Semiconductor device and manufacturing method thereof
View Patent ↗A method includes forming a first multilayer interconnection structure over a carrier substrate. A first interlayer dielectric (ILD) layer is deposited over the first multilayer interconnection structure. A first source/drain contact is formed in the first ILD layer. After forming the first source/drain contact, a semiconductive layer is formed over the first source/drain contact and the first ILD layer. The semiconductive layer is patterned to form a semiconductor fin over the first source/drain contact. A gate structure is formed across the semiconductor fin. The semiconductor fin is patterned to form a first recess and a second recess in the semiconductor fin, such that the first recess exposes the first source/drain contact. First and second source/drain epitaxial structures are respectively formed in the first and second recesses of the semiconductor fin such that the first source/drain epitaxial structure is electrically connected to the first source/drain contact.
1. A method comprising:
forming a first multilayer interconnection structure over a carrier substrate;
depositing a first interlayer dielectric (ILD) layer over the first multilayer interconnection structure;
forming a first source/drain contact in the first ILD layer;
after forming the first source/drain contact, forming a semiconductive layer over the first source/drain contact and the first ILD layer;
patterning the semiconductive layer to form a semiconductor fin over the first source/drain contact;
forming a gate structure across the semiconductor fin;
patterning the semiconductor fin to form a first recess and a second recess in the semiconductor fin, such that the first recess exposes the first source/drain contact; and
forming first and second source/drain epitaxial structures respectively in the first and second recesses of the semiconductor fin such that the first source/drain epitaxial structure is electrically connected to the first source/drain contact.
2. The method of claim 1 , wherein forming the first source/drain contact in the first ILD layer comprises:
patterning the first ILD layer to form an opening in the first ILD layer, such that the opening exposes a metal line of the first multilayer interconnection structure; and
filling the opening with a conductive material to form the first source/drain contact.
3. The method of claim 1 , wherein forming the semiconductive layer comprises:
bonding the semiconductive layer to the first ILD layer such that the semiconductive layer is in contact with the first source/drain contact; and
after bonding the semiconductive layer, thinning down the semiconductive layer.
4. The method of claim 1 , further comprising forming a second ILD layer over the first and second source/drain epitaxial structures and the gate structure.
5. The method of claim 4 , further comprising forming a second source/drain via in the second ILD layer and electrically connected to the second source/drain epitaxial structure.
6. The method of claim 5 , wherein forming the second source/drain via is such that both the second source/drain via and the first source/drain contact taper downward.
7. The method of claim 1 , further comprising forming a second multilayer interconnection structure over the gate structure after forming the first source/drain contact.
8. The method of claim 7 , wherein forming the second multilayer interconnection structure is such that both a metal line of the second multilayer interconnection structure and a metal line of the first multilayer interconnection structure taper downward.
9. A method comprising:
forming a first multilayer interconnection structure over a carrier substrate;
depositing a first interlayer dielectric (ILD) layer over the first multilayer interconnection structure;
forming a first source/drain contact in the first ILD layer;
after forming the first source/drain contact, forming a semiconductive layer over the first source/drain contact and the first ILD layer;
patterning the semiconductive layer to form a semiconductor fin over the first source/drain contact;
forming a dummy gate structure over the semiconductor fin;
forming first and second source/drain epitaxial structures in the semiconductor fin on opposite sides of the dummy gate structure, wherein the first source/drain epitaxial structure is connected to the first source/drain contact;
replacing the dummy gate structure by a gate structure between the first and second source/drain epitaxial structures; and
forming a second source/drain contact over the second source/drain epitaxial structure;
forming a second ILD layer over the second source/drain contact; and
forming a source/drain via in the second ILD layer and electrically connected to the second source/drain epitaxial structure.
10. The method of claim 9 , wherein forming the first source/drain contact in the first ILD layer comprises:
patterning the first ILD layer to form an opening in the first ILD layer, such that the opening exposes a metal line of the first multilayer interconnection structure; and
filling the opening with a conductive material to form the first source/drain contact.
11. The method of claim 9 , wherein forming the semiconductive layer comprises:
bonding the semiconductive layer to the first ILD layer such that the semiconductive layer is in contact with the first source/drain contact; and
after bonding the semiconductive layer, thinning down the semiconductive layer.
12. The method of claim 9 , wherein forming the source/drain via is such that both the source/drain via and the first source/drain contact taper downward.
13. The method of claim 9 , wherein forming the second source/drain contact is such that the second source/drain contact tapers downward.
14. The method of claim 9 , further comprising forming a second multilayer interconnection structure over the gate structure and the first and second source/drain epitaxial structures.
15. The method of claim 14 , wherein forming the second multilayer interconnection structure is such that both a metal line of the second multilayer interconnection structure and a metal line of the first multilayer interconnection structure taper downward.
16. A method, comprising:
forming a first multilayer interconnection structure over a carrier substrate, wherein the first multilayer interconnection structure comprises a conductive line taper downward;
depositing a first interlayer dielectric (ILD) layer over the first multilayer interconnection structure;
forming a first source/drain contact in the first ILD layer;
after forming the first source/drain contact, forming a semiconductive layer over the first source/drain contact and the first ILD layer;
patterning the semiconductive layer to form a semiconductor fin over the first source/drain contact;
forming first and second source/drain epitaxial structures in the semiconductor fin, wherein the first source/drain epitaxial structure electrically connected to the first source/drain contact;
forming a gate structure across the semiconductor fin and between the first and second source/drain epitaxial structures; and
forming a second multilayer interconnection structure over the gate structure, electrically connected to the second source/drain epitaxial structure, and comprising a conductive line taper downward.
17. The method of claim 16 , wherein the first source/drain contact interconnects the conductive line of the first multilayer interconnection structure and the first source/drain epitaxial structure.
18. The method of claim 16 , wherein the first source/drain contact tapers downward.
19. The method of claim 16 , further comprising:
forming a second ILD layer over the first and second source/drain epitaxial structures and the gate structure.
20. The method of claim 16 , further comprising:
forming an isolation structure adjacent the semiconductor fin.