Semiconductor device and method of manufacturing the same
In one embodiment, a semiconductor device includes a stacked film alternately including a plurality of electrode layers and a plurality of insulating layers, a charge storage layer provided on a side face of the stacked film via a first insulator, and a semiconductor layer provided on a side face of the charge storage layer via a second insulator. The device further includes a third insulator provided between an electrode layer and an insulating layer in the stacked film and between the electrode layer and the first insulator, and a first film provided between the third insulator and the insulating layer and/or between the third insulator and the first insulator, and including carbon, germanium, tin, aluminum, phosphorus or arsenic.
1. A semiconductor device comprising:
a stacked film alternately including a plurality of electrode layers and a plurality of insulating layers;
a charge storage layer provided on a side face of the stacked film via a first insulator;
a semiconductor layer provided on a side face of the charge storage layer via a second insulator;
a third insulator provided between an electrode layer and an insulating layer in the stacked film and between the electrode layer and the first insulator, the third insulator including a metal element; and
a first film including carbon, germanium, tin, aluminum, phosphorus, or arsenic, the first film not being provided between the third insulator and the insulating layer, and being provided between the third insulator and the first insulator,
wherein:
the device comprises, as the first film, a film continuously provided on side faces of the plurality of electrode layers and side faces of the plurality of insulating layers, or a plurality of films provided on the side faces of the plurality of electrode layers and isolated from one another,
a thickness of the first film is 1 to 7 nm,
a concentration of carbon, germanium, tin, aluminum, phosphorus, or arsenic included in the first film is 1 to 10 atomic %,
a thickness of the insulating layer is 10 to 40 nm, and
a total thickness of the electrode layer and the third insulator between the insulating layers is 10 to 40 nm.
2. A semiconductor device comprising:
a stacked film alternately including a plurality of electrode layers and a plurality of insulating layers;
a charge storage layer provided on a side face of the stacked film;
a semiconductor layer provided on a side face of the charge storage layer; and
a first film including carbon, the first film not being provided between an electrode layer and an insulating layer in the stacked film, and being provided between the electrode layer and the charge storage layer,
wherein:
the device comprises, as the first film, a film continuously provided on side faces of the plurality of electrode layers and side faces of the plurality of insulating layers, or a plurality of films provided on the side faces of the plurality of electrode layers and isolated from one another,
a thickness of the first film is 1 to 7 nm,
a concentration of carbon, germanium, tin, aluminum, phosphorus, or arsenic included in the first film is 1 to 10 atomic %,
a thickness of the insulating layer is 10 to 40 nm.
3. The device of claim 2 , wherein the first film includes silicon and carbon.
4. The device of claim 2 , wherein the first film includes an SiCN film, an SiOC film, or an SiOCN film, where N denotes nitrogen and O denotes oxygen.