Light emitting device with reflector
This application describes a light emitting device or an assembly of light emitting devices. In the completed light emitting device, a distributed Bragg reflector minimizes the possibility of disturbing adjacent light emitting devices. Methods to fabricate such devices and assemblies of devices are also described.
1. A method to form a light emitting device comprising the steps of:
providing a light emitting diode (LED) having an LED top surface, an LED bottom surface, and a plurality of LED sidewalls, wherein the plurality of LED sidewalls are substantially orthogonal to the LED top surface and the LED bottom surface, and wherein each LED sidewall is contiguous with at least the LED top surface or the LED bottom surface;
providing a dielectric layer on the LED sidewalls;
forming a trench in the dielectric layer, wherein the trench has trench sidewalls and a trench bottom, wherein the trench sidewalls are substantially parallel to the plurality of LED sidewalls;
forming a first distributed Bragg reflector (DBR) in the trench, wherein the first DBR comprises a plurality of layers, and wherein the plurality of layers conformally coat the trench sidewalls and trench bottom; and
providing a first transistor, a second transistor, and a capacitor, wherein the first transistor, the second transistor, and capacitor underlie the LED, wherein the first transistor and second transistor comprise single crystal semiconductor, and wherein the longest dimension of the capacitor is substantially orthogonal to the LED bottom surface.
2. The method of claim 1 wherein the LED comprises gallium nitride, indium gallium nitride, indium arsenide, aluminum gallium arsenide, gallium arsenide, gallium phosphide, gallium arsenide phosphide, aluminum indium gallium phosphide, gallium arsenide nitride, aluminum indium arsenide, aluminum antimonide, indium phosphide, indium antimonide, or indium gallium arsenide phosphide, and combinations thereof.
3. The method of claim 1 further comprising the step of forming a wavelength-converting layer (W-CL) overlying the LED.
4. The method of claim 1 further comprising the step of providing a second DBR underlying the LED, wherein the second DBR has a second DBR first surface and a second DBR second surface, wherein the second DBR first and second surfaces are substantially parallel to the LED bottom surface.
5. The method of claim 1 , wherein the first DBR is deposited by a chemical vapor deposition technique.