surface of the inductor body, a void formed through the inductor body extending from the first end to the second end;

the inductor body comprising a distributed gap magnetic material;

wherein the thermally stable resistive element is positioned through the void, and at least portions of the thermally stable resistive element are turned toward the slot in the top surface to form opposite surface mount terminals.

21. The inductor of claim 20 wherein the thermally stable resistive element being formed of a non-ferrous metallic alloy.

22. The inductor of claim 20 wherein the thermally stable resistive element comprises a non-ferrous metallic alloy comprising nickel and copper.

23. The inductor of claim 20 wherein the thermally stable resistive element comprises iron, chromium, and aluminum.

24. The inductor of claim 1 , wherein the inductor body is formed from ferrite to thereby form a ferrite core.

25. The inductor of claim 1 , wherein the inductor body is formed from a distributed gap magnetic material.

26. The inductor of claim 4 , wherein the inductor body is formed from ferrite to thereby form a ferrite core.

27. The inductor of claim 4 , wherein the inductor body is formed from a distributed gap magnetic material.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
CHANGE OF NAME Recorded Nov 18, 2015
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037146/0050 →
SECURITY AGREEMENT Recorded Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2012
From: HANSEN, THOMAS T.; HOFFMAN, JEROME J.; SHAFER, TIMOTHY; SCHADE, NICHOLAS J.; LANGE, DAVID; SMITH, CLARK; BRUNE, ROB
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 029021/0264 →