Methods and systems for inspecting integrated circuits based on X-rays

1. A method comprising, by an automated high-speed X-ray inspection system:

generating an X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample, wherein the X-ray image is a high-resolution grayscale image;

determining a first cross-sectional shape of a first portion of a first element of interest in the inspected sample, wherein the first cross-sectional shape is determined based on a plurality of grayscale values of the X-ray image associated with the first element of interest;

determining a second cross-sectional shape of a second portion of the first element of interest in the inspected sample, wherein the second cross-sectional shape is determined based on the plurality of grayscale values of the X-ray image associated with the first element of interest; and

determining one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.

2. The method of claim 1 , wherein the inspected sample is an integrated circuit package, and wherein the first element of interest is a solder bump of the integrated circuit package.

3. The method of claim 1 , wherein the first cross-sectional shape and the second cross-sectional shape are determined using an edge filter based on the plurality of grayscale values of the X-ray image associated with the first element of interest.

4. The method of claim 1 , wherein the first cross-sectional shape and the second cross-sectional shape are elliptical shapes or circular shapes, and wherein the first portion of the first element of interest corresponds to a first end of a solder bump and the second portion of the first element of interest corresponds to a second end of the solder bump.

5. The method of claim 1 , further comprising:

determining one or more crescent areas corresponding to one or more non-overlapping areas of the first cross-sectional shape and the second cross-sectional shape.

6. The method of claim 5 , further comprising:

determining an offset vector based on the one or more crescent areas, wherein the offset vector is associated with an offset distance and an offset direction of the second portion of the first element of interest with respect to the first portion of the first element of interest, and wherein the one or more first metrological parameters comprise the offset distance and the offset direction.

7. The method of claim 6 , further comprising:

determining a misalignment metric of a first layer of the inspected sample with respect to a second layer of the inspected sample based on the offset distance and the offset direction, wherein the first layer of the inspected sample is associated with the first portion of the first element of interest and the second layer of the inspected sample is associated with the second portion of the first element of interest.

8. The method of claim 1 , further comprising:

determining one or more second metrological parameters associated with a second element of interest in the inspected sample based a comparison of a third cross-sectional shape of a third portion of the second element of interest and a fourth cross-sectional shape of a fourth portion of the second element of interest.

9. The method of claim 8 , wherein the one or more first metrological parameters comprise first size parameters of the first cross-sectional shape and the second cross-sectional shape of the first element of interest, and wherein the one or more second metrological parameters comprise second size parameters of the third cross-sectional shape and the fourth cross-sectional shape of the second element of interest.

10. The method of claim 9 , further comprising:

determining a tilting angle of a first layer of the inspected sample with respect to a second layer of the inspected sample based on the first size parameters associated with the first element of interest and the second size parameters associated with the second element of interest.

11. The method of claim 9 , further comprising:

determining a layer-distance offset of a first layer of the inspected sample with respect to a second layer of the inspected sample based on the first size parameters associated with the first element of interest and the second size parameters associated with the second element of interest.

12. The method of claim 8 , further comprising:

determining a first offset vector for the first portion of the first element of interest with respect to the second portion of the first element of interest; and

determining a second offset vector for the third portion of the second element of interest with respect to the fourth portion of the second element of interest.

13. The method of claim 12 , further comprising:

determining a rotation angle of a first layer of the inspected sample with respect to a second layer of the inspected sample based on the first offset vector and the second offset vector, wherein the first layer of the inspected sample is associated with the first portion of the first element of interest and the third portion of the second element of interest, and wherein the second layer of the inspected sample is associated with the second portion of the first element of interest and the fourth portion of the second element of interest.

14. The method of claim 1 , further comprising:

generating a reference X-ray image for the inspected sample, wherein the one or more first metrological parameters of the element of interest are determined based on a comparison of the X-ray image of the inspected sample and the reference X-ray image.

15. The method of claim 14 , wherein the reference X-ray image is generated based on an average of X-ray images of a plurality of reference samples, and wherein the plurality of reference samples are the same type of samples to the inspected sample.

16. The method of claim 14 , wherein the reference X-ray image is generated based on a standard reference sample for the inspected sample.

17. The method of claim 14 , further comprising:

determining one or more residual patterns by subtracting the reference X-ray image from the X-ray image of the inspected sample, wherein the one or more first metrological parameters are determined based on the one or more residual patterns.

18. The method of claim 17 , wherein the one or more residual patterns comprise one or more crescent areas, and wherein the one or more crescent areas correspond to one or more non-overlapping areas of an image area in the X-ray image corresponding the first element of interest and a reference image area in the reference X-ray image corresponding to a reference element of interest.

19. One or more computer-readable non-transitory storage media embodying software that is operable when executed to:

generate an X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample, wherein the X-ray image is a high-resolution grayscale image;

determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample, wherein the first cross-sectional shape is determined based on a plurality of grayscale values of the X-ray image associated with the first element of interest;

determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample, wherein the second cross-sectional shape is determined based on the plurality of grayscale values of the X-ray image associated with the first element of interest; and

determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.

20. An automatic high-speed X-ray system comprising: one or more X-ray sensors; one or more processors; and one or more computer-readable non-transitory storage media coupled to one or more of the processors and comprising instructions operable when executed by one or more of the processors to cause the system to:

generate an X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample, wherein the X-ray image is a high-resolution grayscale image;

determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample, wherein the first cross-sectional shape is determined based on a plurality of grayscale values of the X-ray image associated with the first element of interest;

determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample, wherein the second cross-sectional shape is determined based on the plurality of grayscale values of the X-ray image associated with the first element of interest; and

determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.