Integrated magnetic assembly
An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate.
1. An electronic device, comprising:
a multilevel package substrate having a first level, a second level, and a third level;
the first, second, and third levels each having patterned conductive features and molded dielectric features; the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end; the second level including a second patterned conductive feature; and the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end;
a die having first, second, and third terminals, the first terminal of the die coupled to the first end of the first winding, the second terminal of the die coupled to the second end of the first winding, and the third terminal of the die coupled to a first conductive lead;
a second die having first, second, and third terminals, the first terminal of the second die coupled to the first end of the second winding, the second terminal of the second die coupled to the second end of the second winding, and the third terminal of the second die coupled to a second conductive lead; and
a package structure that encloses the die, the second die and a portion of the multilevel package substrate.
2. The electronic device of claim 1 , comprising a magnetic shield attached to a side of the multilevel package substrate.
3. The electronic device of claim 2 , comprising a second magnetic shield attached to another side of the multilevel package substrate.
4. The electronic device of claim 3 , wherein:
the die and the second die are attached to the side of the multilevel package substrate;
the third terminal of the die is soldered to the first conductive lead; and
the third terminal of the second die is soldered to the second conductive lead.
5. The electronic device of claim 3 , wherein:
the die is attached to a die attach pad;
the second die is attached to the die attach pad or another die attach pad;
the multilevel package substrate is attached to the die attach pad or a further die attach pad; and
the package structure encloses the multilevel package substrate and portions of the conductive leads.
6. The electronic device of claim 1 , wherein:
the die and the second die are attached to a side of the multilevel package substrate;
the third terminal of the die is soldered to the first conductive lead; and
the third terminal of the second die is soldered to the second conductive lead.
7. The electronic device of claim 1 , wherein:
the die is attached to a die attach pad;
the second die is attached to the die attach pad or another die attach pad;
the multilevel package substrate is attached to the die attach pad or a further die attach pad; and
the package structure encloses the multilevel package substrate and portions of the conductive leads.
8. An electronic device, comprising:
a multilevel package substrate attached to a die attach pad and having a first level, a second level, and a third level; the first, second, and third levels each having patterned conductive features and molded dielectric features; the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end; the second level including a second patterned conductive feature;
and the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end;
a die attached to the die attach pad, the die having first, second, and third terminals, the first terminal of the die coupled to the first end of the first winding, the second terminal of the die coupled to the second end of the first winding, and the third terminal of the die coupled to a first conductive lead; and
a package structure that encloses the die and a portion of the multilevel package substrate and portions of the conductive leads.
9. A magnetic assembly, comprising:
a multilevel package substrate having a first level, a second level, and a third level, the first, second, and third levels each having patterned conductive features and molded dielectric features;
the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end;
the second level including a second patterned conductive feature;
the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end;
a die attached to a side of the multilevel package substrate, the die having first, second, and third terminals, the first terminal of the die coupled to the first end of the first winding, the second terminal of the die coupled to the second end of the first winding, and the third terminal of the die coupled to a first conductive lead; and
a second die attached to the side of the multilevel package substrate, the second die having first, second, and third terminals, the first terminal of the second die coupled to the first end of the second winding, the second terminal of the second die coupled to the second end of the second winding, and the third terminal of the second die coupled to a second conductive lead.
10. A magnetic assembly, comprising:
a multilevel package substrate having a first level, a second level, and a third level, the first, second, and third levels each having patterned conductive features and molded dielectric features;
the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end;
the second level including a second patterned conductive feature;
the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end;
a die attached to a side of the multilevel package substrate, the die having first, second, and third terminals, the first terminal of the die coupled to the first end of the first winding, the second terminal of the die coupled to the second end of the first winding, and the third terminal of the die coupled to a first conductive lead; and
a magnetic shield attached to the side of the multilevel package substrate.
11. The magnetic assembly of claim 10 , comprising a second magnetic shield attached to another side of the multilevel package substrate.
12. A method for fabricating an electronic device, the method comprising:
fabricating a multilevel package substrate, including:
forming a first level on a carrier structure, the first level having first molded dielectric features and a first patterned conductive feature with multiple turns that form a first winding,
forming a second level on the first level, the second level having second patterned conductive features and second molded dielectric features,
forming a third level on the second level, the third level having third molded dielectric features and a third patterned conductive feature with multiple turns that form a second winding, and
removing the carrier structure from the first level;
performing an electrical connection process that couples a first die and the first winding in a first circuit, and couples a second die and the second winding in a second circuit isolated from the first circuit; and
performing a molding process that encloses a portion of the multilevel package substrate and the first and second dies in a package structure.
13. The method of claim 12 , wherein the electrical connection process includes soldering the first and second dies to a side of the multilevel package substrate.
14. The method of claim 13 , further comprising attaching a magnetic shield to the side of the multilevel package substrate.
15. The method of claim 12 , further comprising attaching a magnetic shield to a side of the multilevel package substrate.
16. The method of claim 12 , further comprising:
attaching the multilevel package substrate to a first die attach pad of a lead frame;
attaching the first die to the first die attach pad; and
attaching the second die to a second die attach pad of the lead frame.