Folding thermal ground plane

1. A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first active region comprising a portion of the first casing surrounded by the first bonding region;

a first folding region having a first out-of-plane wavy structure, the valleys and peaks of the out-of-plane wavy structure extend across a width of the first active region substantially parallel with a width of the thermal ground plane, the first folding region overlapping portions of the first bonding region and the first active region; and

a first non-folding region overlapping portions of the first bonding region and the first active region;

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second active region comprising a portion of the second casing surrounded by the second bonding region;

a second folding region overlapping portions of the second bonding region and the second active region; and

a second non-folding overlapping portions of the second bonding region and the second active region;

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure; and

a mesh layer disposed on an interior surface of the second casing within the second active region, the mesh layer comprising a plurality of arteries formed within the mesh layer and extending substantially parallel with a length of the thermal ground plane, wherein the mesh layer is not bonded with the second casing within the second folding region.

2. The thermal ground plane according to claim 1 , wherein the second casing comprises an out-of-plane wavy structure wherein the valleys and peaks of the out-of-plane wavy structure of the second casing extend across a width of the second active region substantially parallel with a width of the thermal ground plane.

3. The thermal ground plane according to claim 1 , wherein the first bonding region overlapping with the first folding region does not include an out-of-plane wavy structure.

4. The thermal ground plane according to claim 1 , wherein the first bonding region overlapping with the first folding region includes an out-of-plane wavy structure.

5. The thermal ground plane according to claim 1 , wherein the second casing includes a wavy structure in either or both the folding region and the non-folding region.

6. The thermal ground plane according to claim 1 , wherein either or both the second non-folding region and the first non-folding region has a substantially planar shape.

7. The thermal ground plane according to claim 1 , wherein the vapor structure is disposed on an interior surface of the first casing in the first non-folding region, and the vapor structure is not disposed within the first folding region.

8. The thermal ground plane according to claim 1 , wherein each of the plurality of arteries extends substantially perpendicular relative to a folding line within the second folding region.

9. The thermal ground plane according to claim 1 , wherein the second non-folding region comprises an out-of-plane wavy structure.

10. The thermal ground plane according to claim 9 , wherein the out-of-plane wavy structure of the second non-folding region is substantially parallel with a length of the thermal ground plane.

11. The thermal ground plane according to claim 1 , wherein the mesh layer comprises at least one of the following selected from the group consisting of woven copper, woven stainless steel, non-woven copper, non-woven stainless steel, ceramic-coated polymer, and metal-coated polymer.

12. The thermal ground plane according to claim 1 , wherein the mesh layer comprises a metal foam.

13. The thermal ground plane according to claim 1 , wherein either or both the first casing and the second casing comprise a laminate of copper and polymer.

14. The thermal ground plane according to claim 1 , wherein the mesh layer comprises two layers of woven material bonded together.

15. The thermal ground plane according to claim 1 , wherein the mesh layer comprises a copper mesh or a stainless steel mesh.

16. The thermal ground plane according to claim 1 , wherein the mesh layer is bonded to portions of the second casing within the second non-folding region.

17. A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first active region comprising a portion of the first casing surrounded by the first bonding region;

a first folding region having a first out-of-plane wavy structure, the first folding region includes a portion of the first bonding region and a portion of the first active region; and

a first non-folding region that includes a portion of the first bonding region and a portion of the first active region;

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second active region comprising a portion of the second casing surrounded by the second bonding region;

a second folding region that includes a portion of the second bonding region and a portion of the second active region; and

a second non-folding region that includes a portion of the second bonding region and a portion of the second active region and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned;

a mesh layer disposed on the second casing within the second active region, the mesh layer comprising two mesh layers bonded together, and wherein the mesh layer is not bonded with the second casing within the second folding region; and

a vapor structure disposed between the mesh layer and the first layer.