Apparatus to control transfer parameters during transfer of semiconductor devices

1. An apparatus comprising:

a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate, the transfer mechanism including:

one or more transfer wires,

a needle actuator disposed adjacent a first side of the wafer tape and configured to move the one or more transfer wires toward and away from the transfer location,

a vacuum unit disposed adjacent the first side of the wafer tape, the vacuum unit being configured to engage during at least a portion of the transfer of the electrically-actuatable element,

a first frame configured to hold the wafer tape, and

a second frame configured to secure the product substrate such that the circuit trace is disposed facing the electrically-actuatable element disposed on the first side of the wafer tape, and such that at least one transfer wire of the one or more transfer wires is disposed adjacent a second side of the wafer tape opposite the first side, a length of the at least one transfer wire extending in a direction toward the wafer tape,

wherein the vacuum unit is disposed adjacent the second side of the wafer tape surrounding the one or more transfer wires, the vacuum unit being configured to engage during at least a portion of the direct transfer of the electrically-actuatable element, and

wherein the needle actuator is configured to actuate the at least one transfer wire into a die transfer position at which the at least one transfer wire presses on the second side of the wafer tape to press the electrically-actuatable element into contact with the circuit trace of the product substrate.

2. The apparatus according to claim 1 , further comprising two or more stabilizers disposed adjacent the second side of the wafer tape, a length of the two or more stabilizers extending in a direction toward the wafer tape.

3. The apparatus according to claim 2 , wherein the needle actuator is further configured to actuate the two or more stabilizers into the die transfer position along with the at least one transfer wire.

4. The apparatus according to claim 1 , wherein the vacuum unit is engaged based at least in part on a size of the electrically-actuatable element.

5. The apparatus according to claim 1 , wherein the vacuum unit is engaged until the wafer tape ceases to oscillate after the electrically-actuatable element is released.

6. The apparatus according to claim 1 , further comprising two or more stabilizers, at least one of the two or more stabilizers disposed on each side of the one or more transfer wires.

7. The apparatus according to claim 6 , wherein the needle actuator is configured to actuate the one or more transfer wires and the two or more stabilizers independently and simultaneously in a first direction, the first direction being toward the transfer location.

8. The apparatus according to claim 7 , wherein the needle actuator is configured to actuate the one or more transfer wires and the two or more stabilizers sequentially in the first direction and a second direction, the second direction being away from the transfer location.

9. The apparatus according to claim 6 , wherein the needle actuator is configured to actuate the two or more stabilizers to hold the electrically-actuatable element in a substantially fixed position.

10. The apparatus according to claim 6 , wherein the needle actuator includes:

an electromechanical actuator, and

one or more return springs.

11. The apparatus according to claim 6 , wherein the transfer wires are sized to accommodate transferring a micro-sized LED as the electrically-actuatable element, and

wherein a height of the micro-sized LED ranges between 12.5 microns and 200 microns, between 25 microns and 100 microns, or between 50 microns to 80 microns.

12. The apparatus according to claim 6 , wherein the vacuum unit is engaged based at least in part on a size of the electrically-actuatable element.

13. The apparatus according to claim 6 , wherein the vacuum unit is engaged until the wafer tape ceases to oscillate after the electrically-actuatable element is released.