Patent Assignment
Reel/Frame 072290/0572
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 8
Assignor
THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Executed: 2025-09-08
Assignee
KELVIN THERMAL TECHNOLOGIES, INC.
5429 ILLINI WAY, BOULDER, COLORADO, 80303
Covered Properties
(11)
Method and Device for Spreading Heat Fluxes in Thermal Ground Planes
Application:
62/419,272 →
Method and Device for Optimization of Vapor Transport in a Thermal Ground Plane Using Void Space in Mobile Systems
Application:
62/410,229 →
Method and Device for Optimization of Vapor Transport in a Thermal Ground Plane Using Void Space in Mobile Systems
Thermal Management Planes
Application:
62/503,080 →
Thermal Management Planes
Application:
17/529,248 →
Publication:
US 2022/0074673
Thermal Management Planes
Application:
18/666,811 →
Publication:
US 2024/0369306
Thermal Management Planes
Folding Thermal Ground Plane
Application:
63/041,208 →
Folding Thermal Ground Plane
Application:
18/004,059 →
Publication:
US 2023/0292466
Method and Device for Spreading High Heat Fluxes in Thermal Ground Planes
Folding Thermal Ground Plane
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 29, 2017
From: LEE, YUNG-CHENG; LEWIS, RYAN JOHN; YANG, RONGGUI
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 041774/0001 →
Assignment of Assignor's Interest
Mar 29, 2017
From: LEE, YUNG-CHENG; LEWIS, RYAN JOHN; YANG, RONGGUI
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 041776/0948 →
Corrective Assignment to Correct the Assignment Previously Recorded at Reel: 041776 Frame: 0948. Assignor(S) Hereby Confirms the Assignment .
Apr 5, 2017
From: LEWIS, RYAN JOHN
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 042398/0947 →
Corrective Assignment to Correct the Assignment Document Previously Recorded at Reel: 041774 Frame: 0001. Assignor(S) Hereby Confirms the Assignment.
Apr 5, 2017
From: LEWIS, RYAN JOHN
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 042196/0973 →
Assignment of Assignor's Interest
May 25, 2017
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 042508/0621 →
Assignment of Assignor's Interest
May 25, 2017
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 042508/0059 →
Assignment of Assignor's Interest
Jun 23, 2017
From: LEE, YUNG-CHENG; YANG, RONGGUI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 042793/0761 →
Assignment of Assignor's Interest
Dec 21, 2017
From: LEE, YUNG-CHENG; YANG, RONGGUI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 044455/0160 →
Assignment of Assignor's Interest
Dec 21, 2017
From: LEWIS, RYAN JOHN
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 044455/0158 →
Assignment of Assignor's Interest
Aug 3, 2018
From: LEWIS, RYAN JOHN
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 046545/0739 →
Assignment of Assignor's Interest
Aug 3, 2018
From: LEE, YUNG-CHENG; YANG, RONGGUI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 046545/0755 →
Assignment of Assignor's Interest
Nov 20, 2020
From: LEE, YUNG-CHENG; NEMATOLLAHISARVESTANI, ALI; WAGNER, KYLE; LEWIS, RYAN J.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 054425/0362 →
Assignment of Assignor's Interest
Nov 18, 2021
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 058145/0426 →
Assignment of Assignor's Interest
Nov 18, 2021
From: LEWIS, RYAN J.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 058145/0437 →
Assignment of Assignor's Interest
Sep 16, 2022
From: WAGNER, KYLE; LEWIS, RYAN J.; WEST, JASON W.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 061113/0741 →
Assignment of Assignor's Interest
Sep 16, 2022
From: LEE, YUNG-CHENG; NEMATOLLAHISARVESTANI, ALI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 061113/0752 →
Assignment of Assignor's Interest
Dec 7, 2022
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 062018/0589 →
Assignment of Assignor's Interest
Dec 7, 2022
From: LEWIS, RYAN J.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 062018/0593 →
Assignment of Assignor's Interest
Jan 3, 2023
From: LEE, YUNG-CHENG; NEMATOLLAHISARVESTANI, ALI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 062264/0935 →
Assignment of Assignor's Interest
Jan 3, 2023
From: LEWIS, RYAN J.; WEST, JASON W.; WAGNER, KYLE
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 062264/0919 →
Assignment of Assignor's Interest
Aug 21, 2024
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 068361/0721 →
Assignment of Assignor's Interest
Aug 21, 2024
From: LEWIS, RYAN J.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 068745/0385 →