IP Library Granted Patent US 12,308,825
Granted Patent B2
US 12,308,825 · App. 17/393,111 · Granted May 20, 2025

Transversely-excited film bulk acoustic resonators with narrow gaps between busbars and ends of interdigital transducer fingers

Inventors: Bryant Garcia (Belmont, CA); Filip ILiev (San Francisco, CA)
Assignee: MURATA MANUFACTURING CO., LTD
H03H9/54H03H3/02H03H9/02015H03H9/02157H03H9/02228H03H9/205H03H2003/021
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Quick Facts
Patent No.
US 12,308,825
App. No.
17/393,111
Granted
May 20, 2025
Kind
B2
Abstract

An acoustic resonator has a piezoelectric plate attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) formed on the plate has interleaved fingers on the diaphragm with first parallel fingers extending from a first busbar and second parallel fingers extending from a second busbar of the IDT. A distance between the interleaved fingers defines an IDT pitch. The IDT has a gap distance between the ends of the first plurality of parallel fingers and the second busbar, and between the ends of the second plurality of parallel fingers and the first busbar; and the gap distance is less than ⅔ times the IDT pitch.

Claims (49)

1. A bulk acoustic resonator device comprising:

a substrate;

a piezoelectric layer attached directly, or indirectly via one or more intermediate layers, to the substrate, a portion of the piezoelectric layer over a cavity of the bulk acoustic resonator device;

an interdigital transducer (IDT) on the piezoelectric layer and having interleaved fingers,

wherein the interleaved fingers include a first plurality of fingers extending from a first busbar of the IDT and a second plurality of fingers extending from a second busbar of the IDT that opposes the first busbar,

wherein a center-to-center distance between at least a pair of adjacent interleaved fingers extending from the opposing first and second busbars defines a pitch of the IDT,

wherein the IDT includes a gap distance between an end of the first plurality of fingers and the second busbar, and/or between an end of the second plurality of fingers and the first busbar,

wherein the gap distance is less than ⅔ times the pitch, and

wherein a width of the interleaved fingers is not one-fourth an acoustic wavelength of the bulk acoustic resonator device at resonance frequency.

2. The device of claim 1 , wherein the gap distance is between ½ and ⅔ times the pitch.

3. The device of claim 1 , wherein the gap distance is between 3.0 and 4.5 μm; and the pitch is between 6 μm and 7.5 μm.

4. The device of claim 1 , wherein a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the piezoelectric layer over the cavity, the primary shear acoustic mode being a bulk shear mode where acoustic energy propagates along a direction substantially orthogonal to a surface of the piezoelectric layer, which is transverse to a direction of an electric field created by the interleaved fingers of the IDT.

5. The device of claim 4 , wherein:

the piezoelectric layer is a Y-cut lithium niobate piezoelectric material;

the radio frequency signal applied to the IDT excites spurious modes in a gap region between the respective ends of the interleaved fingers and the first and second busbars that cause undesired spurs in the admittance of an XBAR; and

the gap distance is a predetermined gap distance to suppress the spurious modes by up to 10 or 20 dB when the radio frequency signal is applied to the IDT.

6. The device of claim 4 , wherein the pitch of the IDT is not equal to one-half of the acoustic wavelength of the bulk acoustic resonator device at resonance frequency.

7. A bulk acoustic resonator device comprising:

a substrate having a surface;

a piezoelectric layer attached to the surface of the substrate via one or more intermediate material layers, the piezoelectric layer including a diaphragm that is over a cavity in the one or more intermediate material layers of the bulk acoustic resonator device;

an interdigital transducer (IDT) on the piezoelectric layer and including interleaved fingers extending from opposing first and second busbars, the interleaved fingers including a first plurality of fingers extending from the first busbar and a second plurality of fingers extending from the second busbar,

wherein a center-to-center distance between a pair of immediately adjacent fingers of the interleaved fingers defines an IDT finger pitch,

wherein the IDT includes a gap distance between ends of the first plurality of fingers and the second busbar, and between ends of the second plurality of fingers and the first busbar,

wherein the gap distance is less than ⅔ times the IDT finger pitch, and ⅔ wherein a width of the interleaved fingers is not one-fourth an acoustic wavelength of the bulk acoustic resonator device at resonance frequency.

8. The device of claim 7 , wherein the gap distance is between ⅓ and ⅔ times the IDT finger pitch.

9. The device of claim 7 , wherein the IDT finger pitch is between 6 μm and 7.5 μm.

10. The device of claim 7 , wherein a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the piezoelectric layer over the cavity, the primary shear acoustic mode being a bulk shear mode where acoustic energy propagates along a direction substantially orthogonal to a surface of the piezoelectric layer, which is transverse to a direction of an electric field created by the interleaved fingers of the IDT.

11. The device of claim 10 , wherein:

the piezoelectric layer is a Y-cut lithium niobate piezoelectric material;

the radio frequency signal applied to the IDT excites spurious modes in a gap region between the ends of the interleaved fingers of the IDT and the first and second busbars that cause undesired spurs in the admittance of an XBAR; and

the gap distance is a predetermined gap distance to suppress the spurious modes by up to 10 or 20 dB when the radio frequency signal is applied to the IDT.

12. The device of claim 10 , wherein the pitch of the IDT is not equal to one-half of the acoustic wavelength of the bulk acoustic resonator device at resonance frequency.

13. A filter device comprising:

a plurality of bulk acoustic resonator devices that each comprise:

a substrate;

a piezoelectric layer attached to the substrate via one or more intermediate layers and having a portion forming a diaphragm that is over a cavity of the bulk acoustic resonator device;

an interdigital transducer (IDT) on the piezoelectric layer and having interleaved fingers that include a first plurality of fingers extending from a first busbar of the IDT and a second plurality of fingers extending from a second busbar of the IDT,

wherein a center-to-center distance between at least a pair of adjacent interleaved fingers extending from the first and second busbars, respectively, defines a pitch of the IDT,

wherein the IDT includes a gap distance between an end of the first plurality of fingers and the second busbar, and/or between an end of the second plurality of fingers and the first busbar,

wherein the gap distance is less than ⅔ times the pitch of the IDT, and

wherein a width of the interleaved fingers is not one-fourth the acoustic wavelength of the bulk acoustic resonator device at resonance frequency, and

wherein a first resonator of the plurality of bulk acoustic resonator devices has a gap distance that is different than a gap distance of a second resonator of the plurality of bulk acoustic resonator devices.

14. The filter device of claim 13 , wherein, for each of the plurality of bulk acoustic resonator devices, a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the piezoelectric layer over the cavity, the primary shear acoustic mode being a bulk shear mode where acoustic energy propagates along a direction substantially orthogonal to a surface of the piezoelectric layer, which is transverse to a direction of an electric field created by the interleaved fingers of the IDT.

15. The device of claim 14 , wherein, for each of the plurality of bulk acoustic resonator devices, the pitch of the IDT is not equal to one-half of the acoustic wavelength of the bulk acoustic resonator device at resonance frequency.

16. The device of claim 14 , wherein, for each of the plurality of bulk acoustic resonator devices:

the piezoelectric layer is a Y-cut lithium niobate piezoelectric material;

the radio frequency signal applied to the IDT excites spurious modes in a gap region between the respective ends of the interleaved fingers and the first and second busbars that cause undesired spurs in an admittance of the respective bulk acoustic resonator device; and

the gap distance is a predetermined gap distance to suppress spurious modes by up to 10 or 20 dB when the radio frequency signal is applied to the IDT.

17. The filter device of claim 13 , wherein, for each of the plurality of bulk acoustic resonator devices, the gap distance is between 3.0 and 4.5 μm, and the pitch is between 6 μm and 7.5 μm.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2022
From: RESONANT INC.
To: MURATA MANUFACTURING CO., LTD
Reel/Frame 061966/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: GARCIA, BRYANT; ILIEV, FILIP
To: RESONANT INC.
Reel/Frame 057071/0075 →
Continuity (2)
Provisional Application 63148803 · Feb 12, 2021
Related Publication 20220263494A1 · Aug 18, 2022
References Cited (165)
US 5446330A · Eda et al. · 1995 [cited by applicant]
US 5552655A · Stokes et al. · 1996 [cited by applicant]
US 5726610A · Allen et al. · 1998 [cited by applicant]
US 5853601A · Krishaswamy et al. · 1998 [cited by applicant]
US 6377140B1 · Ehara et al. · 2002 [cited by applicant]
US 6516503B1 · Ikada et al. · 2003 [cited by applicant]
US 6540827B1 · Levy et al. · 2003 [cited by applicant]
US 6707229B1 · Martin · 2004 [cited by applicant]
US 6710514B2 · Ikada et al. · 2004 [cited by applicant]
US 7345400B2 · Nakao et al. · 2008 [cited by applicant]
US 7463118B2 · Jacobsen · 2008 [cited by applicant]
US 7535152B2 · Ogami et al. · 2009 [cited by applicant]
US 7684109B2 · Godshalk et al. · 2010 [cited by applicant]
US 7728483B2 · Tanaka · 2010 [cited by applicant]
US 7868519B2 · Umeda · 2011 [cited by applicant]
US 7941103B2 · Iwamoto et al. · 2011 [cited by applicant]
US 7965015B2 · Tai et al. · 2011 [cited by applicant]
US 8278802B1 · Lee et al. · 2012 [cited by applicant]
US 8294330B1 · Abbott et al. · 2012 [cited by applicant]
US 8344815B2 · Yamanaka · 2013 [cited by applicant]
US 8816567B2 · Zuo et al. · 2014 [cited by applicant]
US 8829766B2 · Milyutin et al. · 2014 [cited by applicant]
US 8932686B2 · Hayakawa et al. · 2015 [cited by applicant]
US 9093979B2 · Wang · 2015 [cited by applicant]
US 9112134B2 · Takahashi · 2015 [cited by applicant]
US 9130145B2 · Martin et al. · 2015 [cited by applicant]
US 9219466B2 · Meltaus et al. · 2015 [cited by applicant]
US 9276557B1 · Nordquist et al. · 2016 [cited by applicant]
US 9319023B2 · Tanaka · 2016 [cited by examiner]
US 9369105B1 · Li et al. · 2016 [cited by applicant]
US 9425765B2 · Rinaldi · 2016 [cited by applicant]
US 9525398B1 · Olsson et al. · 2016 [cited by applicant]
US 9640750B2 · Nakanishi et al. · 2017 [cited by applicant]
US 9748923B2 · Kando et al. · 2017 [cited by applicant]
US 9762202B2 · Thalmayr et al. · 2017 [cited by applicant]
US 9780759B2 · Kimura et al. · 2017 [cited by applicant]
US 9837984B2 · Khlat et al. · 2017 [cited by applicant]
US 10079414B2 · Guyette et al. · 2018 [cited by applicant]
US 10187039B2 · Komatsu et al. · 2019 [cited by applicant]
US 10200013B2 · Bower et al. · 2019 [cited by applicant]
US 10211806B2 · Bhattacharjee · 2019 [cited by applicant]
US 10284176B1 · Solal · 2019 [cited by applicant]
US 10491192B1 · Plesski · 2019 [cited by examiner]
US 10601392B2 · Plesski et al. · 2020 [cited by applicant]
US 10637438B2 · Garcia et al. · 2020 [cited by applicant]
US 10644674B2 · Takamine · 2020 [cited by applicant]
US 10707833B2 · Mimura · 2020 [cited by examiner]
US 10756696B2 · Makkonen · 2020 [cited by examiner]
US 10756697B2 · Plesski et al. · 2020 [cited by applicant]
US 10790802B2 · Yantchev et al. · 2020 [cited by applicant]
US 10797675B2 · Plesski · 2020 [cited by applicant]
US 10819309B1 · Turner et al. · 2020 [cited by applicant]
US 10826462B2 · Plesski et al. · 2020 [cited by applicant]
US 10868510B2 · Yantchev et al. · 2020 [cited by applicant]
US 10868512B2 · Garcia et al. · 2020 [cited by applicant]
US 10868513B2 · Yantchev · 2020 [cited by applicant]
US 10911017B2 · Plesski · 2021 [cited by applicant]
US 10911021B2 · Turner et al. · 2021 [cited by applicant]
US 10911023B2 · Turner · 2021 [cited by applicant]
US 10917070B2 · Plesski et al. · 2021 [cited by applicant]
US 10917072B2 · McHugh et al. · 2021 [cited by applicant]
US 10985726B2 · Plesski · 2021 [cited by applicant]
US 10985728B2 · Plesski et al. · 2021 [cited by applicant]
US 10985730B2 · Garcia · 2021 [cited by applicant]
US 10992282B1 · Plesski et al. · 2021 [cited by applicant]
US 10992283B2 · Plesski et al. · 2021 [cited by applicant]
US 10992284B2 · Yantchev · 2021 [cited by applicant]
US 10998877B2 · Turner et al. · 2021 [cited by applicant]
US 10998882B2 · Yantchev et al. · 2021 [cited by applicant]
US 11003971B2 · Plesski et al. · 2021 [cited by applicant]
US 11057016B2 · Tanaka · 2021 [cited by examiner]
US 11588469B2 · Daimon · 2023 [cited by examiner]
US 11611327B2 · Daimon · 2023 [cited by examiner]
US 11722122B2 · Goto · 2023 [cited by examiner]
US 11843366B2 · Fukuhara · 2023 [cited by examiner]
US 20020079986A1 · Ruby et al. · 2002 [cited by applicant]
US 20020158714A1 · Kaitila et al. · 2002 [cited by applicant]
US 20020189062A1 · Lin et al. · 2002 [cited by applicant]
US 20030080831A1 · Naumenko et al. · 2003 [cited by applicant]
US 20030199105A1 · Kub et al. · 2003 [cited by applicant]
US 20040100164A1 · Murata · 2004 [cited by applicant]
US 20040261250A1 · Kadota et al. · 2004 [cited by applicant]
US 20050185026A1 · Noguchi et al. · 2005 [cited by applicant]
US 20050218488A1 · Matsuo · 2005 [cited by applicant]
US 20050264136A1 · Tsutsumi et al. · 2005 [cited by applicant]
US 20060179642A1 · Kawamura · 2006 [cited by applicant]
US 20070182510A1 · Park · 2007 [cited by applicant]
US 20070188047A1 · Tanaka · 2007 [cited by applicant]
US 20070194863A1 · Shibata et al. · 2007 [cited by applicant]
US 20070267942A1 · Matsumoto et al. · 2007 [cited by applicant]
US 20080246559A1 · Ayazi · 2008 [cited by applicant]
US 20100064492A1 · Tanaka · 2010 [cited by applicant]
US 20100123367A1 · Tai et al. · 2010 [cited by applicant]
US 20110018389A1 · Fukano et al. · 2011 [cited by applicant]
US 20110018654A1 · Bradley et al. · 2011 [cited by applicant]
US 20110109196A1 · Goto et al. · 2011 [cited by applicant]
US 20110278993A1 · Iwamoto · 2011 [cited by applicant]
US 20120286900A1 · Kadota et al. · 2012 [cited by applicant]
US 20130234805A1 · Takahashi · 2013 [cited by applicant]
US 20130271238A1 · Onda · 2013 [cited by applicant]
US 20130278609A1 · Stephanou et al. · 2013 [cited by applicant]
US 20130321100A1 · Wang · 2013 [cited by applicant]
US 20140130319A1 · Iwamoto · 2014 [cited by applicant]
US 20140145556A1 · Kadota · 2014 [cited by applicant]
US 20140151151A1 · Reinhardt · 2014 [cited by applicant]
US 20140152145A1 · Kando et al. · 2014 [cited by applicant]
US 20140173862A1 · Kando et al. · 2014 [cited by applicant]
US 20140225684A1 · Kando et al. · 2014 [cited by applicant]
US 20150042417A1 · Onodera et al. · 2015 [cited by applicant]
US 20150319537A1 · Perois et al. · 2015 [cited by applicant]
US 20150333730A1 · Meltaus et al. · 2015 [cited by applicant]
US 20160028367A1 · Shealy · 2016 [cited by applicant]
US 20160182009A1 · Bhattacharjee · 2016 [cited by applicant]
US 20170063332A1 · Gilbert et al. · 2017 [cited by applicant]
US 20170179225A1 · Kishimoto · 2017 [cited by applicant]
US 20170179928A1 · Raihn et al. · 2017 [cited by applicant]
US 20170214381A1 · Bhattacharjee · 2017 [cited by applicant]
US 20170214387A1 · Burak et al. · 2017 [cited by applicant]
US 20170222617A1 · Mizoguchi · 2017 [cited by applicant]
US 20170222622A1 · Solal et al. · 2017 [cited by applicant]
US 20170370791A1 · Nakamura et al. · 2017 [cited by applicant]
US 20180005950A1 · Watanabe · 2018 [cited by applicant]
US 20180026603A1 · Iwamoto · 2018 [cited by applicant]
US 20180033952A1 · Yamamoto · 2018 [cited by applicant]
US 20180062615A1 · Kato et al. · 2018 [cited by applicant]
US 20180062617A1 · Yun et al. · 2018 [cited by applicant]
US 20180123016A1 · Gong · 2018 [cited by applicant]
US 20180191322A1 · Chang et al. · 2018 [cited by applicant]
US 20190068164A1 · Houlden et al. · 2019 [cited by applicant]
US 20190123713A1 · Daimon · 2019 [cited by examiner]
US 20190123721A1 · Takamine · 2019 [cited by applicant]
US 20190131953A1 · Gong · 2019 [cited by applicant]
US 20190273480A1 · Lin et al. · 2019 [cited by applicant]
US 20190348966A1 · Campanella-Pineda · 2019 [cited by applicant]
US 20200036357A1 · Mimura · 2020 [cited by applicant]
US 20200235719A1 · Yantchev et al. · 2020 [cited by applicant]
WO 2016017104 · 2016 [cited by applicant]
WO 2018003273 · 2018 [cited by applicant]
T. Takai, H. Iwamoto, et al., “I.H.P.Saw Technology and its Application to Microacoustic Components (Invited).” 2017 IEEE International Ultrasonics Symposium, Sept. 6-9, 2017. pp. 1-8 Sep. 6, 2017. [cited by applicant]
R. Olsson III, K. Hattar et al. “A high electromechanical coupling coefficient SHO Lamb wave lithiumniobate micromechanical resonator and a method for fabrication” Sensors and Actuators A: Physical, vol. 209, Mar. 1, 20… [cited by applicant]
M. Kadota, S. Tanaka, “Wideband acoustic wave resonators composed of hetero acoustic layer structure,” Japanese Journal of Applied Physics, vol. 57, No. 7S1. Published Jun. 5, 2018. 5 pages, Jun. 5, 2018. [cited by applicant]
Y. Yang, R. Lu et al. “Towards Ka Band Acoustics: Lithium Niobat Asymmetrical Mode Piezoelectric MEMS Resonators”, Department of Electrical and Computer Engineering University of Illinois at Urbana-Champaign, May 2018. … [cited by applicant]
Y. Yang, A. Gao et al. “5 GHZ Lithium Niobate MEMS Resonators With High Fom of 153”, 2017 IEEE 30th International Conference in Micro Electro Mechanical Systems (MEMS). Jan. 22-26, 2017. pp. 942-945 Jan. 22, 2017. [cited by applicant]
USPTO/ISA, International Search Report and Written Opinion for PCT Application No. PCT/US2019/036433 dated Aug. 29, 2019. Aug. 29, 2019. [cited by applicant]
Mizutaui, K. and Toda, K., “Analysis of lamb wave propagation characteristics in rotated Ycut Xpropagation LiNbO3 plates.” Electron. Comm. Jpn. Pt. I, 69, No. 4 (1986): 47-55. doi:10.1002/ecja.4410690406 Jan. 1986. [cited by applicant]
Buchanan “Ceramic Materials for Electronics” 3rd Edition, first published in 2004 by Marcel Dekker, Inc. pp. 496 (Year 2004). Jan. 2004. [cited by applicant]
Moussa et al. Review on Triggered Liposomal Drug Delivery with a Focus on Ultrasound2015, Bentham Science Publishers, pp. 16 (Year 2005) Jan. 2005. [cited by applicant]
Acoustic Properties of SolidsONDA Corporation592 Weddell Drive, Sunnyvale, CA 94089, Apr. 11, 2003, pp. 5 (Year 2003) Apr. 11, 2003. [cited by applicant]
Sorokin et al.Study of Microwave Acoustic Attenuation in a Multi-frequency Bulk Acoustic Resonator Based on a Synthetic Diamond Single CrystalPublished in Acoustical Physics, vol. 61, No. 6, 2015 pp. 675 (Year 2015) Jan… [cited by applicant]
Zou, Jie “High-Performance Aluminum Nitride Lamb Wave Resonators for RF Front-End Technology” University of California, Berkeley, Summer 2015, pp. 63 (Year 2015) Jan. 2015. [cited by applicant]
G. Manohar, Investigation of Various Surface Acoustic Wave Design Configurations for Improved Sensitivity, Jan. 2012, Doctoral dissertation, University of South Florida, USA Jan. 2012. [cited by applicant]
Santosh, G. , Surface acoustic wave devices on silicon using patterned and thin film ZnO, Ph.D. thesis, Feb. 2016, Indian Institute of technology Guwahati, Assam, India Feb. 2016. [cited by applicant]
Kadota et al. “5.4 Ghz Lamb Wave Resonator on LiNbO3 Thin Crystal Plate and Its Application,” published in Japanese Journal of Applied Physics 50 (2011) 07HD11. (Year: 2011) 2011. [cited by applicant]
USPTO/ISA, International Search Report and Written Opinion for PCT Application No. PCT/US2020/45654 dated Oct. 29, 2020. 2020. [cited by applicant]
Webster Dictionary Meaning of “diaphragm” Merriam Webster since 1828. 1828. [cited by applicant]
Safari et al. “Piezoelectric for Transducer Applications” published by Elsevier Science Ltd., pp. 4 (Year: 2000). 2020. [cited by applicant]
Bahreyni, B. Fabrication and Design of Resonant Microdevices Andrew William, Inc. 2018, NY (Year 2008). 2008. [cited by applicant]
USPTO/ISA, International Search Report and Written Opinion for PCT Application No. PCT/US2019/058632 dated Jan. 17, 2020. 2020. [cited by applicant]
Ekeom, D. & Dubus, Bertrand & Volatier, A.. (2006). Solidly mounted resonator (SMR) FEM-BEM simulation. 1474-1477. 10.1109/ULTSYM.2006.371. 2006. [cited by applicant]
Naumenko et al., “Optimal orientations of Lithium Niobate for resonator SAW filters”, 2003 IEEE Ultrasonics SYMPOSIUM-pp. 2110-2113. (Year: 2003) 2003. [cited by applicant]
Namdeo et al. “Simulation on Effects of Electrical Loading due to Interdigital Transducers in Surface Acoustic Wave Resonator”, published in Procedia Engineering 64 ( 2013) of Science Direct pp. 322-330 (Year: 2013) 201… [cited by applicant]
Rodriguez-Madrid et al., “Super-High-Frequency SAW Resonators on AIN/Diamond”, IEEE Electron Device Letters, vol. 33, No. 4, Apr. 2012, pp. 495-497. Year: 2012) 2012. [cited by applicant]
A. C. Guyette, “Theory and Design of Intrinsically Switched Multiplexers With Optimum Phase Linearity,” in IEEE Transactions on Microwave Theory and Techniques, vol. 61, No. 9, pp. 3254-3264, Sep. 2013, doi: 10.1109/TMT… [cited by applicant]
Yanson Yang, Ruochen Lu, Songbin Gong, High Q Antisymmetric Mode Lithium Niobate MEMS Resonators With Spurious Mitigation, Journal of Microelectromechanical Systems, vol. 29, No. 2, Apr. 2020. Apr. 2, 2020. [cited by applicant]
Yu-Po Wong, Luyan Qiu, Naoto Matsuoka, Ken-ya Hashimoto, Broadband Piston Mode Operation for First-order Antisymmetric Mode Resonators, 2020 IEEE International Ultrasonics Symposium, Sep. 2020. Sep. 2020. [cited by applicant]