Method of coating a printed circuit board with a viscoelastic or non-Newtonian coating
A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.
1. A method of coating an assembled printed circuit board with a conformal coating, the method comprising:
applying the conformal coating to the assembled printed circuit board,
wherein the conformal coating is hydrophobic and electrically insulating, exhibits viscoelastic or non-Newtonian properties and comprises a composition of:
at least one hydrophobic fluid; and
one or more functionalized polysiloxanes, linear and cyclic silicones, styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene materials swelled with mineral oils or diesters, long chain fatty alcohols, functionalized or non-functionalized poly oligomeric silsesquioxanes, and polyolefins.
2. The method of claim 1 , wherein the conformal coating is applied to a part of or the entirety of at least one side of the assembled printed circuit board without masking a component on the assembled printed circuit board.
3. The method of claim 2 , wherein the conformal coating covers at least one male connector, female connector or both connectors on the assembled printed circuit board without adversely affecting the electrical properties of the assembled printed circuit board.
4. The method of claim 1 , wherein the composition further comprises one or more metal oxides, fumed functionalized silica, fluoropolymer particles, clay particles, mica, metal alkoxide particles, rare earth and transition metals, carbon-based materials selected from graphene, graphite, and carbon nanotubes, and metal organic frameworks.
5. The method of claim 1 , wherein the composition further comprises one or more surfactant, dispersant, hygroscopic material or rheologic modifier.
6. The method of claim 1 , wherein the composition is suspended in a carrier solvent, the carrier solvent comprising at least one or more low molecular weight mineral oils, paraffins or iso-paraffins, alkanes or iso-alkanes, low molecular weight linear silicones or cyclic silicones, alkyl acetates, ketones, fully or partially halogenated hydrocarbons, or aldehydes.
7. The method of claim 1 , wherein the conformal coating has a thickness ranging from 25 nm to 200 μm.
8. The method of claim 1 , wherein applying the conformal coating is performed by at least one method chosen from atomized or non-atomized spraying, dip coating, film coating, jetting, and needle dispensing.
9. The method of claim 8 , wherein the conformal coating is applied with a needle.
10. The method of claim 9 , wherein the needle has a gauge size ranging from 10 to 32.
11. The method of claim 9 , wherein the needle has a gauge size ranging from 16 to 20.
12. The method of claim 8 , wherein the conformal coating is applied by using compressed air or nitrogen to atomize the coating.
13. The method of claim 1 , wherein the conformal coating is able to redistribute after being applied to the printed circuit board.
14. The method of claim 1 , wherein the conformal coating protects the circuit board from at least one liquid or particulate contaminant.
15. The method of claim 14 , wherein the liquid contaminant comprises water, bodily fluids, or combinations thereof.
16. The method of claim 1 , wherein the conformal coating is applied to a part of or the entirety of at least one side of the assembled printed circuit board.
17. A method of protecting an assembled printed circuit from liquid and/or particulate contaminants, the method comprising:
applying to the assembled printed circuit board a conformal coating comprising a composition of:
at least one hydrophobic fluid; and
one or more functionalized polysiloxanes, linear and cyclic silicones, styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene materials swelled with mineral oils or diesters, long chain fatty alcohols, functionalized or non-functionalized poly oligomeric silsesquioxanes, and polyolefins,
wherein the conformal coating is hydrophobic, electrically insulating, and exhibits viscoelastic or non-Newtonian properties.
18. The method of claim 17 , wherein the conformal coating has a thickness ranging from 25 nm to 200 μm, and is applied by at least one method chosen from atomized or non-atomized spraying, dip coating, film coating, jetting, and needle dispensing.
19. The method of claim 17 , wherein the composition further comprises:
one or more particles selected from metal oxides, fumed functionalized silica, fluoropolymer particles, clay particles, mica, metal alkoxide particles, rare earth and transition metals, carbon-based materials selected from graphene, graphite, and carbon nanotubes, and metal organic frameworks; or
one or more surfactant, dispersant, hygroscopic material or rheologic modifier,
wherein said composition is suspended in a carrier solvent carrier, the carrier solvent carrier comprising at least one or more low molecular weight mineral oils, paraffins or iso-paraffins, alkanes or iso-alkanes, low molecular weight linear silicones or cyclic silicones, alkyl acetates, ketones, fully or partially halogenated hydrocarbons, or aldehydes.