IP Library Granted Patent US 11,985,259
Granted Patent B2
US 11,985,259 · App. 17/357,067 · Granted May 14, 2024

Unified multi-die physical unclonable function

Inventors: Jennifer E. Howard (Prosper, TX); Colby K. Hoffman (Fairview, TX); Edward Escandon (McKinney, TX); Albert D. Marzullo (Plano, TX); Ross MacKinnon (McKinney, TX); Maegen A. Forrer (Farmersville, TX)
Assignee: RAYTHEON COMPANY
H04L9/3278H04L9/0866H04L2209/12
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Quick Facts
Patent No.
US 11,985,259
App. No.
17/357,067
Granted
May 14, 2024
Kind
B2
Abstract

A multi-die device a first die containing a plurality of first die signal path elements configured to propagate a stimulus signal and a second die containing a plurality of second die signal path elements configured to propagate the stimulus signal. The multi-die device further includes an interposer configured to establish signal communication between the first die and the second die so as to deliver the stimulus signal from the plurality of first die signal path elements to the plurality of second die signal path elements to generate a propagation delay. The propagation delay is used to generate a single unified PUF response that is indicative of the authenticity of the multi-die device.

Claims (13)

1. A multi-die device comprising:

a first die including a plurality of first die signal path elements configured to propagate a plurality of stimulus signals including a first stimulus signal and a separate second stimulus signal different from the first stimulus signal;

a second die including a plurality of second die signal path elements configured to propagate the first and second stimulus signals; and

an interposer configured to establish signal communication between the first die and the second die so as to deliver the first and second stimulus signals from the plurality of first die signal path elements to the plurality of second die signal path elements to generate a propagation delay;

wherein the propagation delay is used to generate a single unified physical unclonable function (PUF) response that is indicative of the authenticity of the multi-die device.

2. The multi-die device of claim 1 , wherein the first die and the second die are of the same type of die.

3. The multi-die device of claim 2 , wherein the plurality of stimulus signals include a separate third stimulus signal that is different from the first and second stimulus signals, and

wherein the plurality of first die signal path elements are different from the plurality of second die signal path elements.

4. The multi-die device of claim 3 , wherein the single unified PUF response includes timing results generated according to the combination of the first die signal path elements and the second die path elements.

5. The multi-die device of claim 1 , wherein the first die signal path elements and the second die signal path elements include at least one of a signal trace, a logic gate, a switch, and a look-up tables (LUT).

6. The multi-die device of claim 1 , wherein:

the plurality of first die signal path elements are arranged in a first combination that establishes a first plurality of signal paths to propagate the plurality of stimulus signals; and

the plurality of second die signal path elements are arranged in a second combination different from the first combination, the second combination establishing a second plurality of signal paths different from the first plurality of signal paths to propagate the plurality of stimulus signals.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2021
From: HOWARD, JENNIFER E.; HOFFMAN, COLBY K.; ESCANDON, EDWARD; MARZULLO, ALBERT D.; MACKINNON, ROSS; FORRER, MAEGEN A.
To: RAYTHEON COMPANY
Reel/Frame 056657/0249 →
Continuity (1)
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