IP Library › Granted Patent US 12,480,716
Granted Patent B2
US 12,480,716 · App. 17/529,248 · Granted Nov 25, 2025

Thermal management planes

Inventors: Ryan J. Lewis (Boulder, CO); Ronggui Yang (Broomfield, CO); Yung-Cheng Lee (Boulder, CO)
Assignee: Kelvin Thermal Technologies, Inc.
F28D15/0283F28D15/0233F28D15/04H01L23/427H05K7/20336F28D15/0241F28F2265/00
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Quick Facts
Patent No.
US 12,480,716
App. No.
17/529,248
Granted
Nov 25, 2025
Kind
B2
Abstract

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Claims (34)

1 . A thermal ground plane comprising:

a top casing;

a bottom casing;

a seal between the top casing and the bottom casing;

a working fluid disposed within the thermal ground plane;

a wicking layer disposed between the top casing and the bottom casing;

a vapor core disposed within the thermal ground plane; and

a wall disposed on a side of the wicking layer and disposed between the top casing and the bottom casing.

2 . The thermal ground plane according to claim 1 , wherein the wall is impermeable.

3 . The thermal ground plane according to claim 1 , wherein the wall comprises a porous material.

4 . The thermal ground plane according to claim 1 , further comprising one or more arteries within the wicking layer.

5 . The thermal ground plane according to claim 1 , wherein the wicking layer comprises a plurality of pillars.

6 . The thermal ground plane according to claim 1 , wherein the wicking layer comprises a mesh.

7 . The thermal ground plane according to claim 1 , wherein the wicking layer is etched into the bottom layer.

8 . The thermal ground plane according to claim 1 , further comprising a plurality of support structures placed between the top casing and the bottom casing.

9 . The thermal ground plane according to claim 1 , further comprising an isolated vacuum cavity disposed within the thermal management plane.

10 . The thermal ground plane according to claim 1 , further comprising a plurality of spacers disposed between the top casing and the bottom casing and the plurality of spacers comprising a low-thermal conductivity material.

11 . The thermal ground plane according to claim 1 , wherein the top casing comprises a non-copper layer encapsulated with a copper layer.

12 . The thermal ground plane according to claim 1 , wherein the top casing comprises a polymer encapsulated with a copper layer.

13 . A thermal ground plane comprising:

a top casing comprising a polymer material;

a top encapsulation layer disposed on the top casing;

a bottom casing comprising a polymer material;

a bottom encapsulation layer disposed on the bottom casing;

a hermetical seal coupling the bottom casing with the top casing;

a wicking layer disposed between the bottom casing and the top casing; and

a wall disposed on a side of the wicking layer and disposed between the top casing and the bottom casing.

14 . The thermal ground plane according to claim 13 , wherein the hermetical seal comprises sintered nanoparticles along a perimeter of either or both the top casing and the bottom casing.

15 . The thermal ground plane according to claim 13 , wherein the top encapsulation and/or the bottom encapsulation comprises copper.

16 . The thermal ground plane according to claim 13 , wherein the wicking layer comprises a plurality of pillars where the pillars include a cap.

17 . The thermal ground plane according to claim 13 , wherein the wicking layer comprises a pre-patterned array of caps and/or a pre-patterned array of pillars.

18 . The thermal ground plane according to claim 13 , further comprising a plurality of arteries.

19 . The thermal ground plane according to claim 13 , further comprising a gas reservoir to collect non-condensable gases.

20 . The thermal ground plane according to claim 13 , further comprising a vapor core disposed within the thermal ground plane.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2025
From: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 072290/0572 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2021
From: YANG, RONGGUI; LEE, YUNG-CHENG
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 058145/0426 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2021
From: LEWIS, RYAN J.
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 058145/0437 →
Continuity (3)
Continuation 15974306 · May 8, 2018
Provisional Application 62503080 · May 8, 2017
Related Publication 20220074673A1 · Mar 10, 2022
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