Thermal interface materials
A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
1. A thermal interface material comprising:
a sheet extending between a first major surface and a second major surface, the sheet comprising a mixture of:
a base material comprises thermoplastic material and is a self-supporting flexible layer selected for encouraging migration of filler material dispersed therein into a desired orientation; and wherein the filler material is at least fifty percent by weight of the sheet, the filler material dispersed in the base material, the filler material comprising anisotropically oriented thermally conductive elements;
wherein the anisotropically oriented thermally conductive elements are oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction;
wherein the base material is substantially free of silicone;
wherein the sheet comprises a slice separated from a stack of a plurality of layers of base material compressed together; each of the layers is embedded with the filler material, and wherein the filler material in each layer comprises anisotropically oriented thermally conductive elements and the orientation of the slice during separation from the stack is such that the thermally conductive elements are oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction and the sheet comprises a region proximal the first major surface or second major surface of the sheet, said region containing a subset of the anisotropically oriented thermally conductive elements of the filler material that are less anisotropically oriented than the anisotropically oriented thermally conductive elements located more distal to said surface.
2. The thermal interface material of claim 1 , wherein the sheet exhibits self-healing properties.
3. The thermal interface material of claim 1 , wherein the base material comprises at least one of acrylic rubber, acrylic resin, epoxy resin, a thermoplastic fluorocarbon and fluorine resin.
4. The thermal interface material of claim 1 , wherein the base material comprises at least one of: poly (2-ethylhexyl acrylate), 2-ethylhexyl acrylate-acrylic acid copolymer, a polymethacrylic acid or its ester, an acrylic resin, a polyacrylic acid or its ester; silicone resins; fluororesins; polyethylene; polypropylene; ethylene-propylene copolymer; polymethylpentene; polyvinyl chloride; polyvinyl acetate; ethylene-vinyl acetate copolymer; polyvinyl alcohol; polyacetal; polyethylene terephthalate; polyethylene; polystyrene; polyacrylonitrile; -styrene acrylonitrile copolymer; acrylonitrile-butadiene-styrene resin; styrene butadiene block copolymer; hydrogenated product of styrene butadiene block copolymer; styrene-isoprene block copolymer; hydrogenated product of styrene-isoprene block copolymer; polyphenylene ether; modified polyphenylene ether; aliphatic polyamide; and aromatic polyamides; polyamide; polycarbonate; polyphenylene sulfide; polysulfone; polyethersulfone; polyethernitrile; polyetherketones; polyketone; polyurethane; liquid crystal polymer; ionomers; and combinations thereof.
5. The thermal interface material of claim 1 , wherein the base material comprises at least one of: vinylidene fluoride, tetrafluoroethylene-propylene, fluorine-containing polymerizable monomer, an elastomer resulting from fluorine-containing polymerizable monomer; a poly-tetrafluoroethylene, a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, ethylene-copolymer, tetrafluoroethylene-copolymer, polyvinylfluoride, tetrafluoroethylene-propylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, acrylic-modified polytetrafluoroethylene, polytetrafluoroethylene modified ester, epoxy-modified silane-modified polytetrafluoroethylene and polytetrafluoroethylene.
6. The thermal interface material of claim 1 , wherein the base material comprises at least one of: natural rubber; acrylate rubber; butadiene rubber; isoprene rubber; nitrile rubber; hydrogenated nitrile rubber; chloroprene rubber; ethylene-propylene rubber; chlorinated polyethylene; chlorosulfonated polyethylene; butyl rubber; halogenated butyl rubber; polyisobutylene rubber; polyacrylic rubber; epoxy resin; a polyimide resin; a bismaleimide resin; benzocyclobutene resin; a phenol resin; unsaturated polyester; a diallyl phthalate resin; a polyimide resin; a polyurethane; a thermosetting polyphenylene ether; and thermosetting polyphenylene ether.
7. The thermal interface material of claim 1 , wherein the base material comprises at least one of: poly(vinyl acetate) (PVA); poly(ethenyl ethanoate) (PVAc); and a soy-oil base material.
8. The thermal interface material of claim 1 , wherein the base material is at least partially dissolved in a solvent when the filler material is dispersed therein.
9. The thermal interface material of claim 8 , wherein the solvent comprises isopropyl alcohol.
10. The thermal interface material of claim 1 , wherein the filler material comprises at least one of: carbon nanotubes, bundles of carbon nanotubes, agglomerates of aligned carbon nanotubes; ceramic flake; nano-horns, nano-onions, carbon black, fullerene, graphene and oxidized graphene.
11. The thermal interface material of claim 1 , wherein the filler material comprises at least one of: metal nano-particles, metal oxide nano-particles, and a thermally conductive polymer.
12. The thermal interface material of claim 1 , wherein the filler material comprises at least one of: graphite, boron nitride, boron nitride flakes, boron nitride nano-scrolls, aluminum nitride, aluminum nitride whiskers, carbon nanotubes, metal particles, metal oxide particles.
13. The thermal interface material of claim 1 , wherein the filler material further comprises a distribution of at least one of microscale particles and flakes, wherein the distribution comprises elements that exhibit at least one dimension in the range of about 0.1 microns up to 200 microns.
14. The thermal interface material of claim 1 , wherein the thermal conductivity is at least 40 W/mK.
15. The thermal interface material of claim 1 , wherein the thermal conductivity is at least 70 W/mK.
16. The thermal interface material of claim 1 , wherein the sheet further comprises at least one other thermally conductive element in thermal communication between and exposed at the first major surface and the second major surface.
17. The thermal interface material of claim 16 , wherein the at least one other thermally conductive element comprises one of a sheet, a strip and a pillar.
18. The thermal interface material of claim 16 , wherein the at least one other thermally conductive element comprises at least one of carbon, graphite and graphene.