Layout method of a chip and electronic equipment
A layout method of a chip includes: determining a logic diagram corresponding to a chip to be laid out and a device list corresponding to the logic diagram; and determining a layout diagram of the chip to be laid out, according to the logic diagram, the device list, and a pre-trained layout mode. The layout diagram includes at least an arrangement position, in the chip to be laid out, of each device in the device list.
1. A layout method of a chip, comprising:
determining a logic diagram corresponding to a chip to be laid out and a device list corresponding to the logic diagram; and
determining a layout diagram of the chip to be laid out, according to the logic diagram, the device list, and a pre-trained layout model;
wherein the layout diagram includes at least an arrangement position, in the chip to be laid out, of each device in the device list,
wherein the determining the layout diagram of the chip to be laid out. according to the logic diagram, the device list, and the pre-trained layout model includes:
obtaining first attribute data of the chip to be laid out, second attribute data of each device in the device list, and wiring rules; and
determining the layout diagram of the chip to be laid out, according to the pre- trained layout model, the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules,
wherein the first attribute data includes at least an area of the chip to be laid out;
second attribute data of a device includes at least power consumption of the device, performance of the device, and a size of the device; and
the wiring rules includes at least a wiring density, an interconnection principle, and a non-crossing principle.
2. The method according to claim 1 , wherein the determining the layout diagram of the chip to be laid out, according to the pre-trained layout model, the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules includes:
inputting the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules into the pre-trained layout model, and running the pre-trained layout model to obtain the arrangement position of each device in the chip to be laid out; and
determining the layout diagram, according to the arrangement position of each device in the chip to be laid out.
3. The method according to claim 1 , before the determining the layout diagram of the chip to be laid out, according to the logic diagram, the device list, and the pre-trained layout model, the method further comprising:
obtaining K sample logic diagrams, K sample device lists that are corresponding to the K sample logic diagrams respectively, and K sample layout diagrams that are corresponding to the K sample logic diagrams respectively; and
training a preset initial layout model with the K sample logic diagrams, the K sample device lists, and the K sample layout diagrams to obtain a layout model, wherein the lay out model is the pre-trained layout model.
4. The method according to claim 3 , wherein the training the preset initial layout model with the K sample logic diagrams, the K sample device lists, and the K sample layout diagrams to obtain the layout model includes:
for each of the K sample logic diagrams,
determining an operation type of each sample operation in the sample logic diagram, input or output of each sample operation, and corresponding devices of each sample operation;
obtaining a sample device sub-list corresponding to each type of samples operation, according to the operation type and the corresponding device of each sample operation;
for each sample operation in the sample logic diagram, determining cascade information of the sample operation, according to the operation type of the sample operation, the input or output of the sample operation, and a sample device sub-list corresponding to a type of sample operations to which the sample operation belongs; and
determining a training layout diagram corresponding to the sample logic diagram, according to the cascade information of each sample operation in the sample logic diagram and a layout model of previous training iteration;
calculating a training error, according to K training layout diagrams that are corresponding to the K sample logic diagrams respectively, and the K sample layout diagrams;
in response to the training error being greater than a preset error, adjusting the layout model of the previous training iteration to obtain a layout model of current training iteration, the layout model of current training iteration being used in next training iteration; and
performing a plurality of training iterations until a training error obtained in a training iteration is less than or equal to the preset error, a layout model of a previous training iteration of the training iteration being the pre-trained layout model.
5. The method according to claim 4 , wherein the adjusting the layout model of the previous training iteration to obtain the layout model of the current training iteration includes:
adjusting model parameters of the layout model of the previous training iteration with a preset formula, so as to obtain the layout model of the current training iteration; and
the preset formula includes:
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where K is a number of the sample logic diagrams; r(P i ) is a sample layout duration of a layout based on an i-th sample logic diagram; B is a time baseline of the i-th sample logic diagram; and u is input or output of a sample operation in the i-th sample logic diagram.
6. The method according to claim 1 , further comprising:
determining a layout duration corresponding to the chip to be laid out;
in a case where a difference between the layout duration and a time baseline of the logic diagram is greater than a preset threshold, obtaining a plurality of historical layout durations; and
updating model parameters of the layout model, according to the plurality of historical layout durations.
7. An electronic equipment, comprising:
at least one processor, a memory, and computer instructions stored in the memory and executable on the at least one processor, wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to perform;
determining a logic diagram corresponding to a chip to be laid out and a device list corresponding to the logic diagram;
obtaining first attribute data of the chip to be laid out, second attribute data of each device in the device list, and wiring rules; and
determining a layout diagram of the chip to be laid out, according to a pre-trained layout model, the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules,
wherein the layout diagram includes at least an arrangement position, in the chip to be laid out, of each device in the device list; the first attribute data includes at least an area of the chip to be laid out; second attribute data of a device includes at least power consumption of the device, performance of the device, and a size of the device; and the wiring rules includes at least a wiring density. an interconnection principle, and a non-crossing principle.
8. The electronic equipment according to claim 7 , wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to perform;
inputting the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules into the pre-trained layout model, and running the pre-trained layout model to obtain the arrangement position of each device in the chip to be laid out; and
determining the layout diagram, according to the arrangement position of each device in the chip to be laid out.
9. The electronic equipment according to claim 7 , wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to further perform:
obtaining K sample logic diagrams, K sample device lists that are corresponding to the K sample logic diagrams respectively, and K sample layout diagrams that are corresponding to the K sample logic diagrams respectively; and
training a preset initial layout model with the K sample logic diagrams, the K sample device lists, and the K sample layout diagrams to obtain a layout model, wherein the lay out model is the pre-trained layout model.
10. The electronic equipment according to claim 9 , wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to perform:
for each of the K sample logic diagrams,
determining an operation type of each sample operation in the sample logic diagram, input or output of each sample operation, and corresponding devices of each sample operation;
obtaining a sample device sub-list corresponding to each type of samples operation, according to the operation type and the corresponding devices of each sample operation;
for each sample operation in the sample logic diagram, determining cascade information of the sample operation, according to the operation type of the sample operation, the input or output of the sample operation, and a sample device sub-list corresponding to a type of sample operation to which the sample operation belongs; and
determining a training layout diagram corresponding to the sample logic diagram, according to the cascade information of each sample operation in the sample logic diagram and a layout model of previous training iteration;
calculating a training error, according to K training layout diagrams that are corresponding to the K sample logic diagrams respectively, and the K sample layout diagrams;
in response to the training error being greater than a preset error, adjusting the layout model of the previous training iteration to obtain a layout model of current training iteration, the layout model of current training iteration being used in next training iteration; and
performing a plurality of training iterations until a training error obtained in a training iteration is less than or equal to the preset error, a layout model of a previous training iteration of the training iteration being the pre-trained layout model.
11. The electronic equipment according to claim 10 , wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to perform:
adjusting model parameters of the layout model of the previous training iteration with a preset formula, so as to obtain the layout model of the current training iteration; and
the preset formula includes:
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u
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K
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K
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u
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where K is a number of the sample logic diagrams; r(P i ) is a sample layout duration of a layout based on an i-th sample logic diagram; B is a time baseline of the i-th sample logic diagram; and
u is input or output of a sample operation in the i-th sample logic diagram.
12. The electronic equipment according to claim 7 , wherein the computer instructions, when executed by the at least one processor, cause the at least one processor to further perform:
determining a layout duration corresponding to the chip to be laid out;
in a case where a difference between the layout duration and a time baseline of the logic diagram is greater than a preset threshold, obtaining a plurality of historical layout durations, and
updating model parameters of the layout model, according to the plurality of historical layout durations.
13. A non-transitory computer-readable storage medium, storing thereon one or more computer programs, wherein the one or more computer programs include computer instructions that, when executed by a processor, cause the processor to perform;
determining a logic diagram corresponding to a chip to be laid out and a device list corresponding to the logic diagram;
obtaining first attribute data of the chip to be laid out, second attribute data of each device in the device list, and wiring rules; and
determining a layout diagram of the chip to be laid out, according to a pre-trained layout model, the logic diagram, the device list, the first attribute data, the second attribute data, and the wiring rules,
wherein the layout diagram includes at least an arrangement position. in the chip to be laid out, of each device in the device list; the first attribute data includes at least an area of the chip to be laid out; second attribute data of a device includes at least power consumption of the device, performance of the device, and a size of the device; and the wiring rules includes at least a wiring density, an interconnection principle, and a non-crossing principle.