Semiconductor package with marking pattern

1. A semiconductor package, comprising:

a package substrate;

a chip structure including vertically stacked semiconductor chips disposed on the package substrate;

a spacer disposed on an uppermost semiconductor chip among the semiconductor chips;

an encapsulant covering at least part of the chip structure, and including an upper portion of the encapsulant covering at least part of the spacer; and

a marking pattern visually identifiable through an opening in the upper portion of the encapsulant selectively exposing portions of the spacer,

wherein the spacer includes at least one of monocrystalline silicon, polycrystalline silicon, amorphous silicon, monocrystalline gallium arsenide, polycrystalline gallium arsenide and amorphous gallium arsenide.

2. The semiconductor package of claim 1 , wherein the encapsulant includes at least one material having a first color, and the spacer includes at least one material having a second color different from the first color.

3. The semiconductor package of claim 1 , wherein the spacer has a first thickness, the upper portion of the encapsulant has a second thickness, and the opening has a depth substantially equal to the second thickness.

4. The semiconductor package of claim 3 , wherein the first thickness ranges from between about 20 μm to about 100 μm.

5. The semiconductor package of claim 3 , wherein the first thickness ranges from between about 80% to about 120% of the second thickness.

6. The semiconductor package of claim 3 , wherein the second thickness ranges from between about 20 μm to about 70 μm.

7. The semiconductor package of claim 3 , wherein the second thickness ranges from between about 50% to about 150% of the first thickness.

8. The semiconductor package of claim 1 , wherein a distance from an upper surface of the uppermost semiconductor chip to an uppermost surface of the encapsulant ranges from between about 40 μm to about 150 μm.

9. The semiconductor package of claim 1 , wherein the encapsulant includes an epoxy molding compound.

10. The semiconductor package of claim 9 , wherein the epoxy molding compound including at least one resin and carbon black.

11. The semiconductor package of claim 1 , further comprising:

upper connection pads disposed on an upper surface of the package substrate;

chip pads disposed on an active surface of at least one of the semiconductor chips; and

bonding wires electrically connecting at least one of the upper connection pads to at least one of the chip pads.

12. The semiconductor package of claim 1 , further comprising:

an upper adhesive layer disposed between the uppermost semiconductor chip and the spacer.

13. The semiconductor package of claim 1 , wherein each of the semiconductor chips includes an active surface and an inactive surface,

the active surface of a lowermost semiconductor chip among the semiconductor chips is connected to connection pads disposed on an upper surface of the package substrate via a connection member; and

an underfill resin substantially covering side surfaces of the connection member.

14. The semiconductor package of claim 1 , further comprising:

upper connection pads disposed on an upper surface of the package substrate;

chip pads disposed on an active surface of at least one of the semiconductor chips; and

bonding wires electrically connecting at least one of the upper connection pads to at least one of the chip pads,

wherein each of the semiconductor chips includes an upward-facing active surface and a downward-facing inactive surface.

15. A semiconductor package, comprising:

a package substrate;

a support member disposed on the package substrate;

a chip structure including a first semiconductor chip disposed on the package substrate, and second semiconductor chips vertically stacked on at least one of the first semiconductor chip and the support member;

a spacer disposed on an uppermost second semiconductor chip among the second semiconductor chips;

an encapsulant covering at least part of the chip structure, and including an upper portion of the encapsulant covering at least part of the spacer; and

a marking pattern visually identifiable through an opening in the upper portion of the encapsulant selectively exposing portions of the spacer,

wherein a distance from an uppermost surface of the chip structure to an uppermost surface of the encapsulant ranges from between about 40 μm to about 150 μm, and the spacer comprises silicon.

16. The semiconductor package of claim 15 , wherein a thickness of the spacer ranges from between about 20 μm to about 100 μm.

17. The semiconductor package of claim 15 , wherein a thickness of the spacer ranges from between about 80% to about 120% of a thickness of the uppermost second semiconductor chip.

18. The semiconductor package of claim 15 , wherein at least one of the second semiconductor chips is a memory chip.

19. A semiconductor package, comprising:

a package substrate;

a chip structure including vertically stacked semiconductor chips disposed on the package substrate;

a spacer disposed on the chip structure, and including a first surface facing the chip structure, and a second surface opposing the first surface;

an upper adhesive layer between the first surface of the spacer and an upper surface of an uppermost semiconductor chip among the semiconductor chips;

an encapsulant covering at least part of the chip structure, and including an upper portion of the encapsulant covering at least part of the spacer; and

a marking pattern visually identifiable through an opening in the upper portion of the encapsulant selectively exposing portions of the second surface of the spacer,

wherein the spacer includes a silicon layer, and

the encapsulant includes a resin and a filler.