Thermal management planes
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
1. A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape, and wherein the wick has sides capped with a cap so that a meniscus does not form and proceed underneath the cap;
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal between the top casing and the bottom casing.
2. The thermal management plane according to claim 1 , wherein the copper hermetic seal occurs at a temperature between 170° C. and 300° C.
3. The thermal management plane according to claim 1 , wherein the top casing comprises a non-copper layer encapsulated with a copper layer.
4. The thermal management plane according to claim 1 , wherein the top casing comprises a polymer encapsulated with a copper layer.
5. The thermal management plane according to claim 1 , wherein the wick comprises an artery with capped sides.
6. The thermal management plane according to claim 1 , wherein the cap comprises an impermeable wall.
7. The thermal management plane according to claim 1 , wherein the cap comprises a porous material.
8. The thermal management plane according to claim 7 , wherein the porous material comprises sintered micro/nano particles, inverse opal structures, zeolites, or porous anodized alumina.
9. The thermal management plane according to claim 1 , further comprising an isolated vacuum cavity disposed within the thermal management plane.
10. The thermal management plane according to claim 1 , wherein the thermal management plane has a thickness less than about 200 microns.
11. A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper, the top casing comprising a polymer encapsulated with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casing, wherein the wick has a non-tubular shape, and wherein the wick has sides capped with a cap so that a meniscus does not form and proceed underneath the cap and the wick includes a plurality of arteries formed within the wick by removing portions of the wick;
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal between the top casing and the bottom casing.
12. The thermal management plane according to claim 11 , further comprising an impenetrable wall disposed along sides of the arteries.
13. The thermal management plane according to claim 11 , further comprising a porous material disposed along sides of the arteries.
14. The thermal management plane according to claim 13 , wherein the porous material comprises sintered micro/nano particles, inverse opal structures, zeolites, or porous anodized alumina.
15. A thermal management plane comprising:
a top casing that is hermetically sealed and bondable with copper, the top casing comprising a polymer encapsulated with copper;
a bottom casing that is hermetically sealed and bondable with copper;
a wick disposed between the top casing and the bottom casing, wherein the wick has a non-tubular shape, and wherein the wick includes a plurality of arteries formed within the wick by removing portions of the wick;
an impermeable wall arranged along sides of the wick;
a working fluid disposed between the top casing and the bottom casing; and
a copper hermetic seal between the top casing and the bottom casing.
16. The thermal management plane according to claim 15 , further comprising a porous material disposed along sides of the arteries.
17. The thermal management plane according to claim 15 , wherein the porous material comprises sintered micro/nano particles, inverse opal structures, zeolites, or porous anodized alumina.