IP Library Granted Patent US 8,985,197
Granted Patent B2
US 8,985,197 · App. 13/226,473 · Granted Mar 24, 2015

Heat dissipation unit with mounting structure

Inventor: Jui-Pin Wang (New Taipei, TW)
Assignee: Asia Vital Components Co., Ltd.
F28F3/12H01L23/4006H01L23/427F28D15/0233F28F2280/00
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Quick Facts
Patent No.
US 8,985,197
App. No.
13/226,473
Granted
Mar 24, 2015
Kind
B2
Abstract

A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements.

Claims (11)

1. A heat dissipation unit with mounting structure, comprising:

a main body internally defining a chamber, and including a plurality of discreet support elements provided and sealed in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber; and

a plurality of mounting elements being externally connected to a first side of the main body at positions corresponding to the supports in the chamber and without penetrating the main body and the chamber, such that the plurality of mounting elements are separated from the supports by the first side; and each of the mounting elements internally defining an axial coupling bore, wherein the mounting elements respectively include a connection end and an opposite free end, and the mounting elements being fixedly connected at the connection ends to the first side of the main body corresponding to the supports in the chamber, wherein the main body is provided on the first side with at least one raised heat absorption zone, and the mounting elements being located in the vicinity of the raised heat absorption zone, and wherein the main body is correspondingly connected to a circuit board via the mounting elements with the heat absorption zone correspondingly contacting with at least one heat-generating element on the circuit board.

2. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the main body is connected to the circuit board with the free ends of the mounting elements in contact with one side of the circuit board facing toward the main body, allowing a plurality of fastening elements to be correspondingly extended through a plurality of mounting holes formed on the circuit board into the coupling bores of the mounting elements via the free ends thereof.

3. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the main body is connected at an opposite second side to a heat sink, and the heat sink including a plurality of radiating fins.

4. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the main body is selected from the group consisting of a vapor chamber and a hot plate.

5. The heat dissipation unit with mounting structure as claimed in claim 2 , wherein the coupling bores are respectively provided with internal screw threads and the fastening elements are respectively provided with external screw threads meshing with the internal screw threads of the coupling bores.

6. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the mounting elements are made of a metal material.

7. The heat dissipation unit with mounting structure as claimed in claim 6 , wherein the metal material for forming the mounting elements is selected from the group consisting of copper, aluminum, gold, iron, aluminum alloys, and any other metal alloys.

8. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the mounting elements are connected to the first side of the main body in a manner selected from the group consisting of welding, machining and corona discharging.

9. The heat dissipation unit with mounting structure as claimed in claim 1 , wherein the main body is formed from a first plate and a second plate that are closed to each other to together define the chamber therebetween.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2011
From: WANG, JUI-PIN
To: ASIA VITAL COMPONENTS CO., LTD.
Reel/Frame 026862/0462 →
Priority Claims (1)
TW 100129398 · Aug 17, 2011 · national
Continuity (1)
Related Publication 20130043000A1 · Feb 21, 2013