Method for manufacturing LCP-based flexible copper-clad plate, and article thereof
Disclosed is a method for manufacturing an LCP-based flexible copper-clad laminate, comprising: providing an LCP substrate and subjecting the LCP substrate to a Hall ion source pre-treatment; forming an ion-implanted layer in a certain depth range below the surface of the LCP substrate via ion implantation; performing plasma deposition to form a plasma deposition layer onto the ion-implanted layer; performing magnetron sputtering deposition to deposit copper ions onto the plasma deposition layer and form a magnetron sputtering deposition layer; and plating the magnetron sputtering deposition layer with a thickened copper layer to obtain the LCP-based flexible copper-clad laminate. Also disclosed is an LCP-based flexible copper-clad laminate, wherein a peeling strength between a copper foil and the LCP substrate of the LCP-based flexible copper-clad laminate is greater than or equal to 0.5 N/mm, a surface roughness between the two is smaller than or equal to 0.3 μm, a thickness tolerance of double-sided copper foil is not more than 4.3 μm, and a thickness tolerance of single-sided copper foil is not more than 3.4 μm.
1. A method for manufacturing an LCP-based flexible copper-clad laminate, comprising:
providing an LCP substrate, and subjecting the LCP substrate to a Hall ion source pre-treatment, to clean a surface of the LCP substrate;
implanting first metal ions into the LCP substrate via ion implantation, to form an ion-implanted layer in a certain depth range below the surface of the LCP substrate;
performing plasma deposition on the LCP substrate subjected to the ion implantation, to deposit second metal ions onto the ion-implanted layer and form a plasma deposition layer;
performing magnetron sputtering deposition to deposit copper ions onto the plasma deposition layer and form a magnetron sputtering deposition layer; and
plating the magnetron sputtering deposition layer with a thickened copper layer to obtain the LCP-based flexible copper-clad laminate,
wherein a temperature of the LCP substrate is controlled to be always lower than 200° C. during the process of manufacturing the LCP-based flexible copper-clad laminate; and
wherein during the ion implantation, an ion implantation voltage is set to 10 kV to 20 kV, an ion implantation current is set to 1 mA to 4 mA, and an implantation time is set to 40 s to 3 min.
2. The method according to claim 1 , wherein a peeling strength between a copper foil and the LCP substrate of the LCP-based flexible copper-clad laminate is greater than or equal to 0.5 N/mm.
3. The method according to claim 1 , wherein a thickness tolerance of double-sided copper coil in the LCP-based flexible copper-clad laminate is not more than 4.3 μm, while a thickness tolerance of single-sided copper foil is not more than 3.4 μm.
4. The method according to claim 1 , wherein the Hall ion source pre-treatment comprises: increasing a temperature within a Hall source chamber to 40° C. to 120° C., by way of heating with a vacuum heating pipe.
5. The method according to claim 4 , wherein while the temperature within the Hall source chamber is increased to 40° to 70° C., a treatment voltage is set to 1500V to 2000V, a treatment current is set to 1.5 A to 2 A, and a treatment time is set to 20 min to 30 min.
6. The method according to claim 4 , wherein while the temperature within the Hall source chamber is increased to 70° C. to 100° C., a treatment voltage is set to 1000V to 1500V, a treatment current is set to 1 A to 1.5 A, and a treatment time is set to 10 min to 20 min.
7. The method according to claim 4 , wherein while the temperature within the Hall source chamber is increased to 100° C. to 120° C., a treatment voltage is set to 500V to 1000V, a treatment current is set to 0.04 A to 1 A, and a treatment time is set to 30 s to 10 min.
8. The method according to claim 1 , wherein the Hall ion source pre-treatment comprises: controlling a temperature of the LCP substrate at a range of 40° C. to 80° C., by controlling parameters of the Hall ion source.
9. The method according to claim 8 , wherein a treatment voltage is set to 1500V to 2000V, a treatment current is set to 1.5 A to 2 A, and a treatment time is set to 30 s to 20 min, and wherein the LCP substrate is controlled at a range of 40° C. to 80° C.
10. The method according to claim 8 , wherein a treatment voltage is set to 1000V to 1500V, a treatment current is set to 1 A to 1.5 A, and a treatment time is set to 10 s to 20 min, and wherein the LCP substrate is controlled at a range of 40° C. to 80° C.
11. The method according to claim 8 , wherein a treatment voltage is set to 500V to 1000V, a treatment current is set to 0.04 A to 1 A, and a treatment time is set to 20 s to 30 min, and wherein the LCP substrate is controlled at a range of 40° C. to 80° C.
12. The method according to claim 1 , wherein a working gas of the Hall ion source includes argon, nitrogen, hydrogen, oxygen, carbon dioxide, and a mixed gas composed of a combination thereof.
13. The method according to claim 1 , wherein during the plasma deposition, the plasma deposition is configured to adopt a deposition current of 45 A to 70 A, a deposition energy of 10 eV to 30 eV, and a deposition time of 40 s to 3 min.
14. The method according to claim 1 , wherein during the magnetron sputtering deposition, a deposition current is set to 2 A to 10 A, a deposition voltage is set to 200V to 500V, and a deposition time is set to 40 s to 3 min.
15. The method according to claim 1 , further comprising: performing high temperature annealing treatment on the LCP-based flexible copper-clad laminate at a temperature of 200° C. to 300° C. for 30 s to 10 minutes, such that a bending resistance property of the LCP-based flexible copper-clad laminate shows at least more than 400 times of bending.
16. The method according to claim 1 , wherein a bonding surface between a copper foil and the LCP substrate of the LCP-based flexible copper-clad laminate has a surface roughness of ≤0.3 μm.
17. An LCP-based flexible copper-clad laminate manufactured according to the method of claim 1 , the LCP-based flexible copper-clad laminate comprising:
an LCP substrate;
an ion-implanted layer implanted into the LCP substrate below a surface of the LCP substrate;
a plasma deposition layer deposited onto the ion-implanted layer;
a magnetron sputtering deposition layer deposited onto the plasma deposition layer; and
a thickened copper layer plated onto the magnetron sputtering deposition layer,
wherein a bonding surface between a copper foil and the LCP substrate of the LCP-based flexible copper-clad laminate can reach a surface roughness of ≤0.3 μm.
18. The LCP-based flexible copper-clad laminate according to claim 17 , wherein a peeling strength between the copper foil and the LCP substrate of the LCP-based flexible copper-clad laminate is greater than or equal to 0.5 N/mm.
19. The LCP-based flexible copper-clad laminate according to claim 17 , wherein a thickness tolerance of double-sided copper foil in the LCP-based flexible copper-clad laminate is not more than 4.3 μm, while a thickness tolerance of single-sided copper foil is not more than 3.4 μm.
20. The method according to claim 1 , wherein a working gas of the Hall ion source includes oxygen.
21. The method according to claim 1 , wherein the first metal ions are copper ions.
22. The method according to claim 1 , wherein the second metal ions are copper ions.