Electronic component

1. An electronic component comprising:

a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other; and

external electrode layers on end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction; wherein

each of the external electrode layers is connected to the internal electrode layers;

the dielectric layers each include at least one of Ca, Zr, or Ti;

the internal electrode layers each include Cu;

the external electrode layers each include:

a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni; and

at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer; and

in a cross section extending in the lamination direction and the length direction, the dielectric particles in the sintered electrode layer have an area ratio M of about 35% M about 42% and are dispersed within the sintered electrode layer.

2. The electronic component according to claim 1 , further comprising an alloy layer including the Cu included in the internal electrode layers and the Ni included in the sintered electrode layer.

3. The electronic component according to claim 1 , wherein

a dimension of the multilayer body in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is about 0.2 mm to about 2.0 mm;

a dimension of the multilayer body in the lamination direction is about 0.25 mm to about 2.5 mm; and

a dimension of the multilayer body in the length direction is about 0.3 mm to about 3.0 mm.

4. The electronic component according to claim 1 , wherein the electronic component comprises a multilayer ceramic capacitor.

5. The electronic component according to claim 1 , wherein

the internal electrode layers include a plurality of first internal electrodes and a plurality of second internal electrodes alternately positioned in the lamination direction;

at least one of the plurality of first internal electrodes is connected to a first external electrode layer of the external electrode layers; and

at least one of the plurality of second internal electrodes is connected to a second external electrode layer of the external electrode layers.

6. The electronic component according to claim 1 , wherein a laminated number of the internal electrode layers is fifteen or more and 700 or less.

7. The electronic component according to claim 1 , wherein a thickness of each of the dielectric layers is about 0.40 μm or more and about 0.50 μm or less.

8. The electronic component according to claim 1 , wherein a thickness of each of the internal electrode layers is about 0.25 μm or more and about 0.33 μm or less.

9. The electronic component according to claim 1 , wherein side gap portions are provided on opposing surfaces of the multilayer body in a width direction orthogonal or substantially orthogonal to the lamination direction.

10. The electronic component according to claim 9 , wherein each of the side gap portions includes a ceramic material including at least one of Ca, Zr, and Ti.

11. The electronic component according to claim 9 , wherein each of the side gap portions includes a same material or substantially a same material as the dielectric layers.

12. The electronic component according to claim 9 , wherein each of the side gap portions includes a plurality of layers.

13. The electronic component according to claim 12 , wherein

the plurality of layers of each of the side gap portions include an inner layer and an outer layer; and

a thickness of the inner layer is less than a thickness of the outer layer.

14. The electronic component according to claim 13 , wherein each of the side gap portions has a thickness of about 5 μm or more and about 12 μm or less.

15. The electronic component according to claim 1 , wherein each of the dielectric layers includes a perovskite compound.