IP Library › Granted Patent US 12,385,697
Granted Patent B2
US 12,385,697 · App. 18/180,122 · Granted Aug 12, 2025

Micropillar-enabled thermal ground plane

Inventors: Ryan John Lewis (Boulder, CO); Li-Anne Liew (Westminster, CO); Ching-Yi Lin (Longmont, CO); Collin Jennings Coolidge (Longmont, CO); Shanshan Xu (Boulder, CO); Ronggui Yang (Boulder, CO); Yung-Cheng Lee (Boulder, CO)
Assignee: Kelvin Thermal Technologies, Inc.
F28D15/046
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Quick Facts
Patent No.
US 12,385,697
App. No.
18/180,122
Granted
Aug 12, 2025
Kind
B2
Abstract

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Claims (38)

1. A thermal ground plane comprising:

a first substrate member comprising copper;

a second substrate member comprising a metal, wherein the first substrate member and the second substrate member are sealed together so as to be in direct contact and to enclose a working fluid;

a first plurality of pillars disposed on an interior surface of the first substrate;

a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper, wherein the mesh is entirely disposed in a cavity defined by the first substrate member and the second substrate member; and

a second plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer.

2. The thermal ground plane according to claim 1 , wherein the second plurality of pillars are not in contact with the first substrate member.

3. The thermal ground plane according to claim 1 , wherein the thermal ground plane has a thickness less than 300 microns.

4. The thermal ground plane according to claim 1 , wherein the mesh layer is bonded with the first plurality of pillars.

5. The thermal ground plane according to claim 1 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises the same material as the other mesh layers.

6. The thermal ground plane according to claim 1 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises a different material than the other mesh layers.

7. The thermal ground plane according to claim 1 , wherein a perimeter of the first substrate member and a perimeter of the second substrate member are hermetically sealed together.

8. The thermal ground plane according to claim 7 , wherein the hermetical seal is a thermocompression-bonded, an ultrasound-welded, an electrostatic welded, or a laser-welded copper-to-copper interface.

9. The thermal ground plane according to claim 1 , wherein the spacing between each pillar of the second plurality of pillars is larger than two times of the diameter of each pillar of the second plurality of pillars.

10. The thermal ground plane according to claim 1 , wherein the mesh layer may include a mesh selected from the list consisting of copper mesh, stainless steel mesh, metal mesh, polymer mesh and copper-encapsulated mesh.

11. A thermal ground plane comprising:

a first substrate member comprising at copper and either stainless steel or polymer;

a second substrate member comprising a metal, wherein a perimeter of the first substrate member and a perimeter of the second substrate member are hermetically sealed together so as to be in direct contact, wherein the first substrate member and the second substrate member enclose a working fluid;

a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper, wherein the mesh is entirely disposed in a cavity defined by the first substrate member and the second substrate member; and

a plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer and are not in contact with the first substrate member.

12. The thermal ground plane according to claim 11 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises the same material as the other mesh layers.

13. The thermal ground plane according to claim 11 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises a different material than the other mesh layers.

14. The thermal ground plane according to claim 11 , wherein the thermal ground plane has a thickness less than 300 microns.

15. The thermal ground plane according to claim 11 , wherein the mesh layer may include a mesh selected from the list consisting of copper mesh, stainless steel mesh, metal mesh, polymer mesh and copper-encapsulated mesh.

16. A thermal ground plane comprising:

a first substrate member comprising copper;

a second substrate member comprising a metal, wherein the first substrate member and the second substrate member are sealed together so as to be in direct contact and to enclose a working fluid;

a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper, wherein the mesh is entirely disposed in a cavity defined by the first substrate member and the second substrate member; and

a second plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer and are not in contact with the first substrate member.

17. The thermal ground plane according to claim 16 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises the same material as the other mesh layers.

18. The thermal ground plane according to claim 16 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises a different material than the other mesh layers.

19. A thermal ground plane comprising:

a first substrate member comprising copper;

a second substrate member comprising a metal, wherein the first substrate member and the second substrate member are sealed together so as to be in direct contact and to enclose a working fluid;

a mesh layer bonded with the first substrate member, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper, wherein the mesh is entirely disposed in a cavity defined by the first substrate member and the second substrate member; and

a second plurality of pillars disposed on an interior surface of the second substrate member within an area defined by the perimeter of the second substrate member and the second plurality of pillars extend from the second substrate member to the mesh layer.

20. The thermal ground plane according to claim 19 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises the same material as the other mesh layers.

21. The thermal ground plane according to claim 19 , wherein the mesh layer comprises at least two mesh layers and each mesh layer comprises a different material than the other mesh layers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2023
From: LIN, CHING-YI; COOLIDGE, COLLIN JENNINGS; LEE, YUNG-CHENG; LEWIS, RYAN JOHN; YANG, RONGGUI; LIEW, LI-ANNE; XU, SHANSHAN
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 063873/0053 →
Continuity (5)
Continuation In Part 15930016 · May 12, 2020
Continuation In Part 14857567 · Sep 17, 2015
Provisional Application 62069564 · Oct 28, 2014
Provisional Application 62051761 · Sep 17, 2014
Related Publication 20230332841A1 · Oct 19, 2023
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