IP Library › Granted Patent US 11,957,036
Granted Patent B2
US 11,957,036 · App. 17/414,003 · Granted Apr 9, 2024

Perovskite light-emitting diode and method of manufacturing the same

Inventor: Yongwei Wu (Guangdong, CN)
Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
H10K71/00H10K50/11H10K50/15H10K50/16H10K71/441H10K85/30
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Quick Facts
Patent No.
US 11,957,036
App. No.
17/414,003
Granted
Apr 9, 2024
Kind
B2
Abstract

A perovskite light-emitting diode and a method of manufacturing the same are provided. The method includes steps of providing a substrate, disposing a first electrode layer, a hole transport layer, and a perovskite precursor liquid layer on the substrate, coating the perovskite precursor liquid layer with a first solvent, performing a first thermal process to form a perovskite prefabricated layer, coating the perovskite prefabricated layer with a second solvent, and performing a second thermal process to form a perovskite light-emitting layer.

Claims (32)

1. A method of manufacturing a perovskite light-emitting diode, comprising steps of:

providing a substrate;

disposing a first electrode layer on the substrate, wherein the first electrode layer is formed by vacuum evaporation;

disposing a hole transport layer on the first electrode layer;

disposing a perovskite precursor liquid layer on the hole transport layer;

coating the perovskite precursor liquid layer with a first solvent, performing a first thermal process on the perovskite precursor liquid layer coated with the first solvent, and allowing the perovskite precursor liquid layer to form a perovskite prefabricated layer;

coating the perovskite prefabricated layer with a second solvent, performing a second thermal process on the perovskite prefabricated layer coated with the second solvent, and allowing the perovskite prefabricated layer to form a perovskite light-emitting layer; and

disposing an electron transport layer and a second electrode layer sequentially on the perovskite light-emitting layer;

wherein durations for the first thermal process and the second thermal process range from 10 minutes to 120 minutes.

2. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein the first solvent comprises one of toluene, chlorobenzene, anisole, and acetone or any combination thereof.

3. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein the second solvent comprises one of ethanol, isopropanol, and n-hexane or any combination thereof.

4. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein a material of the hole transport layer comprises one of PEDOT:PSS, NiO, and MoO 3 or any combination thereof.

5. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein a material of the electron transport layer comprises one of TPBi, B 3 PYMPM, BCP, SnO 2 , and TiO 2 or any combination thereof.

6. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein materials of the first electrode layer and the second electrode layer comprise one of Al, ITO, Mg, and Ag or any combination thereof.

7. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein temperatures of the first thermal process and the second thermal process range from 60° C. to 120° C.

8. The method of manufacturing the perovskite light-emitting diode according to claim 1 , wherein atmospheres of the first thermal process and the second thermal process comprise one of helium, neon, argon, krypton, and xenon or any combination thereof.

9. A method of manufacturing a perovskite light-emitting diode, comprising steps of:

providing a substrate;

disposing a first electrode layer on the substrate;

disposing a hole transport layer on the first electrode layer;

disposing a perovskite precursor liquid layer on the hole transport layer;

coating the perovskite precursor liquid layer with a first solvent, performing a first thermal process on the perovskite precursor liquid layer coated with the first solvent, and allowing the perovskite precursor liquid layer to form a perovskite prefabricated layer;

coating the perovskite prefabricated layer with a second solvent, performing a second thermal process on the perovskite prefabricated layer coated with the second solvent, and allowing the perovskite prefabricated layer to form a perovskite light-emitting layer; and

disposing an electron transport layer and a second electrode layer sequentially on the perovskite light-emitting layer;

durations for the first thermal process and the second thermal process range from 10 minutes to 120 minutes.

10. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein the first solvent comprises one of toluene, chlorobenzene, anisole, and acetone or any combination thereof.

11. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein the second solvent comprises one of ethanol, isopropanol, and n-hexane or any combination thereof.

12. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein a material of the hole transport layer comprises one of PEDOT:PSS, NiO, and MoO 3 or any combination thereof.

13. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein a material of the electron transport layer comprises one of TPBi, B 3 PYMPM, BCP, SnO 2 , and TiO 2 or any combination thereof.

14. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein materials of the first electrode layer and the second electrode layer comprise one of Al, ITO, Mg, and Ag or any combination thereof.

15. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein temperatures of the first thermal process and the second thermal process range from 60° C. to 120° C.

16. The method of manufacturing the perovskite light-emitting diode according to claim 9 , wherein atmospheres of the first thermal process and the second thermal process comprise one of helium, neon, argon, krypton, and xenon or any combination thereof.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2021
From: WU, YONGWEI
To: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Reel/Frame 056900/0050 →
Priority Claims (1)
CN 202010426149.1 · May 19, 2020 · national
Continuity (1)
Related Publication 20220310982A1 · Sep 29, 2022