Vibration sensing assembly for bone conduction microphone

1. A vibration sensing assembly, comprising:

a base, comprising a first bottom plate, a second bottom plate located above the first bottom plate and separated from the first bottom plate, and a first cavity formed between the first bottom plate and the second bottom plate, wherein the second bottom plate comprises a first through hole and a second through hole communicated with the first cavity;

a side shell, disposed on the second bottom plate and comprising a cylinder and an inner partition located in the cylinder, wherein the inner partition divides the cylinder into a second cavity and an airflow channel, and the airflow channel is communicated with the first cavity through the first through hole;

a sensor, disposed in the second cavity and covering the second through hole of the second bottom plate;

an upper cover, wherein the side shell is located between the base and the upper cover, and the base, the side shell, and the upper cover jointly form an outer shell of the vibration sensing assembly; and

a diaphragm assembly, disposed between the side shell and the upper cover, wherein a third cavity is formed between the diaphragm assembly and the upper cover, and the third cavity is communicated with the airflow channel.

2. The vibration sensing assembly according to claim 1 , further comprising a control chip disposed in the second cavity and electrically connected to the sensor, wherein the first bottom plate is a circuit board, and the control chip is electrically connected to the circuit board.

3. The vibration sensing assembly according to claim 2 , wherein the base further comprises a spacer located between the first bottom plate and the second bottom plate, the spacer comprises a void, the first bottom plate is a circuit board, and the control chip is electrically connected to the circuit board through passing through a route of the void.

4. The vibration sensing assembly according to claim 2 , wherein the base further comprises a spacer located between the first bottom plate and the second bottom plate, the spacer comprises a via hole, the first bottom plate is a circuit board, and the control chip is electrically connected to the circuit board through the via hole.

5. The vibration sensing assembly according to claim 2 , further comprising a buffer disposed on a surface of the control chip, wherein the surface faces the diaphragm assembly.

6. The vibration sensing assembly according to claim 2 , wherein the base further comprises a spacer located between the first bottom plate and the second bottom plate, the spacer is made of a conductive material, the first bottom plate is a circuit board, and the control chip is electrically connected to the circuit board through the spacer.

7. The vibration sensing assembly according to claim 1 , wherein the diaphragm assembly comprises a diaphragm and a mass block fixed to the diaphragm, and the mass block is located in the second cavity.

8. The vibration sensing assembly according to claim 1 , wherein a projection range of the upper cover on a plane where the diaphragm assembly is located is same as a range of the diaphragm assembly.

9. The vibration sensing assembly according to claim 8 , wherein the diaphragm assembly comprises a perforation corresponding to the airflow channel.

10. The vibration sensing assembly according to claim 1 , wherein a projection range of a part surrounding the second cavity in the side shell on a plane where the diaphragm assembly is located is same as a range of the diaphragm assembly.

11. The vibration sensing assembly according to claim 10 , wherein the diaphragm assembly comprises a diaphragm and a mass block and an annulus connector fixed to the diaphragm, and the diaphragm is connected to the part surrounding the second cavity in the side shell through the annulus connector.

12. The vibration sensing assembly according to claim 11 , wherein the annulus connector and the mass block are disposed at a bottom surface of the diaphragm, so that the annulus connector and the mass block face toward the sensor.

13. The vibration sensing assembly according to claim 12 , wherein the upper cover contacts the part surrounding the second cavity in the side shell.

14. The vibration sensing assembly according to claim 11 , wherein the annulus connector surrounds the mass block and has same height as the mass block.

15. The vibration sensing assembly according to claim 1 , wherein the diaphragm assembly comprises a diaphragm, a mass block and an annulus connector, the annulus connector and the mass block are disposed at a bottom surface of the diaphragm, so that the annulus connector and the mass block face toward the sensor, the upper cover is connected to a part surrounding the second cavity in the side shell through the diaphragm and the annulus connector sequentially.

16. The vibration sensing assembly according to claim 1 , wherein the diaphragm assembly comprises a diaphragm, a mass block and an annulus connector, the annulus connector and the mass block are disposed at a top surface of the diaphragm, so that the annulus connector and the mass block face toward the upper cover, the upper cover is connected to a part surrounding the second cavity in the side shell through the annulus connector and the diaphragm sequentially.

17. The vibration sensing assembly according to claim 1 , wherein the base further comprises a spacer located between the first bottom plate and the second bottom plate, and the spacer, the side shell, and the upper cover jointly form an electromagnetic protection structure.

18. The vibration sensing assembly according to claim 1 , wherein the airflow channel is disposed at a peripheral position of the side shell.

19. The vibration sensing assembly according to claim 1 , wherein the upper cover has an upper cover opening, and the upper cover opening is communicated with the third cavity.