Apparatus and method for orientation of semiconductor device die

1. An apparatus for aligning and orienting a semiconductor die (“die”) to be transferred to a substrate, the apparatus comprising:

an alignment mechanism to align the die to be queued, along a surface, among a plurality of die, the surface being formed of a plurality of overlapping material layers; and

an orientation mechanism to orient the die using magnetism to be positioned in a predetermined position prior to transfer to the substrate,

wherein the alignment mechanism further transports the die to be positioned at a feeding position for supply to a die transfer system.

2. The apparatus according to claim 1 , wherein the alignment mechanism includes a plurality of capillary channels.

3. The apparatus according to claim 2 , wherein the channels are sized according to a size of the die passing therethrough.

4. The apparatus according to claim 1 , wherein the alignment mechanism and the orientation mechanism implement a fluid flowing from a first side of the surface to a second side of the surface at which the die are positioned, thereby creating a laminar flow of fluid via which the die are oriented and aligned and transported.

5. The apparatus according to claim 4 , wherein the surface is formed of mesh materials.

6. The apparatus according to claim 1 , wherein the orientation mechanism assists in sorting good die from bad die.

7. The apparatus according to claim 1 , wherein the alignment mechanism operates to transport and align die via a fluid flow through a surface on which the die are located.

8. A method of aligning and orienting a semiconductor die (“die”) to be transferred to a substrate, the method comprising:

aligning the die via an alignment mechanism to be queued; and

orienting and sorting the die via an orientation mechanism using magnetism to be positioned within a plurality of capillary channels of the alignment mechanism in a predetermined position prior to transfer to the substrate.

9. The method according to claim 8 , wherein the aligning further transports the die to be positioned at a feeding position for supply to a die transfer system.

10. The method according to claim 8 , wherein the channels are sized according to a size of the die passing therethrough.

11. The method according to claim 8 , wherein the aligning and the orienting include flowing a fluid from a first side of a surface through a second side of the surface at which the die are positioned, thereby creating a laminar flow of fluid via which the die are oriented and aligned and transported.

12. The method according to claim 11 , wherein the surface is formed of a mesh material.

13. The method according to claim 11 , wherein the surface is formed of a plurality of overlapping mesh material layers.

14. The method according to claim 8 , wherein the orienting includes sorting good die from bad die.

15. The method according to claim 8 , wherein the aligning includes operating a fluid flow beneath the die to transport the die.

16. The method according to claim 15 , wherein the fluid of the fluid flow is an inert gas.

17. A system for aligning and orienting a semiconductor die (“die”) to be transferred to a substrate, the system comprising:

an alignment mechanism to align the die to be queued among a plurality of die; and

an orientation mechanism to orient the plurality of die using magnetism to be positioned in a predetermined position prior to transfer to the substrate,

wherein the alignment mechanism further transports the plurality of die to be positioned at a feeding position for supply to a plurality of capillary channels, and

wherein the magnetism sorts the plurality of die into various capillary channels of the plurality of capillary channels.

18. The system according to claim 17 , wherein the plurality of die are sorted such that faulty die are forced into a particular channel of the plurality of capillary channels, or a set of channels of the plurality of capillary channels, separate from good die.