IP Library › Granted Patent US 12,656,066
Granted Patent B2
US 12,656,066 · App. 18/772,555 · Granted Jun 16, 2026

Stepped mesh-stacked powder-filling structure and vapor chamber using same

Inventors: Wen-Shiang Chen (Taoyuan City, TW); Yuan-Chia Chung (Taoyuan City, TW)
Assignee: Delta Electronics, Inc.
F28D15/046
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Quick Facts
Patent No.
US 12,656,066
App. No.
18/772,555
Granted
Jun 16, 2026
Kind
B2
Abstract

A stepped mesh-stacked powder-filling structure is disclosed and includes a cover plate, a first mesh plate, a second mesh plate and a wick structure. The first mesh plate is stacked on an inner surface of the cover plate along a first direction, and includes a first through opening. The second mesh plate is stacked on the first mesh plate along the first direction and includes a second through opening in communication with the inner surface through the first through opening. The second through opening is greater than the first through opening in view of the first direction, and a top surface of the first mesh plate not covered by the second mesh plate forms a first overlapping surface. The wick structure is disposed in the first and second through openings, and connected to the first mesh plate through the first overlapping surface.

Claims (24)

1 . A stepped mesh-stacked powder-filling structure, comprising:

a cover plate comprising an outer surface and an inner surface opposite to each other;

a first mesh plate stacked on the inner surface of the cover plate along a first direction, and comprising a first through opening, wherein the first through opening is in fluid communication with the inner surface;

a second mesh plate stacked on the first mesh plate along the first direction and comprising a second through opening, wherein the second through opening is in fluid communication with the inner surface through the first through opening, the second through opening is greater than the first through opening in view of the first direction, and a top surface of the first mesh plate corresponding to the second through opening forms a first overlapping surface that is not covered by the second mesh plate; and

a wick structure disposed in the first through opening and the second through opening, and at least in fluid communication with the first mesh plate through the first overlapping surface.

2 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first mesh plate and the wick structure are at least partially overlapped in view of the first direction.

3 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the outer surface of the cover plate is attached to a heat source, and the first through opening has an area not less than that of the heat source in view of the first direction.

4 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first mesh plate and the second mesh plate are stacked on the cover plate through a hot pressing process.

5 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first mesh plate has a bottom surface attached to the inner surface of the cover plate, and the second mesh plate has a bottom surface attached to a top surface of the first mesh plate, wherein the first mesh plate and the second mesh plate are configured to guide a working fluid to flow back to the wick structure along a second direction, and the second direction is perpendicular to the first direction.

6 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first overlapping surface is connected between a peripheral edge of the second through opening and a peripheral edge of the first through opening, and the first overlapping surface has an extending direction perpendicular to the first direction.

7 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first through opening and the second through opening are rectangular in view of the first direction, respectively, and the first overlapping surface is disposed adjacent to one side, two connected sides, and two opposite sides, or three connected sides of the first through opening.

8 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first through opening and the second through opening are circular in view of the first direction, respectively, and the first overlapping surface is disposed adjacent to an outer periphery of the first through opening.

9 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first through opening and the second through opening are rhombus in view of the first direction, respectively, and the first overlapping surface is disposed around an outer periphery of the first through opening.

10 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first through opening and the second through opening collaboratively form a stepped accommodation space, and the wick structure is accommodated in the stepped accommodation space.

11 . The stepped mesh-stacked powder-filling structure according to claim 10 , wherein the wick structure is a porous capillary structure formed by filling the stepped accommodation space with metal powder and then sintering the metal power.

12 . The stepped mesh-stacked powder-filling structure according to claim 11 , wherein the first mesh plate and the second mesh plate are a copper mesh, respectively, the metal powder is a copper powder, and the wick structure has a porosity smaller than that of the first mesh plate and the second mesh plate.

13 . The stepped mesh-stacked powder-filling structure according to claim 1 , wherein the first mesh plate is formed by stacking two layers of mesh plate structure.

14 . The stepped mesh-stacked powder-filling structure according to claim 1 , further comprising a third mesh plate, wherein the third mesh plate is stacked on the second mesh plate along the first direction, and comprises a third through opening, wherein the third through opening is in fluid communication with the inner surface through the second through opening and the first through opening, and spatially corresponding to the second through opening and the first through opening, wherein the third through opening is greater than the second through opening in view of the first direction, and a top surface of the second mesh plate corresponding to the third through opening forms a second overlapping surface that is not covered by the third mesh plate, wherein the wick structure is disposed in the first through opening, the second through opening and the third through opening, at least in fluid communication with the first mesh plate through the first overlapping surface, and at least in fluid communication with the second mesh plate through the second overlapping surface.

15 . A vapor camber, comprising:

an upper cover structure and a lower cover structure paired and assembled with each other to form the vaper chamber, wherein the upper cover structure or/and the lower cover structure comprises a stepped mesh-stacked powder-filling structure, and the stepped mesh-stacked powder-filling structure comprises:

a cover plate comprising an outer surface and an inner surface opposite to each other;

a first mesh plate stacked on the inner surface of the cover plate along a first direction, and comprising a first through opening, wherein the first through opening is in fluid communication with the inner surface;

a second mesh plate stacked on the first mesh plate along the first direction and comprising a second through opening, wherein the second through opening is in fluid communication with the inner surface through the first through opening, the second through opening is greater than the first through opening in view of the first direction, and a top surface of the first mesh plate corresponding to the second through opening forms a first overlapping surface that is not covered by the second mesh plate; and

a wick structure disposed in the first through opening and the second through opening, and at least in fluid communication with the first mesh plate through the first overlapping surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2024
From: CHEN, WEN-SHIANG; CHUNG, YUAN-CHIA
To: DELTA ELECTRONICS, INC.
Reel/Frame 067995/0047 →
Priority Claims (1)
CN 202421223152.3 · May 31, 2024 · national
Continuity (1)
Related Publication 20250369702A1 · Dec 4, 2025
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