Advanced metal interconnects with a replacement metal
An approach to provide a semiconductor structure using different two metal materials for interconnects in the middle of the line and the back end of the line metal layers of a semiconductor chip. The semiconductor structure includes the first metal material connecting both horizontally and vertically with the second metal material and the second metal material connecting both horizontally and vertically with the first metal material where the second metal material is more resistant to electromigration than the first metal material.
1. A semiconductor comprising:
a first metal material in a metal layer, wherein the first metal material includes two lines connected horizontally by a second metal material between the two lines in the metal layer; and
the second metal material is a single-track jog between the two lines.
2. The semiconductor structure of claim 1 , wherein the second metal material is more resistant to electromigration.
3. The semiconductor structure of claim 1 , wherein the second metal material has a higher resistivity than the first metal material, wherein both the second metal material and the first metal material include metal alloys.
4. The semiconductor structure of claim 1 , wherein the single-track jog has a top surface that is larger than a bottom surface of the single-track jog, and wherein the top surface of the second metal material and a top surface of the two lines is flat.
5. The semiconductor structure of claim 1 , wherein the second metal material includes a material selected from the group consisting of tungsten, ruthenium, cobalt, aluminum, copper, rhodium, iridium, and nickel.
6. The semiconductor structure of claim 1 , wherein the single-track jog between the two lines is perpendicular to the two lines in a plan view.
7. The semiconductor structure of claim 1 , wherein an electrical resistance of the second metal material does not increase as rapidly as the electrical resistance of first metal material when a line width of the second metal material is equal to or less than 7 nanometers.
8. The semiconductor structure of claim 1 , wherein the single-track jog has sides abutting sides of the two lines.
9. The semiconductor structure of claim 1 , wherein the first metal material is copper and the second metal material is ruthenium.
10. A semiconductor structure comprising:
a first metal layer composed of a first metal material;
a first via composed of the first metal material in a first interlevel dielectric material on the first metal layer;
a first line composed of the first metal material in a second metal layer; and
a single-track jog composed of a second material connects the line to a second via, wherein the second via composed of the second metal material in a second interlevel dielectric layer connects the first via to a third metal layer composed of the first metal material.
11. The semiconductor structure of claim 10 , wherein the first via composed of the first metal material connects the second via composed of the second metal material to the first metal layer.
12. The semiconductor structure of claim 10 , wherein the single-track jog connects horizontally with the first line and vertically with both the first metal layer and the third metal layer by the first via and the second via.
13. The semiconductor structure of claim 10 , wherein the single-track jog is perpendicular to the first line in a plan view.
14. The semiconductor structure of claim 10 , further comprising:
a second line composed of the first metal material in the second metal layer; and
at least one top via composed of the first metal material directly on a portion of the second line, wherein the at least one top via contacts the second line to the third metal layer.
15. The semiconductor structure of claim 10 , wherein an electrical resistance of the second metal material does not increase as rapidly as the electrical resistance of first metal material when a line width of the second metal material is equal to or less than 7 nanometers.
16. The semiconductor structure of claim 10 , wherein the first metal material is copper and the second metal material is ruthenium.
17. The semiconductor structure of claim 10 , wherein the second metal material horizontally connects to the first line composed of the first metal material, and wherein the second metal material directly contacts the first via composed of the first metal material and the third metal layer composed of the first metal material.