IP Library › Granted Patent US 12,306,297
Granted Patent B2
US 12,306,297 · App. 17/388,416 · Granted May 20, 2025

Ultrasonic probe

Inventors: Masaaki Sudo (Otawara, JP); Takashi Takeuchi (Otawara, JP); Hiroyuki Shikata (Nasushiobara, JP)
Assignee: Canon Medical Systems Corporation
G01S15/8918A61B8/4494B06B1/0629G01S15/8925G01S15/8927A61B8/4444
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Quick Facts
Patent No.
US 12,306,297
App. No.
17/388,416
Granted
May 20, 2025
Kind
B2
Abstract

According to one embodiment, an ultrasonic probe includes a plurality of ultrasonic transducers, a first substrate, and a plurality of electronic circuit modules. The plurality of ultrasonic transducers are equally spaced and aligned at least in one direction. The first substrate to which the ultrasonic transducers are coupled. The plurality of electronic circuit modules provided at predetermined intervals one the first substrate and coupled to the first substrate.

Claims (40)

1. An ultrasonic probe, comprising:

a plurality of ultrasonic transducers equally spaced and aligned at least in one direction;

a first substrate to which the ultrasonic transducers are coupled, the first substrate being a non-divided structure; and

a plurality of electronic circuit modules arranged spaced apart from each other by a predetermined distance on the first substrate and coupled to the first substrate, wherein

each of the electronic circuit modules includes:

an acoustic load member; and

a second substrate folded in such a manner as to be in contact with three surfaces of the acoustic load member, adhered at least to a first surface of the three surfaces, and coupled to the first substrate, and

the first surface is parallel to the first substrate.

2. The ultrasonic probe according to claim 1 , further comprising:

a filler provided between any adjacent two of the electronic circuit modules.

3. The ultrasonic probe according to claim 2 , wherein

the filler is at least one of (i) all or a portion of materials of an acoustic load member and (ii) an epoxy resin.

4. The ultrasonic probe according to claim 1 , further comprising:

a spacer provided between any adjacent two of the electronic circuit modules and having a width that is the same length as the predetermined distance.

5. The ultrasonic probe according to claim 1 , wherein

each of the electronic circuit modules includes a metallic member adhered to a surface of the acoustic load member opposite the first surface, and

the metallic member has a surface opposite the surface to which the acoustic load member is adhered, the opposite surface having a shape for holding and supporting a support member.

6. The ultrasonic probe according to claim 5 , wherein

the metallic member has, as the shape, at least a concavity or a protrusion.

7. The ultrasonic probe according to claim 1 , wherein

the electronic circuit modules are coupled to the first substrate in such a manner that one of the folded surfaces of the second substrate of one electronic circuit module is adjacent to one of the folded surfaces of the second substrate of an adjacent electronic circuit module.

8. An ultrasonic probe constituted by coupling modules of a same type to each other,

each of the modules comprising:

a plurality of ultrasonic transducers equally spaced and aligned at least in one direction;

a first substrate to which the ultrasonic transducers are coupled;

an acoustic load member;

a second substrate folded in such a manner as to be in contact with three surfaces of the acoustic load member, adhered at least to a first surface of the three surfaces, and coupled to the first substrate; and

a metallic member adhered to a surface of the acoustic load member opposite the first surface, wherein

the metallic member has a surface opposite the surface to which the acoustic load member is adhered, the opposite surface having a shape for holding and supporting a support member.

9. The ultrasonic probe according to claim 8 , wherein

the metallic member has, as the shape, at least a concavity or a protrusion.

10. An ultrasonic probe, comprising:

a plurality of ultrasonic transducers equally spaced and aligned at least in one direction;

a first substrate to which the ultrasonic transducers are coupled; and

a plurality of electronic circuit modules provided at predetermined intervals on the first substrate and coupled to the first substrate, wherein

each of the electronic circuit modules includes:

an acoustic load member; and

a second substrate folded in such a manner as to be in contact with three surfaces of the acoustic load member, adhered at least to a first surface of the three surfaces, and coupled to the first substrate,

the first surface is parallel to the first substrate, and

a metallic member adhered to a surface of the acoustic load member opposite the first surface, the metallic member having a surface opposite the surface to which the acoustic load member is adhered and the opposite surface having a shape for holding and supporting a support member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: SUDO, MASAAKI; TAKEUCHI, TAKASHI; SHIKATA, HIROYUKI
To: CANON MEDICAL SYSTEMS CORPORATION
Reel/Frame 057020/0582 →
Priority Claims (1)
JP 2020-128158 · Jul 29, 2020 · national
Continuity (1)
Related Publication 20220035028A1 · Feb 3, 2022
References Cited (13)
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US 11510648B2 · Shikata · 2022 [cited by examiner]
US 20060186765A1 · Hashimoto · 2006 [cited by applicant]
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Japanese Office Action issued Feb. 15, 2024 in Japanese Patent Application No. 2020-128158, 3 pages. [cited by applicant]
Japanese Office Action issued Feb. 13, 2024 in Japanese Patent Application No. 2020-128158, 3 pages. [cited by applicant]
Japanese Office Action issued Jul. 23, 2024 in Japanese Patent Application No. 2020-128158, 3 pages. [cited by applicant]