Integrated electro-optical flexible circuit board

1. A method of fabricating an integrated electro-optical circuit board comprising:

providing a first flexible substrate having a top side and a bottom side;

fabricating at least one first optical circuit on said bottom side of said first flexible substrate and connecting said first optical circuit to said top surface through a first filled via;

fabricating a 45° micro-mirror between said first optical circuit and said first filled via;

fabricating at least one first metal trace on said top side of said first flexible substrate;

providing a second flexible substrate having a top side and a bottom side;

connecting said bottom side of said first flexible substrate to a top side of a second flexible substrate with an optical adhesive layer; and

fabricating at least one second metal trace on a bottom side of said second flexible substrate and connecting said at least one second metal trace to said at least one first metal trace by a second filled via through said second flexible substrate, said optical adhesive layer, and said first flexible substrate.

2. The method according to claim 1 wherein said first flexible substrate comprises glass or cyclic olefin polymer (COP) having a thickness of between about 12.5 and 100 μm.

3. The method according to claim 1 wherein said at least one first optical circuit is a waveguide comprising silicon, silicon dioxide, gallium arsenide, gallium phosphide, or a polymer having a thickness of between about 4 and 15 μm and a refractive index higher than a refractive index of said first flexible substrate.

4. The method according to claim 1 wherein said optical adhesive material comprises epoxies, polyurethanes, silicones elastomers, UV-cured acrylics, or Cyanoacrylates having a thickness of between about 25 to 50 μm and a refractive index identical to a refractive index of said first flexible substrate.

5. The method according to claim 1 wherein said first and second metal traces comprise copper having a thickness of between about 4 and 15 μm and an underlying seed layer of Ni—P having a thickness of between about 0.01 and 0.5 μm.

6. The method according to claim 1 further comprising at least one second optical circuit on said top surface of said second flexible substrate.

7. The method according to claim 1 where said second flexible substrate comprises flexible glass or cyclic olefin polymer (COP) having a thickness of between about 12.5 and 100 μm.

8. The method according to claim 1 further comprising:

mounting at least one electrical device onto said at least one first metal trace; and

mounting at least one optoelectronic device onto said at least one first optical circuit.

9. An integrated electro-optical circuit board comprising:

a first flexible substrate having a top side and a bottom side;

at least one first optical circuit on said bottom side of said first flexible substrate connected to said top surface through a first filled via;

at least one first metal trace on said top side of said first flexible substrate;

an optical adhesive layer connecting said bottom side of said first flexible substrate to a top side of a second flexible substrate;

at least one second metal trace on a top side of said second flexible substrate and at least one third metal trace on a bottom side of said second flexible substrate connected by a second filled via through said second flexible substrate to said at least one second metal trace; and

a third flexible substrate with a bonding film between said second flexible substrate and said third flexible substrate wherein fourth and fifth metal traces are formed on and through said third flexible substrate and sixth and seventh metal traces are formed on and through said second flexible substrate.

10. The device according to claim 9 wherein said first flexible substrate comprises glass or cyclic olefin polymer (COP) having a thickness of between about 12.5 and 100 μm.

11. The device according to claim 9 wherein said at least one first optical circuit is a waveguide comprising silicon, silicon dioxide, gallium arsenide, gallium phosphide, or a polymer having a thickness of between about 4 and 15 μm and a refractive index higher than a refractive index of said first flexible substrate.

12. The device according to claim 9 further comprising a 45° micro-mirror between said first optical circuit and said filled via.

13. The device according to claim 9 wherein said optical adhesive material comprises epoxies, polyurethanes, silicones elastomers, UV-cured acrylics, or Cyanoacrylates having a thickness of between about 25 to 50 μm and a refractive index identical to a refractive index of said first flexible substrate.

14. The device according to claim 9 wherein said first, second, and third metal traces comprise copper having a thickness of between about 4 and 15 μm and an underlying seed layer of Ni—P having a thickness of between about 0.01 and 0.5 μm.

15. The device according to claim 9 wherein said second and third flexible substrates comprise polyimide (PI), modified polyimide (MPI), liquid crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon, or modified Teflon having a thickness of between about 12.5 and 100 μm.

16. An integrated electro-optical circuit board comprising:

a first flexible substrate having a top side and a bottom side;

at least one first optical circuit on said bottom side of said first flexible substrate connected to said top surface through a first filled via;

at least one first metal trace on said top side of said first flexible substrate;

an optical adhesive layer connecting said bottom side of said first flexible substrate to a top side of a first half of a folded second flexible substrate;

at least one second metal trace on a top side of said first half of said second flexible substrate and at least one third metal trace on a bottom side of first half of said second flexible substrate connected by a second filled via through said second flexible substrate to said at least one second metal trace;

a bonding film joining said top side of a second half of said second flexible substrate to a top side of said first flexible substrate; and

at least one third metal trace on a bottom side of said second half of said second flexible substrate connected by a third filled via to said at least one first metal trace.

17. The device according to claim 16 further comprising:

at least one electrical device mounted onto said at least one first metal trace; and

at least one optoelectronic device mounted onto said at least one first optical circuit.

18. The device according to claim 16 wherein said first flexible substrate comprises glass or cyclic olefin polymer (COP) having a thickness of between about 12.5 and 100 μm and wherein said second flexible substrate comprises polyimide (PI), modified polyimide (MPI), liquid crystal polymer (LCP), polyester (PET), polyethylene-naphtalate (PEN), poly tetra fluoro ethylene, or a laminate substrate such as epoxies and BT, or Teflon, or modified Teflon having a thickness of between about 12.5 and 100 μm.

19. The device according to claim 16 wherein said at least one first optical circuit is a waveguide comprising silicon, silicon dioxide, gallium arsenide, gallium phosphide, or a polymer having a thickness of between about 4 and 15 μm and a refractive index higher than a refractive index of said first flexible substrate.

20. The device according to claim 16 wherein said optical adhesive material comprises epoxies, polyurethanes, silicones elastomers, UV-cured acrylics, or Cyanoacrylates having a thickness of between about 25 to 50 μm and a refractive index identical to a refractive index of said first flexible substrate.