Semiconductor device and method of manufacturing same
View Patent ↗A semiconductor device includes a semiconductor part; first and second electrodes, the semiconductor part being provided between the first and second electrodes; a control electrode selectively provided between the semiconductor part and the second electrode; and a contacting part electrically connecting the semiconductor part and the second electrode. The semiconductor part includes a first layer of a first conductivity type, a second layer of a second conductivity type provided between the first layer and the second electrode, a third layer of the first conductivity type selectively provided between the second layer and the second electrode, and a fourth layer of the second conductivity type selectively provided between the second layer and the second electrode. The contacting part includes a first semiconductor portion of the first conductivity type contacting the third layer, and a second semiconductor portion of the second conductivity type contacting the fourth layer.
1. A semiconductor device comprising:
a semiconductor part including a first semiconductor layer of a first conductivity type;
a first electrode provided on the semiconductor part;
a second electrode, the semiconductor part being provided between the first electrode and the second electrode;
a control electrode selectively provided between the semiconductor part and the second electrode, the control electrode being electrically isolated from the semiconductor part by a first insulating film, the control electrode being electrically isolated from the second electrode by a second insulating film; and
a contacting part electrically connecting the semiconductor part and the second electrode,
the semiconductor part further including a second semiconductor layer of a second conductivity type, a third semiconductor layer of the first conductivity type and a fourth semiconductor layer of the second conductivity type,
the second semiconductor layer being selectively provided between the first semiconductor layer and the second electrode,
the third semiconductor layer being selectively provided between the second semiconductor layer and the second electrode,
the fourth semiconductor layer being selectively provided between the second semiconductor layer and the second electrode, the fourth semiconductor layer including a second conductivity type impurity with a higher concentration than a concentration of a second conductivity type impurity in the second semiconductor layer,
the control electrode being provided to face the second semiconductor layer with the first insulating film interposed,
the contacting part including a first semiconductor portion of the first conductivity type and a second semiconductor portion of the second conductivity type, the first semiconductor portion contacting the third semiconductor layer and being electrically connected to the third semiconductor layer, the second semiconductor portion contacting the fourth semiconductor layer and being electrically connected to the fourth semiconductor layer.
2. The device according to claim 1 , wherein the contacting part and the semiconductor part include at least one element of platinum (Pt), ruthenium (Rh), palladium (Pd), osmium (Os), iridium (Ir), or gold (Au).
3. The device according to claim 1 , wherein
the contacting part pierces the second insulating film and extends in a direction from the second electrode toward the semiconductor part, and
the first semiconductor portion is positioned between the second insulating film and the second semiconductor portion.
4. The device according to claim 1 , wherein
the contacting part includes a silicide region positioned between the first semiconductor portion and the second electrode and between the second semiconductor portion and the second electrode, and
the silicide region contacts the second electrode, is electrically connected to the second electrode, and includes at least one element of platinum (Pt), ruthenium (Rh), palladium (Pd), osmium (Os), iridium (Ir), or gold (Au).
5. The device according to claim 1 , wherein
the semiconductor part further includes a fifth semiconductor layer of the first conductivity type,
the fifth semiconductor layer is selectively provided between the first semiconductor layer and the control electrode and includes a first conductivity-type impurity with a higher concentration than a concentration of a first conductivity-type impurity in the first semiconductor layer, and
the second semiconductor layer includes a portion positioned between the third semiconductor layer and the fifth semiconductor layer.
6. A semiconductor device comprising:
a semiconductor part including a first semiconductor layer of a first conductivity type;
a first electrode provided on the semiconductor part;
a second electrode, the semiconductor part being provided between the first electrode and the second electrode;
a control electrode selectively provided between the semiconductor part and the second electrode, the control electrode being electrically isolated from the semiconductor part by a first insulating film, the control electrode being electrically isolated from the second electrode by a second insulating film; and
a contacting part electrically connecting the semiconductor part and the second electrode,
the semiconductor part further including a second semiconductor layer of a second conductivity type, a third semiconductor layer of the first conductivity type and a fourth semiconductor layer of the second conductivity type,
the second semiconductor layer being selectively provided between the first semiconductor layer and the second electrode,
the third semiconductor layer being selectively provided between the second semiconductor layer and the second electrode,
the fourth semiconductor layer being selectively provided between the second semiconductor layer and the second electrode, the fourth semiconductor layer including a second conductivity type impurity with a higher concentration than a concentration of a second conductivity type impurity in the second semiconductor layer,
the control electrode being provided to face the first semiconductor layer and the second semiconductor layer with the first insulating film interposed,
the contacting part including a semiconductor portion, the semiconductor portion contacting the third semiconductor layer and the fourth semiconductor layer, the contacting part being electrically connected to the third semiconductor layer and the fourth semiconductor layer,
the semiconductor portion and the semiconductor part including at least one element of platinum (Pt), ruthenium (Rh), palladium (Pd), osmium (Os), iridium (Ir), or gold (Au).
7. The device according to claim 6 , wherein the second semiconductor layer includes the at least one element.
8. The device according to claim 6 , wherein
the semiconductor part further includes a sixth semiconductor layer of the first conductivity type, and
the sixth semiconductor layer is provided between the first semiconductor layer and the first electrode, includes a first conductivity-type impurity with a higher concentration than a concentration of a first conductivity-type impurity in the first semiconductor layer, and includes the at least one element with a concentration equal to or lower than a concentration of the at least one element in the first semiconductor layer.
9. The device according to claim 6 , wherein the second insulating film includes the at least one element.
10. The device according to claim 6 , wherein
a plurality of the contacting parts is provided,
the plurality of contacting parts includes a first contacting part and a second contacting part,
the first contacting part includes a silicide region and the at least one element, and
the second contacting part includes the at least one element with a lower concentration than a concentration of the at least one element in the first contacting part.