PAGE MAP RENUMBERING TO REDUCE ERROR CORRECTION FAILURES AND IMPROVE PROGRAM TIME UNIFORMITY
Systems, apparatuses and methods may provide for technology that detects a request to program a NAND memory containing a plurality of dies and programs the NAND memory on a stripe-by-stripe basis, wherein each stripe spans the plurality of dies and includes multiple types of pages. The multiple types of pages may reduce program time variability across the stripes and reduce the error susceptibility of the NAND memory.
1 . A solid state drive (SSD) comprising:
a device controller;
a chip controller; and
a NAND memory containing a plurality of dies, wherein one or more of the device controller or the chip controller include logic coupled to one or more substrates, the logic to:
detect a request to program the NAND memory, and
program the NAND memory on a stripe-by-stripe basis, wherein each stripe spans the plurality of dies and includes multiple types of pages.
2 . The SSD of claim 1 , wherein the multiple types of pages are to reduce a program time variability across the stripes.
3 . The SSD of claim 1 , wherein the multiple types of pages are to reduce an error susceptibility of the NAND memory.
4 . The SSD of claim 1 , wherein to program the NAND memory on the stripe-by-stripe basis, the logic is to:
reorder logical page addresses in a first die of the plurality of dies in accordance with a first configuration, and
reorder logical page addresses in a second die of the plurality of dies in accordance with a second configuration, wherein the first configuration is different from the second configuration.
5 . The SSD of claim 1 , wherein to program the NAND memory on the stripe-by-stripe basis, the logic is to:
start a first program operation in a first die of the plurality of dies at a first wordline position, and
start a second program operation in a second die of the plurality of dies at a second wordline position, wherein the first wordline position is different from the second wordline position, and wherein each stripe includes pages from multiple wordline locations.
6 . The SSD of claim 1 , wherein the logic is to:
prefill a first die in the plurality of dies is prefilled with dummy data to a first logical page address, and
prefill a second die in the plurality of dies is prefilled with dummy data to a second logical page address, wherein the first logical page address is different from the second logical page address, and wherein each stripe includes pages from multiple wordline locations.
7 . The SSD of claim 1 , wherein the multiple types of pages include two or more of an extra page, an upper page or a lower page.
8 . A semiconductor apparatus comprising:
one or more substrates; and
logic coupled to the one or more substrates, wherein the logic is implemented at least partly in one or more of configurable or fixed-functionality hardware, the logic to:
detect a request to program a NAND memory containing a plurality of dies; and
program the NAND memory on a stripe-by-stripe basis, wherein each stripe spans the plurality of dies and includes multiple types of pages.
9 . The semiconductor apparatus of claim 8 , wherein the multiple types of pages are to reduce a program time variability across the stripes.
10 . The semiconductor apparatus of claim 8 , wherein the multiple types of pages are to reduce an error susceptibility of the NAND memory.
11 . The semiconductor apparatus of claim 8 , wherein to program the NAND memory on the stripe-by-stripe basis, the logic is to:
reorder logical page addresses in a first die of the plurality of dies in accordance with a first configuration; and
reorder logical page addresses in a second die of the plurality of dies in accordance with a second configuration, wherein the first configuration is different from the second configuration.
12 . The semiconductor apparatus of claim 8 , wherein to program the NAND memory on the stripe-by-stripe basis, the logic is to:
start a first program operation in a first die of the plurality of dies at a first wordline position; and
start a second program operation in a second die of the plurality of dies at a second wordline position, wherein the first wordline position is different from the second wordline position, and wherein each stripe includes pages from multiple wordline locations.
13 . The semiconductor apparatus of claim 8 , wherein the logic is to:
prefill a first die in the plurality of dies with dummy data to a first logical page address; and
prefill a second die in the plurality of dies with dummy data to a second logical page address, wherein the first logical page address is different from the second logical page address, and wherein each stripe includes pages from multiple wordline locations.
14 . The semiconductor apparatus of claim 8 , wherein the multiple types of pages include two or more of an extra page, an upper page or a lower page.
15 . A method comprising:
detecting a request to program a NAND memory containing a plurality of dies; and
programming the NAND memory on a stripe-by-stripe basis, wherein each stripe spans the plurality of dies and includes multiple types of pages.
16 . The method of claim 15 , wherein the multiple types of pages reduce a program time variability across the stripes.
17 . The method of claim 15 , wherein the multiple types of pages reduce an error susceptibility of the NAND memory.
18 . The method of claim 15 , wherein programming the NAND memory on the stripe-by-stripe basis includes:
reordering logical page addresses in a first die of the plurality of dies in accordance with a first configuration; and
reordering logical page addresses in a second die of the plurality of dies in accordance with a second configuration, wherein the first configuration is different from the second configuration.
19 . The method of claim 15 , wherein programming the NAND memory on a stripe-by-stripe basis includes:
starting a first program operation in a first die of the plurality of dies at a first wordline position; and
starting a second program operation in a second die of the plurality of dies at a second wordline position, wherein the first wordline position is different from the second wordline position, and wherein each stripe includes pages from multiple wordline locations.
20 . The method of claim 15 , further including:
prefilling a first die in the plurality of dies with dummy data to a first logical page address; and
prefilling a second die in the plurality of dies with dummy data to a second logical page address, wherein the first logical page address is different from the second logical page address, and wherein each stripe includes pages from multiple wordline locations.