IP Library › Granted Patent US 11,764,335
Granted Patent B2
US 11,764,335 · App. 17/380,211 · Granted Sep 19, 2023

Semiconductor light emitting device

Inventor: Yudai Uratani (Tokyo, JP)
Assignee: STANLEY ELECTRIC CO., LTD.
H01L33/486
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Quick Facts
Patent No.
US 11,764,335
App. No.
17/380,211
Granted
Sep 19, 2023
Kind
B2
Abstract

A semiconductor light emitting device has: a semiconductor light emitting element; a substrate on which the semiconductor light emitting element is mounted and which includes a substrate bonding surface to which a substrate metal layer having an annular shape is fixed; and a light transmitting cap including a window portion containing glass and transmitting radiation light of the semiconductor light emitting element and a flange having a bottom surface to which an annular flange fixation layer having a size corresponding to the substrate metal layer is fixed, and sealed and bonded to the substrate with a space housing the semiconductor light emitting element by bonding of the flange fixation layer to the substrate metal layer. The flange fixation layer contains a ceramic layer welded to the flange and a metal layer formed on the ceramic layer.

Claims (17)

1. A semiconductor light emitting device comprising:

a semiconductor light emitting element;

a substrate on which the semiconductor light emitting element is mounted and which includes a substrate bonding surface to which a substrate metal layer having an annular shape is fixed; and

a light transmitting cap including a window portion containing glass and transmitting radiation light of the semiconductor light emitting element and a flange having a bottom surface to which an annular flange fixation layer having a size corresponding to the substrate metal layer is fixed, and sealed and bonded to the substrate with a space housing the semiconductor light emitting element by bonding of the flange fixation layer to the substrate metal layer, wherein

the flange fixation layer contains a ceramic layer welded to the flange and a metal layer formed on the ceramic layer.

2. The semiconductor light emitting device according to claim 1 , wherein the ceramic layer has a ceramic layer inner peripheral portion formed from a bottom surface of the flange to an inner surface of the light transmitting cap and fixed over an entire inner peripheral surface of the flange.

3. The semiconductor light emitting device according to claim 2 , wherein the flange has a recessed portion in an inner peripheral portion and the ceramic layer inner peripheral portion is formed by welding of ceramic into the recessed portion.

4. The semiconductor light emitting device according to claim 3 , wherein a height of a top surface of the ceramic layer inner peripheral portion is equal to or larger than a height of a light emitting surface of the semiconductor light emitting element in a case of being measured in a light emitting direction of the semiconductor light emitting element.

5. The semiconductor light emitting device according to claim 2 , wherein an upper surface of the flange is positioned on a rear side in a light emitting direction of the semiconductor light emitting element relative to a light emitting surface of the semiconductor light emitting element.

6. The semiconductor light emitting device according to claim 2 , wherein a height of a top surface of the ceramic layer inner peripheral portion is equal to or larger than a height of a light emitting surface of the semiconductor light emitting element in a case of being measured in a light emitting direction of the semiconductor light emitting element.

7. The semiconductor light emitting device according to claim 6 , wherein the ceramic layer is a black alumina layer.

8. The semiconductor light emitting device according to claim 6 , wherein the ceramic layer contains a black alumina layer welded to the flange and a white alumina layer welded onto the black alumina layer.

9. The semiconductor light emitting device according to claim 2 , wherein the ceramic layer is a black alumina layer.

10. The semiconductor light emitting device according to claim 2 , wherein the ceramic layer contains a black alumina layer welded to the flange and a white alumina layer welded onto the black alumina layer.

11. The semiconductor light emitting device according to claim 1 , wherein the ceramic layer is a black alumina layer.

12. The semiconductor light emitting device according to claim 1 , wherein the ceramic layer contains a black alumina layer welded to the flange and a white alumina layer welded onto the black alumina layer.

13. The semiconductor light emitting device according to claim 1 , wherein the ceramic layer contains at least one of alumina, silicon carbide, silicon nitride, aluminum nitride, and zirconia.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: URATANI, YUDAI
To: STANLEY ELECTRIC CO., LTD.
Reel/Frame 056912/0186 →
Priority Claims (1)
JP 2020-125826 · Jul 22, 2020 · national
Continuity (1)
Related Publication 20220029065A1 · Jan 27, 2022