Semiconductor device including a single crystal contact

1. A semiconductor device comprising:

a substrate including an element separation film and an active region defined by the element separation film;

an insulating pattern on the substrate;

a bit line structure on the substrate;

a trench in the element separation film and the active region, the trench on at least one side of the bit line structure and including a first portion in the element separation film and a second portion in the active region, a bottom face of the first portion placed above a bottom face of the second portion;

a single crystal storage contact including a first contact portion filling the first portion of the trench and a second contact portion filing the second portion of the trench, without a void; and

an information storage element electrically connected to the single crystal storage contact,

wherein the bit line structure includes a first bit line structure on the active region and across the single crystal storage contact, and a second bit line structure on the insulating pattern,

wherein a top face of the second contact portion is in contact with a bottom face of the insulating pattern,

wherein the bit line structure includes at least one of conductive film, and

wherein the single crystal storage contact entirely fills a part of the trench, the part of the trench overlapping the at least one of conductive film of the bit line structure in a direction parallel to an upper face of the substrate.

2. The semiconductor device of claim 1 , wherein the single crystal storage contact has a crystal orientation identical to that of the active region.

3. The semiconductor device of claim 1 ,

wherein the element separation film includes a first element separation film and a second element separation film adjacent to each other,

the second bit line structure is on the second element separation film, and

the first portion of the trench is in the first element separation film, and the second portion of the trench is in the active region between the first element separation film and the second element separation film.

4. The semiconductor device of claim 3 , wherein side walls of the first element separation film define connecting side walls that connect the bottom face of the first portion of the trench with the bottom face of the second portion of the trench.

5. The semiconductor device of claim 3 , further comprising:

a bit line contact on the active region,

the first bit line structure being on the bit line contact and connected to the substrate through the bit line contact.

6. The semiconductor device of claim 3 , wherein

the insulating pattern on the second element separation film, and includes a first region which overlaps the second element separation film, and a second region which does not overlap the element separation film, and

the top face of the second contact portion is in contact with the bottom face of the second region of the insulating pattern.

7. The semiconductor device of claim 1 , further comprising:

a landing pad placed on the single crystal storage contact,

the information storage element being electrically connected to the landing pad.

8. The semiconductor device of claim 1 , further comprising:

a bit line contact on the active region,

the bit line structure being on the bit line contact, and

an upper face of the single crystal storage contact placed above an upper face of the bit line contact.

9. The semiconductor device of claim 1 , further comprising:

a bit line contact on the active region,

the bit line structure being on the bit line contact, and

the bottom face of the second portion of the trench being above a bottom face of the bit line contact.

10. A semiconductor device comprising:

a substrate;

a first element separation film and a second element separation film which are in the substrate and are adjacent to each other;

an insulating pattern on the substrate;

a bit line structure on the substrate;

a trench which includes a first portion in the first element separation film and a second portion in the substrate between the first element separation film and the second element separation film, a bottom face of the first portion above a bottom face of the second portion, connecting side walls for connecting the bottom face of the first portion with the bottom face of the second portion defined by the first element separation film; and

a storage contact including a first contact portion filling the first portion of the trench and a second contact portion filing the second portion of the trench without a void,

wherein the bit line structure includes a first bit line structure on an active region and across the storage contact, and a second bit line structure on the insulating pattern,

wherein a top face of the second contact portion is in contact with a bottom face of the insulating pattern,

wherein

the substrate and the storage contact include single crystal silicon,

wherein the bit line structure includes at least one of conductive film, and

wherein the storage contact entirely fills a part of the trench, the part of the trench overlapping the at least one of conductive film of the bit line structure in a direction parallel to an upper face of the substrate.

11. The semiconductor device of claim 10 , wherein at least a part of the side walls of the trench is defined by the second element separation film.

12. The semiconductor device of claim 10 , wherein an upper face of the first element separation film is below an upper face of the second element separation film.

13. The semiconductor device of claim 10 , wherein a crystal orientation of the substrate is the same as a crystal orientation of the storage contact.