Micro-transfer-printed acoustic wave filter device
A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
1. A heterogeneous device, comprising:
a first substrate comprising a first material;
an active first circuit formed in or on the first substrate, the active first circuit comprising one or more first connection pads connected to the active first circuit for providing signals to the active first circuit or receiving signals from the active first circuit;
a second substrate separate, distinct, and independent from the first substrate, the second substrate comprising a second material different from the first material, and the second substrate directly or indirectly micro-transfer printed on the first substrate;
two or more electrodes or a second circuit formed in or on the second substrate, the two or more electrodes or second circuit comprising one or more second connection pads connected to the two or more electrodes or second circuit for providing signals to the electrodes or receiving signals from the two or more electrodes; and
one or more electrical conductors electrically connecting one or more of the first connection pads to one or more of the second connection pads.
2. The heterogeneous device of claim 1 , comprising a plurality of electrode pairs or second circuits formed on or in the second substrate wherein the first connection pads are electrically connected to the second connection pads of the plurality of electrode pairs or second circuits with the one or more electrical conductors.
3. The heterogeneous device of claim 1 , comprising a plurality of the separate, distinct, and independent second substrates micro-transfer printed on the first substrate wherein the first connection pads are connected to the second connection pads with the one or more electrical conductors.
4. The heterogeneous device of claim 1 , wherein the second substrate is micro-transfer printed directly or indirectly on the first circuit formed on or in the first substrate.
5. The heterogeneous device of claim 1 , wherein the first circuit is located at least partially between the second substrate and at least portions of the first substrate.
6. The heterogeneous device of claim 1 , wherein the second substrate is adhered to the first substrate with a layer of adhesive.
7. The heterogeneous device of claim 1 , wherein the second substrate includes at least a portion of a tether.
8. The heterogeneous device of claim 1 , wherein the second substrate is crystalline, a semiconductor, a crystalline semiconductor, or a ceramic.
9. The compound acoustic wave filter device of claim 1 , wherein the first substrate has a length or breadth dimension of less than or equal to 1 mm.
10. The heterogeneous device of claim 9 , wherein the heterogeneous device is a surface mount device.
11. The heterogeneous device of claim 1 , wherein the first substrate or the second substrate has a width from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm, the first substrate or the second substrate has a length from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm, or the first substrate or the second substrate has a height from 2 to 5 μm, 4 to 10 μm, 10 to 20 μm, or 20 to 50 μm.
12. The heterogeneous device of claim 1 , wherein the second connection pads are electrically conductive protrusions or spikes extending from the second substrate in electrical contact with the first connection pads and constitute the one or more electrical conductors.
13. The heterogeneous device of claim 1 , wherein the heterogeneous device is a surface-mount device.
14. A method of making a heterogeneous device, comprising:
providing a first substrate with an active first circuit formed in or on the first substrate, the first circuit comprising one or more first connection pads connected to the first circuit for providing signals to the first circuit or receiving signals from the first circuit;
providing a second substrate separate, distinct, and independent from the first substrate, two or more electrodes or a second circuit formed in or on the second substrate, and two or more second connection pads connected to the two or more electrodes or second circuit for providing signals to or receiving signals from the two or more electrodes or second circuit;
directly or indirectly micro-transfer printing the second substrate on the first substrate; and
electrically connecting one or more of the first connection pads to one or more of the second connection pads.
15. The method of claim 14 , comprising:
providing a plurality of electrode pairs or second circuits on the second substrate; and
electrically connecting one or more of the second connection pads of each of the second circuits to one or more of the first connection pads.
16. The method of claim 14 , comprising:
providing a plurality of second substrates;
mounting the second substrates on the first substrate; and
electrically connecting one or more of the second connection pads of each of the second substrates to one or more of the first connection pads.
17. The method of claim 14 , wherein the second connection pads are electrically conductive protrusions or spikes extending from the second substrate, and comprising pressing the electrically conductive protrusions or spikes against or into the first connection pads to form an electrical connection between the second circuit and the first circuit so that the electrically conductive protrusions or spikes form the one or more electrical conductors.
18. The method of claim 14 , wherein the second substrate is micro-transfer printed directly or indirectly onto the first circuit formed on or in the first substrate.
19. The method of claim 14 , wherein the first circuit is located at least partially between the second substrate and at least portions of the first substrate.
20. The method of claim 14 , wherein the second substrate comprises at least a portion of a tether.
21. The method of claim 14 , wherein the first substrate or the second substrate has a width from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm, the first substrate or the second substrate has a length from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm, or the first substrate or the second substrate has a height from 2 to 5 μm, 4 to 10 μm, 10 to 20 μm, or 20 to 50 μm.
22. The method of claim 14 , wherein the heterogeneous device is a surface-mount device.