Planar antenna and wireless module
A planar antenna includes: a radiating element; a flexible dielectric film portion; a power feeder line provided for the dielectric film portion, and configured to feed power to the radiating element; a first ground conductor facing against the radiating element; and an antenna base having a dielectric layer disposed between the radiating element and the first ground conductor. The dielectric film portion extends from a side surface of the antenna base. The dielectric layer is thicker than the dielectric film portion.
1. A wireless module comprising:
a radiating element;
a flexible dielectric film portion;
a power feeder line provided for the dielectric film portion, and configured to feed power to the radiating element;
a first ground conductor facing against the radiating element;
an antenna base having a dielectric layer that is disposed between the radiating element and the first ground conductor, the dielectric layer having a laminated structure in which a plurality of films is continuously laminated, the dielectric film portion extending from a side surface of the antenna base toward an outside of the antenna base; and
a wireless unit to which the power feeder line is connected,
wherein the laminated structure includes a main layer provided with the dielectric film portion and one or more subsidiary layers laminated on a region of the main layer excluding the dielectric film portion.
2. The wireless module according to claim 1 , wherein
the main layer is seamless with the dielectric film portion.
3. The wireless module according to claim 1 , wherein
the one or more subsidiary layers include one or more first subsidiary layers and one or more second subsidiary layers, the first subsidiary layers being laminated on a side of a first surface of the main layer, the second subsidiary layers being laminated on a side of a second surface as a surface opposite of the first surface.
4. The wireless module according to claim 1 , wherein
one of the first ground conductor and the radiating element is provided for the main layer.
5. The wireless module according to claim 1 , wherein
the first ground conductor is provided for the main layer, and connected to a second ground conductor for power feeding, the second ground conductor being provided for the dielectric film portion seamless with the main layer.
6. The wireless module according to claim 1 , wherein
the radiating element is provided for the main layer, and connected to the power feeder line provided for the dielectric film portion seamless with the main layer.
7. A wireless module comprising:
a plurality of planar antennas;
a base substrate to which the plurality of planar antennas is connected; and
a wireless unit provided in the base substrate, and configured to process wireless signals,
wherein, each planar antenna includes:
a radiating element;
a flexible dielectric film portion connected to the base substrate;
a power feeder line provided in the dielectric film portion at least in part, and configured to connect the radiating element and the wireless unit to each other;
a first ground conductor opposites to the radiating element; and
an antenna base having a dielectric layer disposed between the radiating element and the first ground conductor, and
the dielectric film portion extends from a side surface of the antenna base and flexibly connects the base substrate and the antenna base to each other.
8. The wireless module according to claim 7 , wherein
the dielectric layer has a laminated structure in which a plurality of films is continuously laminated, and
the laminated structure includes a main layer provided with the dielectric film portion and one or more subsidiary layers laminated on a region of the main layer excluding the dielectric film portion.