IP Library › Granted Patent US 12,464,679
Granted Patent B2
US 12,464,679 · App. 18/004,059 · Granted Nov 4, 2025

Folding thermal ground plane

Inventors: Ryan J. Lewis (Boulder, CO); Yung-Cheng Lee (Boulder, CO); Ali Nematollahisarvestani (Boulder, CO); Jason W. West (Broomfield, CO); Kyle Wagner (Minneapolis, MN)
Assignee: Kelvin Thermal Technologies, Inc.
H05K7/20336H05K7/2039H05K7/20309H05K7/20318
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Quick Facts
Patent No.
US 12,464,679
App. No.
18/004,059
Granted
Nov 4, 2025
Kind
B2
Abstract

Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.

Claims (79)

1 . A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first non-folding region overlapping portions of the first bonding region;

a first folding region overlapping portions of the first bonding region and portions of the first non-folding region; and

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second non-folding overlapping portions of the second bonding region;

a second folding region overlapping portions of the second bonding region and portions of the second non-folding region; and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure disposed on at least a portion of the interior surface of the first casing within the first non-folding region; and

a liquid structure comprising a mesh and a plurality of arteries, the plurality of arteries are formed within the mesh extending substantially parallel with a length of the thermal ground plane and extending substantially through the second folding region;

wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.

2 . The thermal ground plane according to claim 1 , wherein the mesh layer is not bonded with the second casing within the second folding region; and the mesh is bonded within the second casing within the second non-folding region.

3 . The thermal ground plane according to claim 1 , wherein the vapor structure comprises a plurality of pillars.

4 . The thermal ground plane according to claim 1 , wherein the first folding region comprises a first out-of-plane wavy structure; and the second folding region comprises a second out-of-plane wavy structure.

5 . The thermal ground plane according to claim 1 , wherein either or both the second non-folding region and the first non-folding region has a substantially planar shape.

6 . The thermal ground plane according to claim 1 , wherein the vapor structure is disposed on an interior surface of the first casing in the first non-folding region, and the vapor structure is not disposed within the first folding region.

7 . The thermal ground plane according to claim 1 , wherein each of the plurality of arteries extends substantially perpendicular relative to a folding line within the second folding region.

8 . The thermal ground plane according to claim 1 , wherein the mesh comprises at least one of the following selected from the group consisting of woven copper, woven stainless steel, non-woven copper, non-woven stainless steel, ceramic-coated polymer, and metal-coated polymer.

9 . The thermal ground plane according to claim 1 , wherein either or both the first casing and the second casing comprise a laminate of copper and polymer.

10 . The thermal ground plane according to claim 1 , wherein the mesh comprises two layers of woven material bonded together.

11 . The thermal ground plane according to claim 1 , wherein the mesh comprises a copper mesh or a stainless steel mesh.

12 . A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first non-folding region overlapping portions of the first bonding region;

a first folding region overlapping portions of the first bonding region and portions of the first non-folding region; and

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second non-folding overlapping portions of the second bonding region;

a second folding region overlapping portions of the second bonding region and portions of the second non-folding region; and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure disposed on an interior surface of the first casing in the first non-folding region and the vapor structure is not disposed on an interior surface of the first casing within the first folding region; and

a liquid structure comprising a mesh and a plurality of arteries, the plurality of arteries are formed within the mesh extending substantially parallel with a length of the thermal ground plane and extending substantially through the second folding region;

wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.

13 . The thermal ground plane according to claim 12 , wherein the first folding region comprises a first out-of-plane wavy structure; and the second folding region comprises a second out-of-plane wavy structure.

14 . A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first non-folding region overlapping portions of the first bonding region;

a first folding region overlapping portions of the first bonding region and portions of the first non-folding region; and

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second non-folding overlapping portions of the second bonding region;

a second folding region overlapping portions of the second bonding region and portions of the second non-folding folding region; and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure disposed on at least a portion of the interior surface within the first non-folding region of the first casing; and

a liquid structure comprising a mesh and a plurality of arteries, the plurality of arteries are formed within the mesh extending substantially parallel with a length of the thermal ground plane and perpendicular relative to a folding line within the folding region, and extending substantially through the second folding region;

wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.

15 . The thermal ground plane according to claim 14 , wherein the vapor structure comprises a plurality of pillars.

16 . A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first non-folding region overlapping portions of the first bonding region;

a first folding region overlapping portions of the first bonding region and portions of the first non-folding; and

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second non-folding overlapping portions of the second bonding region;

a second folding region overlapping portions of the second bonding region and portions of the second non-folding region; and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure comprising a plurality of pillars disposed on at least a portion of the interior surface of the first non-folding region of the first casing; and

a liquid structure comprising a mesh and a plurality of arteries formed within the mesh;

wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.

17 . The thermal ground plane according to claim 14 , wherein the plurality of arteries extend substantially parallel with a length of the thermal ground plane and/or extend substantially through the second folding region, and/or extend perpendicular relative to a folding line within the folding region.

18 . A thermal ground plane comprising:

a first casing comprising:

a first bonding region extending around a periphery of the first casing;

a first non-folding region overlapping portions of the first bonding region;

a first folding region overlapping portions of the first bonding region and portions of the first non-folding region; and

a second casing comprising:

a second bonding region extending around a periphery of the second casing;

a second non-folding overlapping portions of the second bonding region;

a second folding region overlapping portions of the second bonding region and portions of the second non-folding region; and

wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and

a vapor structure disposed on at least a portion of the interior surface of the first casing; and

a liquid structure comprising a mesh and a plurality of arteries, the mesh comprises two layers of woven material sealed together;

wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.

19 . The thermal ground plane according to claim 14 , wherein the plurality of arteries extend substantially parallel with a length of the thermal ground plane and/or extend substantially through the second folding region.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2025
From: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 072290/0572 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2023
From: LEWIS, RYAN J.; WEST, JASON W.; WAGNER, KYLE
To: KELVIN THERMAL TECHNOLOGIES, INC.
Reel/Frame 062264/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2023
From: LEE, YUNG-CHENG; NEMATOLLAHISARVESTANI, ALI
To: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
Reel/Frame 062264/0935 →
Continuity (3)
Continuation 17352250 · Jun 18, 2021
Provisional Application 63041208 · Jun 19, 2020
Related Publication 20230292466A1 · Sep 14, 2023
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