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Patent Application
App. No. 17/379,888

MEMS Assembly Process Flow

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Patent No.
US None
App. No.
17/379,888
Abstract

A method of producing a MEMS assembly includes: producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.

Claims (75)

1 . A method of producing a MEMS assembly comprising:

producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and

coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly.

2 . The method of producing a MEMS assembly of claim 1 wherein producing an OIS/IS subassembly includes:

dispensing an epoxy onto the optical image stabilizer;

picking and placing the image sensor onto the optical image stabilizer;

performing a thermal curing operation;

wire bonding the optical image stabilizer and the image sensor; and

inspecting the wire bonding.

3 . The method of producing a MEMS assembly of claim 1 wherein coupling the OIS/IS subassembly to an AF subassembly includes:

dispensing an epoxy onto the AF subassembly; and

picking and placing the OIS/IS subassembly onto the AF subassembly.

4 . The method of producing a MEMS assembly of claim 1 further comprising:

structurally reinforcing a plurality of binding wires between the optical image stabilizer and the image sensor.

5 . The method of producing a MEMS assembly of claim 4 wherein structurally reinforcing a plurality of binding wires between the optical image stabilizer and the image sensor includes:

dispensing an epoxy on the plurality of binding wires between the optical image stabilizer and the image sensor.

6 . The method of producing a MEMS assembly of claim 1 further comprising:

structurally reinforcing one or more sponge areas on the OIS/IS subassembly.

7 . The method of producing a MEMS assembly of claim 6 wherein structurally reinforcing one or more sponge areas on the OIS/IS subassembly includes:

dispensing an epoxy on the one or more sponge areas on the OIS/IS subassembly.

8 . The method of producing a MEMS assembly of claim 1 further comprising:

coupling the OIS/IS/AF assembly to a printed circuit board to form a OIS/IS/AF PCB assembly.

9 . The method of producing a MEMS assembly of claim 8 wherein coupling the OIS/IS/AF assembly to a printed circuit board includes:

structurally coupling the OIS/IS/AF assembly to the printed circuit board; and

electrically coupling the OIS/IS/AF assembly to the printed circuit board.

10 . The method of producing a MEMS assembly of claim 9 wherein structurally coupling the OIS/IS/AF assembly to a printed circuit board includes:

dispensing an epoxy onto the printed circuit board; and

picking and placing the OIS/IS/AF assembly onto the printed circuit board.

11 . The method of producing a MEMS assembly of claim 9 wherein electrically coupling the OIS/IS/AF assembly to a printed circuit board includes:

wire bonding the OIS/IS/AF assembly and the printed circuit board; and

inspecting the wire bonding.

12 . The method of producing a MEMS assembly of claim 8 further comprising:

performing quality assurance operations on the OIS/IS/AF PCB assembly.

13 . The method of producing a MEMS assembly of claim 12 wherein performing quality assurance operations of the OIS/IS/AF PCB assembly includes one or more of:

measuring critical dimensions within the OIS/IS/AF PCB assembly; and

visually inspecting the OIS/IS/AF PCB assembly.

14 . The method of producing a MEMS assembly of claim 8 further comprising:

coupling a housing to the OIS/IS/AF PCB assembly to form the MEMS assembly.

15 . The method of producing a MEMS assembly of claim 14 wherein coupling a housing to the OIS/IS/AF PCB assembly to form the MEMS assembly includes:

dispensing an epoxy onto the OIS/IS/AF PCB assembly;

picking and placing the housing onto the OIS/IS/AF PCB assembly; and

performing a thermal curing operation.

16 . The method of producing a MEMS assembly of claim 14 further comprising:

performing quality assurance operations on the MEMS assembly.

17 . The method of producing a MEMS assembly of claim 14 wherein performing quality assurance operations of the MEMS assembly includes one or more of:

performing a function test on the OIS/IS subassembly; and

performing a function test on the AF subassembly.

18 . A method of producing a MEMS assembly comprising:

producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor and producing an OIS/IS subassembly includes:

dispensing an epoxy onto the optical image stabilizer,

picking and placing the image sensor onto the optical image stabilizer,

performing a thermal curing operation,

wire bonding the optical image stabilizer and the image sensor; and

inspecting the wire bonding; and

coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly, wherein coupling the OIS/IS subassembly to an AF subassembly includes:

dispensing an epoxy onto the AF subassembly, and

picking and placing the OIS/IS subassembly onto the AF subassembly

19 . The method of producing a MEMS assembly of claim 18 further comprising:

coupling the OIS/IS/AF assembly to a printed circuit board to form a OIS/IS/AF PCB assembly.

20 . The method of producing a MEMS assembly of claim 19 further comprising:

coupling a housing to the OIS/IS/AF PCB assembly to form the MEMS assembly.

21 . A method of producing a MEMS assembly comprising:

producing an OIS/IS subassembly, wherein the OIS/IS subassembly includes an optical image stabilizer and an image sensor; and

coupling the OIS/IS subassembly to an AF subassembly to form an OIS/IS/AF assembly;

coupling the OIS/IS/AF assembly to a printed circuit board to form a OIS/IS/AF PCB assembly; and

coupling a housing to the OIS/IS/AF PCB assembly to form the MEMS assembly.

22 . The method of producing a MEMS assembly of claim 21 wherein producing an OIS/IS subassembly includes:

dispensing an epoxy onto the optical image stabilizer;

picking and placing the image sensor onto the optical image stabilizer;

performing a thermal curing operation;

wire bonding the optical image stabilizer and the image sensor; and

inspecting the wire bonding.

23 . The method of producing a MEMS assembly of claim 21 wherein coupling the OIS/IS subassembly to an AF subassembly includes:

dispensing an epoxy onto the AF subassembly; and

picking and placing the OIS/IS subassembly onto the AF subassembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2022
From: NG, MATTHEW; LIU, XIAOLEI; WANG, GUIQIN
To: MEMS DRIVE (NANJING) CO., LTD.
Reel/Frame 060089/0111 →