IP Library Granted Patent US 11,728,784
Granted Patent B2
US 11,728,784 · App. 17/362,727 · Granted Aug 15, 2023

Transversely-excited film bulk acoustic resonator matrix filters with split die sub-filters

Inventors: Andrew Guyette (San Mateo, CA); Neal Fenzi (Santa Barbara, CA); Greg Dyer (Santa Barbara, CA); Sean McHugh (Santa Barbara, CA)
Assignee: Murata Manufacturing Co., Ltd.
H03H9/205H03H3/02H03H9/02031H03H9/02157H03H9/02228H03H9/13H03H9/17H03H9/545H03H9/568
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Quick Facts
Patent No.
US 11,728,784
App. No.
17/362,727
Granted
Aug 15, 2023
Kind
B2
Abstract

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

Claims (67)

1. A radio frequency filter, comprising:

at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port, each of the first and second sub-filters comprising:

a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms, wherein

a thickness of the piezoelectric plate portion of the first sub-filter is different from a thickness of the piezoelectric plate portion of the second sub-filter, and

the substrate of the first sub-filter is different than the substrate of the second sub-filter.

2. The filter of claim 1 , wherein the piezoelectric plate of the first sub-filter is the same as the piezoelectric plate of the second sub-filter.

3. The filter of claim 1 , wherein the piezoelectric plate of the first sub-filter is different than the piezoelectric plate of the second sub-filter.

4. The filter of claim 1 , wherein:

the piezoelectric plate portions and the IDTs of the first and second sub-filter are configured such that radio frequency signals applied to the IDTs excite primary shear acoustic modes in the portions of the piezoelectric plate portions forming the plurality of diaphragms spanning the respective cavities in the different substrates; and

the thicknesses of the piezoelectric plate portions of the first and second sub-filters are selected to tune the primary shear acoustic modes in the portions of the piezoelectric plates.

5. The filter of claim 1 , further comprising:

a third sub-filter connected in parallel between the first port and the second port, the third sub-filter comprising:

a piezoelectric plate having front and back surfaces, the back surface attached to the substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms,

wherein a thickness of the piezoelectric plate portion of the third sub-filter is different from a thickness of the piezoelectric plate portion of the first and portion of the second sub-filters.

6. The filter of claim 5 , wherein the thickness of the piezoelectric plate portion of the first sub-filter is a thickness of between 720 nm and 740 nm extending between a front surface and a back surface of the piezoelectric plate portion of the first sub-filter; wherein the thickness of the piezoelectric plate portion of the second sub-filter is a thickness of between 752 nm and 772 nm extending between a front surface and a back surface of the piezoelectric plate portion of the second sub-filter; and wherein the thickness of the piezoelectric plate portion of the third sub-filter is a thickness of between 734 nm and 754 nm extending between a front surface and a back surface of the piezoelectric plate portion of the third sub-filter.

7. The filter of claim 5 , wherein each sub-filter further comprises:

three resonators connected in series between the first port and the second port; and

two coupling capacitors, each of which is connected between ground and a respective node between two of the resonators of the sub-filter.

8. The filter of claim 7 , further comprising:

a first low-edge resonator, from the plurality of resonators, connected between the first port and ground;

a second low-edge resonator, from the plurality of resonators, connected between the second port and ground;

wherein respective resonance frequencies of the first and second low-edge resonators are adjacent to a lower edge of a passband of the filter.

9. The filter of claim 8 , wherein:

two of the resonators of each sub-filter are symmetrical in response;

the low-edge resonators have the same response;

each of the coupling capacitors is a metal-insulator-metal capacitor; and

the sub-filters and the low-edge resonators form a matrix filter having a contiguous passband formed by passbands of the sub-filters; and a center frequency of a passband of each sub-filter is different from a center frequency of any other sub-filter.

10. The filter of claim 5 , wherein:

the thickness of the piezoelectric plate portion of the first sub-filter is thinner than the thickness of the piezoelectric plate portion of the second sub-filter; and

the thickness of the piezoelectric plate portion of the second sub-filter is thinner than the thickness of the piezoelectric plate portion of the third sub-filter.

11. A radio frequency filter, comprising:

a first sub-filter and a second sub-filter connected in parallel between a first port and a second port, the first sub-filters comprising:

a first piezoelectric plate having first front and back surfaces, the first back surface attached to a first substrate of a first die, first portions of the first piezoelectric plate forming a first plurality of diaphragms spanning first respective cavities in the first substrate; and

a first conductor pattern formed on the first front surface, the first conductor pattern including a first plurality of interdigital transducers (IDTs) of a first respective plurality of resonators, first interleaved fingers of each first IDT disposed on a first respective diaphragm of the first plurality of diaphragms;

the second sub-filters comprising:

a second piezoelectric plate having second front and back surfaces, the second back surface attached to a second substrate of a second die, second portions of the second piezoelectric plate forming a second plurality of diaphragms spanning second respective cavities in the second substrate; and

a second conductor pattern formed on the second front surface, the second conductor pattern including a second plurality of interdigital transducers (IDTs) of a second respective plurality of resonators, second interleaved fingers of each second IDT disposed on a second respective diaphragm of the second plurality of diaphragms; and

wherein a thickness of the first piezoelectric plate portions are thicker than a thickness of the second piezoelectric plate portions, and

wherein the first substrates is different than the second substrate.

12. The filter of claim 11 , wherein the first piezoelectric plate is the same as the second piezoelectric plate.

13. The filter of claim 11 , wherein the first piezoelectric plate is different than the second piezoelectric plate.

14. The filter of claim 11 , wherein:

the first and second portions and the first and second IDTs are configured such that radio frequency signals applied to the first and second IDTs excite primary shear acoustic modes in the first and second portions of the piezoelectric plate portions forming the plurality of diaphragms spanning the respective cavities in the different substrates; and

the thicknesses of the first and second portions are selected to tune the primary shear acoustic modes in the first and second portions.

15. The filter of claim 11 ,

wherein each sub-filter further comprises:

three resonators connected in series between the first port and the second port;

two coupling capacitors, each of which is connected between ground and a respective node between two of the resonators of the sub-filter;

and further comprising:

a first low-edge resonator, from the plurality of resonators, connected between the first port and ground;

a second low-edge resonator, from the plurality of resonators, connected between the second port and ground;

wherein respective resonance frequencies of the first and second low-edge resonators are adjacent to a lower edge of a passband of the filter.

16. A radio frequency filter, comprising:

a first sub-filter, a second and a third sub-filter connected in parallel between a first port and a second port, each of the first, second and third sub-filters comprising:

a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms, wherein

a thickness of the piezoelectric plate portion of the first sub-filter is different from a thickness of the piezoelectric plate portion of the second and third sub-filter,

a thickness of the piezoelectric plate portion of the second sub-filter is different from a thickness of the piezoelectric plate portion of the third sub-filter,

the substrate of the first sub-filter is different than the substrate of the second sub-filter and the third sub-filter, and

the substrate of the second sub-filter is different than the substrate of the third sub-filter.

17. The filter of claim 16 , wherein the piezoelectric plate of the first sub-filter is different than the piezoelectric plate of the second sub-filter and the third sub-filter, and wherein

the piezoelectric plate of the second sub-filter is different than the piezoelectric plate of the third sub-filter.

18. The filter of claim 16 , wherein:

the piezoelectric plate portions and the IDTs of the first, second and third sub-filter are configured such that radio frequency signals applied to the IDTs excite primary shear acoustic modes in the portions of the piezoelectric plate portions forming the plurality of diaphragms spanning the respective cavities in the different substrates; and

the thicknesses of the piezoelectric plate portions of the first, second and third sub-filters are selected to tune the primary shear acoustic modes in the portions of the piezoelectric plates.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2022
From: RESONANT INC.
To: MURATA MANUFACTURING CO., LTD
Reel/Frame 061966/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2021
From: GUYETTE, ANDREW; FENZI, NEAL; DYER, GREG; MCHUGH, SEAN
To: RESONANT INC.
Reel/Frame 056719/0799 →
Continuity (5)
Continuation In Part 17133849 · Dec 24, 2020
Continuation In Part 17121724 · Dec 14, 2020
Provisional Application 63127095 · Dec 17, 2020
Provisional Application 63087789 · Oct 5, 2020
Related Publication 20220109427A1 · Apr 7, 2022