IP Library › Granted Patent US 12,109,869
Granted Patent B2
US 12,109,869 · App. 17/354,663 · Granted Oct 8, 2024

Temperature adjusting device

Inventor: Toru Okamura (Kariya, JP)
Assignee: DENSO CORPORATION
B60H1/32284B60H1/00878B60H1/3227B60H2001/00928B60H2001/00942
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,109,869
App. No.
17/354,663
Granted
Oct 8, 2024
Kind
B2
Abstract

A temperature adjusting device includes a heat radiation portion and a refrigeration cycle device. The heat radiation portion radiates heat of a target object to outside air. The refrigeration cycle device has a condenser and an evaporator. The condenser condenses a high-pressure refrigerant discharged from a compressor that compresses and discharges a refrigerant. The evaporator evaporates a low-pressure refrigerant pressure-reduced in a pressure reducing portion that reduces a pressure of the high-pressure refrigerant. The condenser radiates heat of the high-pressure refrigerant to at least part of the outside air that has passed through the heat radiation portion. The heat radiation portion radiates the heat of the target object to the outside air before heat of the outside air is absorbed in the condenser.

Claims (33)

1. A temperature adjusting device comprising:

an evaporation-side target-object heat exchanger in which a first heat medium flows to exchange heat with an evaporation-side target object;

a refrigeration cycle device that includes a condenser configured to condense a high-pressure refrigerant discharged from a compressor that compresses and discharges a refrigerant, and an evaporator configured to evaporate a low-pressure refrigerant pressure reduced in a pressure reducing portion that reduces a pressure of the high-pressure refrigerant;

a condensing-side heat exchanger that is thermally connected to the condenser and exchanges heat between a second heat medium and the high-pressure refrigerant;

a first heat exchanger configured to exchange heat between the first heat medium flowing out of the evaporation-side target-object heat exchanger and outside air;

a second heat exchanger configured to exchange heat between the second heat medium flowing out of the condensing-side heat exchanger and the outside air;

an evaporation-side heat exchanger thermally connected to the evaporator and exchanges heat between the first heat medium and the low-pressure refrigerant;

a first heat medium circuit that circulates the first heat medium;

a second heat medium circuit that circulates the second heat medium; and

a switching unit configured to switch circuit configurations of the first heat medium circuit, wherein

the first heat exchanger exchanges heat between the first heat medium flowing out of the evaporation-side target-object heat exchanger and the outside air;

the second heat exchanger exchanges heat between the second heat medium flowing out of the condensing-side heat exchanger and at least part of the outside air that has passed through the first heat exchanger,

the first heat medium circuit and the second heat medium circuit are configured as independent heat medium circuits in which the first heat medium is not mixed with the second heat medium, and

the switching unit is configured to switch a circuit configuration in which the first heat medium flowing out of the first heat exchanger flows into the evaporation-side target-object heat exchanger and a circuit configuration in which the first heat medium flowing out of the first heat exchanger flows into the evaporation-side heat exchanger.

2. The temperature adjusting device according to claim 1 , further comprising:

a heater configured to heat a heating target fluid by using the high-pressure refrigerant as a heat source, wherein

the refrigeration cycle device is configured such that heat absorbed by the refrigerant from the first heat medium in the evaporator is radiated to the second heat medium in the condenser.

3. The temperature adjusting device according to claim 1 , further comprising:

a heater configured to heat a heating target fluid by using the high-pressure refrigerant as a heat source, wherein

the refrigeration cycle device is configured such that heat absorbed by the refrigerant from the second heat medium in the evaporator is radiated to the second heat medium in the condenser.

4. The temperature adjusting device according to claim 1 , further comprising:

an outside-air-side target-object heat exchanger in which the first heat medium flows to exchange heat with an outside-air-side target object.

5. The temperature adjusting device according to claim 1 , further comprising:

an outside-air-side target-object heat exchanger in which the second heat medium flows to exchange heat with an outside-air-side target object.

6. The temperature adjusting device according to claim 1 , wherein

the first heat exchanger and the second heat exchanger are thermally connected to each other to perform heat transfer between the first heat medium and the second heat medium.

7. The temperature adjusting device according to claim 1 , wherein

the refrigeration cycle device further includes a fluid-side evaporator configured to evaporate the refrigerant pressure reduced in a fluid-side pressure reducing portion that reduces a pressure of the high-pressure refrigerant, through heat exchange with a cooling target fluid, and

the evaporator and the fluid-side evaporator are connected in parallel to each other, with respect to a flow of the high-pressure refrigerant flowing out of the condenser.

8. The temperature adjusting device according to claim 7 , further comprising:

an evaporation-side heat exchanger that is thermally connected to the evaporator and exchanges heat between the first heat medium and the low-pressure refrigerant, wherein the cooling target fluid is ventilation air blown to a space to be air conditioned; and

an inside-outside air switch unit configured to adjust a ratio between inside air in the space to be air conditioned and outside air outside the space to be air conditioned, in the ventilation air flowing into the fluid-side evaporator, wherein

the inside-outside air switch unit increases a ratio of the outside air, when an operation mode in which the cooling target fluid is cooled in the fluid-side evaporator is switched to an operation mode in which the cooling target fluid is cooled in the fluid-side evaporator and the first heat medium cooled in the evaporation-side heat exchanger flows into the evaporation-side target-object heat exchanger.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2021
From: OKAMURA, TORU
To: DENSO CORPORATION
Reel/Frame 056623/0701 →
Priority Claims (1)
JP 2018-243390 · Dec 26, 2018 · national
Continuity (2)
Continuation PCTJP2019044814 · Nov 15, 2019
Related Publication 20210316597A1 · Oct 14, 2021