Techniques for conductive particle based material used for at least one of propagation, emission and absorption of electromagnetic radiation
An antenna system and method for fabricating an antenna are provided. The antenna system includes a substrate and an antenna. The antenna includes a conductive particle based material applied onto the substrate. The conductive particle based material includes conductive particles and a binder. When the conductive particle based material is applied to the substrate, the conductive particles are dispersed in the binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.
1. An antenna system comprising:
a first element formed of a conductive material, the first element being electrically coupled to at least one of a receiver or a transmitter; and
a second element formed of a conductive particle based material, the second element being disposed adjacent to, and offset from, the first element,
wherein the second element is electrically isolated from the first element,
wherein the second element and the first element are at least one of inductively or capacitively coupled,
wherein at least one of an air gap or a non-conductive material is disposed between the at least one of the first element and the second element,
wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,
wherein the binder is disposed between at least a part of the conductive particles that are adjacent to, but do not touch, one another, and
wherein at least some of the conductive particles of the conductive particle based material that are adjacent to one another are at least one of capacitively or inductively coupled to one another.
2. The antenna system of claim 1 , wherein, when a Radio Frequency (RF) signal is input to the first element, a reverse power is lower than the reverse power of first element without the second element.
3. The antenna system of claim 1 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.
4. The antenna system of claim 1 , further comprising at least one of a protective and concealment coating applied to the second element.
5. The antenna system of claim 1 , wherein the second element is the same size, or smaller than, the first element.
6. The antenna system of claim 1 , wherein the first element is disposed in an electronic device and the second element is disposed in a case for the electronic device.
7. The antenna system of claim 1 , wherein the first element and the second element are disposed in an electronic device.
8. The antenna system of claim 1 , wherein the second element is applied directly onto at least a portion of a conductive substrate.
9. The antenna system of claim 1 , wherein the second element is completely electrically isolated.
10. The antenna system of claim 1 , wherein the second element is at a ground potential.
11. The antenna system of claim 10 , wherein the second element is a ground plane of the first element.
12. An antenna subassembly comprising:
a second element formed of a conductive particle based material, the second element being disposed adjacent to, and offset from, a first element formed of a conductive material, the first element being electrically coupled to at least one of a receiver or a transmitter,
wherein the second element is electrically isolated from the first element,
wherein the second element and the first element are at least one of inductively or capacitively coupled,
wherein at least one of an air gap or a non-conductive material is disposed between the first element and the second element,
wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,
wherein the binder is disposed between at least a part of the conductive particles that are adjacent to, but do not touch, one another, and
wherein at least some of the conductive particles of the conductive particle based material that are adjacent to one another are at least one of capacitively or inductively coupled to one another.
13. The antenna subassembly of claim 12 , wherein, when a Radio Frequency (RF) signal is input to the first element, a reverse power is lower than the reverse power of the first element without the second element.
14. The antenna subassembly of claim 12 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.
15. The antenna subassembly of claim 12 , further comprising at least one of a protective and concealment coating applied to the second element.
16. The antenna subassembly of claim 12 , wherein the second element is the same size, or smaller than, the first element.
17. The antenna subassembly of claim 12 , wherein the first element is disposed in an electronic device and the second element is disposed in a case for the electronic device.
18. The antenna subassembly of claim 12 , wherein the first element and the second element are disposed in an electronic device.
19. The antenna subassembly of claim 12 , wherein the second element is applied directly onto at least a portion of a conductive substrate.
20. The antenna subassembly of claim 12 , wherein the second element is completely electrically isolated.
21. The antenna subassembly of claim 12 , wherein the second element is at a ground potential.
22. The antenna subassembly of claim 21 , wherein the second element is a ground plane of the first element.
23. An electronic device comprising:
a housing;
a first element formed of a conductive material, the first element being electrically coupled to at least one of a receiver or a transmitter; and
a second element formed of a conductive particle based material, the second element being disposed adjacent to, and offset from, the first element,
wherein the first element and the second element are disposed in the housing,
wherein the second element is electrically isolated from the first element,
wherein the second element and the first element are at least one of inductively or capacitively coupled,
wherein at least one of an air gap or a non-conductive material is disposed between the first element and the second element,
wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,
wherein the binder is disposed between at least a part of the conductive particles that are adjacent to, but do not touch, one another, and
wherein at least some of the conductive particles of the conductive particle based material that are adjacent to one another are at least one of capacitively or inductively coupled to one another.
24. The electronic device of claim 23 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.
25. The electronic device of claim 23 , further comprising at least one of a protective and concealment coating applied to the second element.
26. The electronic device of claim 23 , wherein the second element is the same size, or smaller than, the first element.
27. The electronic device of claim 23 , wherein the second element is applied directly onto at least a portion of a conductive substrate.
28. The electronic device of claim 23 , wherein the second element is completely electrically isolated.
29. The electronic device of claim 23 , wherein the second element is at a ground potential.
30. The electronic device of claim 29 , wherein the second element is a ground plane of the first element.