IP Library Granted Patent US 11,765,477
Granted Patent B2
US 11,765,477 · App. 17/403,457 · Granted Sep 19, 2023

Apparatus for wavelength conversion using layers of different photoelectric conversion materials for detecting visible and infared light simultaneously

Inventor: Atsushi Toda (Kanagawa, JP)
Assignee: SONY GROUP CORPORATION
H04N25/705G01S7/4816G01S17/86G01S17/931G02B5/201G02B5/208G02B5/26G02B5/281H01L24/29H01L24/32H01L27/14629H01L27/14634H01L27/14636H01L27/14647H01L27/14652H01L27/14685H04N23/11H01L27/1464H01L27/1469H01L27/14689H01L2224/2908H01L2224/29188H01L2224/30505H01L2224/32145H01L2924/05042H01L2924/05341H01L2924/05442
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Quick Facts
Patent No.
US 11,765,477
App. No.
17/403,457
Granted
Sep 19, 2023
Kind
B2
Abstract

There is provided an imaging device, an electronic apparatus including an imaging device, and an automotive vehicle including an electronic apparatus including an imaging device, including: a first substrate including a first set of photoelectric conversion units; a second substrate including a second set of photoelectric conversion units; and an insulating layer between the first substrate and the second substrate; where the insulating layer has a capability to reflect a first wavelength range of light and transmit a second wavelength range of light that is longer than the first wavelength range of light.

Claims (55)

1. An imaging device, comprising:

a semiconductor layer;

a plurality of pixels;

a first pixel unit that converts light of a first wavelength range into a first charge;

a second pixel unit that converts light of a second wavelength range into a second charge; and

a layer,

wherein the first wavelength range includes a shorter wavelength than the second wavelength range,

wherein the layer is formed between the first pixel unit and the second pixel unit in a depth direction,

wherein the layer allows the light of the second wavelength range to transmit through,

wherein a first photoelectric conversion material used in the first pixel unit and a second photoelectric conversion material used in the second pixel unit are different from each other,

wherein the first pixel unit comprises a single section shared among the plurality of pixels,

wherein the second pixel unit comprises a plurality of sections that are electrically separated,

wherein each section of the plurality of sections corresponds to a pixel of the plurality of pixels, and

wherein an electrical connection of the first pixel unit to the semiconductor layer is electrically separate from an electrical connection of the second pixel unit to the semiconductor layer.

2. The imaging device according to claim 1 , further comprising:

a first wiring layer between the first pixel unit and the layer in the depth direction; and

a second wiring layer under the second pixel unit in the depth direction.

3. The imaging device according to claim 2 , wherein the first wiring layer includes a first wire electrically connected with a second wire of the second wiring layer by a through electrode.

4. The imaging device according to claim 2 , further comprising:

an optical filter on top of the first pixel unit in the depth direction.

5. The imaging device according to claim 2 , wherein the semiconductor layer is disposed under the second wiring layer in the depth direction.

6. The imaging device according to claim 1 , wherein the layer comprises a multilayer film.

7. The imaging device according to claim 1 , wherein the light of the first wavelength range comprises visible light, and wherein the light of the second wavelength range comprises infrared light.

8. The imaging device according to claim 1 , further comprising:

at least one of a logic circuit and a memory circuit.

9. The imaging device according to claim 1 , further comprising:

a control unit that controls an overall drive state of the imaging device.

10. The imaging device according to claim 1 , wherein the first pixel unit is formed so as to extend under a plurality of light collection structural elements.

11. The imaging device according to claim 10 , wherein the plurality of light collection structural elements are on chip lenses.

12. The imaging device according to claim 1 , further comprising:

a plurality of color filters formed above the first pixel unit, wherein the second pixel unit is formed so as to extend under the plurality of color filters.

13. An electronic apparatus, comprising:

an imaging device, comprising:

a semiconductor layer;

a plurality of pixels;

a first pixel unit that converts light of a first wavelength range into a first charge;

a second pixel unit that converts light of a second wavelength range into a second charge; and

a layer,

wherein the first wavelength range includes a shorter wavelength than the second wavelength range,

wherein the layer is formed between the first pixel unit and the second pixel unit in a depth direction,

wherein the layer allows the light of the second wavelength range to transmit through,

wherein a first photoelectric conversion material used in the first pixel unit and a second photoelectric conversion material used in the second pixel unit are different from each other,

wherein the first pixel unit comprises a single section shared among the plurality of pixels,

wherein the second pixel unit comprises a plurality of sections that are electrically separated,

wherein each section of the plurality of sections corresponds to a pixel of the plurality of pixels, and

wherein an electrical connection of the first pixel unit to the semiconductor layer is electrically separate from an electrical connection of the second pixel unit to the semiconductor layer.

14. The electronic apparatus according to claim 13 , wherein at least two second pixel units correspond to one first pixel unit.

15. The electronic apparatus according to claim 13 , further comprising:

a first wiring layer between the first pixel unit and the layer in the depth direction; and

a second wiring layer under the second pixel unit in the depth direction.

16. The electronic apparatus according to claim 15 , wherein the first wiring layer includes a first wire electrically connected with a second wire of the second wiring layer by a through electrode.

17. The electronic apparatus according to claim 15 , wherein the semiconductor layer is disposed under the second wiring layer in the depth direction.

18. The electronic apparatus according to claim 13 , wherein the layer comprises a multilayer film.

19. The electronic apparatus according to claim 13 , further comprising:

an optical filter on top of the first pixel unit in the depth direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2021
From: TODA, ATSUSHI
To: SONY CORPORATION
Reel/Frame 057194/0245 →
CHANGE OF NAME Recorded Aug 16, 2021
From: SONY CORPORATION
To: SONY GROUP CORPORATION
Reel/Frame 057291/0076 →
Priority Claims (1)
JP 2015-244083 · Dec 15, 2015 · national
Continuity (3)
Continuation 16845964 · Apr 10, 2020
Continuation 16060106
Related Publication 20210377471A1 · Dec 2, 2021