Vapor chamber and method for manufacturing the same
The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.
1. A vapor chamber used in an electronic device, the electronic device including a metal casing, the vapor chamber comprising:
an upper cover disposed on inner walls of the metal casing of the electronic device to define a containing space;
a working fluid filled into the containing space;
a waterproof layer formed on inner walls of the containing space;
a wick structure layer formed on the waterproof layer; and
an electrical-insulating heat-conducting ceramic layer formed between the waterproof layer and the inner walls of the containing space;
wherein the electrical-insulating heat-conducting ceramic layer, the waterproof layer and the wick structure layer are sequentially formed on the inner walls of the metal casing via thermal spray molding to avoid reactions of the working fluid, the electrical-insulating heat-conducting ceramic layer, the waterproof layer, and the wick structure layer as well as to avoid an electrochemistry corrosion caused by standard potential differences of the electrical-insulating heat-conducting ceramic layer, the waterproof layer and the wick structure layer,
wherein porosity of the electrical-insulating heat-conducting ceramic layer is less than or equal to 10%, porosity of the waterproof layer is less than or equal to 2%, and porosity of the wick structure layer is between 30% and 70%.
2. The vapor chamber according to claim 1 , wherein the electrical-insulating heat-conducting ceramic layer is made of a material selected from a group consisting of aluminum nitride, alumina, silicon nitride, and boron nitride.
3. The vapor chamber according to claim 1 , wherein the metal casing is made of a material selected from a group consisting of aluminum-magnesium alloy, aluminum alloy, magnesium alloy, aluminum, steel, and iron.
4. The vapor chamber according to claim 1 , wherein the upper cover is made of metal selected from a group consisting of aluminum-magnesium alloy, aluminum alloy, magnesium alloy, aluminum, steel, and iron.
5. The vapor chamber according to claim 1 , wherein the working fluid is water.
6. The vapor chamber according to claim 5 , wherein the waterproof layer and the wick structure layer are made of a material incapable of reacting with the water, and the material is selected from a group consisting of copper, brass, nickel, and titanium.
7. The vapor chamber according to claim 1 , wherein the wick structure layer is a powder porous wick structure layer.
8. The vapor chamber according to claim 1 , wherein the wick structure layer is thicker than the waterproof layer.
9. A method for manufacturing a vapor chamber comprising the following steps of:
forming an upper cover on inner walls of a metal casing of an electronic device to define a containing space;
forming a waterproof layer on inner walls of the containing space;
forming a wick structure layer on the waterproof layer;
filling a working fluid into the containing space; and
sealing the containing space,
wherein porosity of the electrical-insulating heat-conducting ceramic layer is less than or equal to 10%, porosity of the waterproof layer is less than or equal to 2%, and porosity of the wick structure layer is between 30% and 70%.
10. The method for manufacturing a vapor chamber according to claim 9 , further comprising the following step of:
forming an electrical-insulating heat-conducting ceramic layer between the waterproof layer and the inner walls of the containing space.
11. The method for manufacturing a vapor chamber according to claim 10 , wherein the step of forming the electrical-insulating heat-conducting ceramic layer between the waterproof layer and the inner walls of the containing space is completed via thermal spray molding.
12. The method for manufacturing a vapor chamber according to claim 10 , wherein the electrical-insulating heat-conducting ceramic layer is made of a material selected from a group consisting of aluminum nitride, alumina, silicon nitride, and boron nitride.
13. The method for manufacturing a vapor chamber according to claim 9 , wherein the step of forming the waterproof layer on the inner walls of the containing space and the step of forming the wick structure layer on the waterproof layer are completed via thermal spray molding.
14. The method for manufacturing a vapor chamber according to claim 9 , wherein the metal casing is made of a material selected from a group consisting of aluminum-magnesium alloy, aluminum alloy, magnesium alloy, aluminum, steel, and iron.
15. The method for manufacturing a vapor chamber according to claim 9 , wherein the upper cover is made of metal selected from a group consisting of aluminum-magnesium alloy, aluminum alloy, magnesium alloy, aluminum, steel, and iron.
16. The method for manufacturing a vapor chamber according to claim 9 , wherein the working fluid is water.
17. The method for manufacturing a vapor chamber according to claim 16 , wherein the waterproof layer and the wick structure layer are made of a material incapable of reacting with the water, and the material is selected from a group consisting of copper, brass, nickel, and titanium.
18. The method for manufacturing a vapor chamber according to claim 9 , wherein the wick structure layer is a powder porous wick structure layer.
19. The method for manufacturing a vapor chamber according to claim 9 , wherein the wick structure layer is thicker than the waterproof layer.