IP Library › Granted Patent US 11,731,483
Granted Patent B2
US 11,731,483 · App. 17/416,788 · Granted Aug 22, 2023

Temperature adjustment circuit

Inventors: Tetsu Miyamoto (Saitama, JP); Toshikatsu Katagiri (Saitama, JP); Kengo Aoki (Saitama, JP); Naoki Fujihara (Saitama, JP); Ayumu Uno (Tokyo, JP); Kenta Sugitate (Saitama, JP); Takeshi Otani (Saitama, JP)
Assignee: HONDA MOTOR CO., LTD.
B60H1/00278B60H1/00885B60L58/26
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Quick Facts
Patent No.
US 11,731,483
App. No.
17/416,788
Granted
Aug 22, 2023
Kind
B2
Abstract

A temperature adjustment circuit includes a first temperature adjustment circuit and a second temperature adjustment circuit in which a control device is configured to switch between a circulation state where a heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and a non-circulation state where the heat-transfer medium is not circulated through the connection circuit.

Claims (33)

1. A temperature adjustment circuit comprising:

a first temperature adjustment circuit that includes:

a first pump that is configured to supply a heat-transfer medium to a first cooling target and

a first heat exchanging part that transfers heat between the heat-transfer medium and an air-conditioning refrigerant;

a second temperature adjustment circuit that includes:

a second pump that is configured to supply the heat-transfer medium to a second cooling target and

a second heat exchanging part that transfers heat between the heat-transfer medium and outside air;

a first connection path that connects a first connection portion of the first temperature adjustment circuit and a first connection portion of the second temperature adjustment circuit;

a second connection path that connects a second connection portion of the first temperature adjustment circuit and a second connection portion of the second temperature adjustment circuit;

a three-way valve that is provided in the first connection portion of the second temperature adjustment circuit and is configured to switch between supply of the heat-transfer medium to the second connection portion of the second temperature adjustment circuit and supply of the heat-transfer medium to the first connection path;

a shut-off valve that is provided between the first connection portion of the first temperature adjustment circuit and the second connection portion of the first temperature adjustment circuit; and

a control device that is configured to control the three-way valve and the shut-off valve,

wherein the control device is configured to switch between

a circulation state where the shut-off valve is set to a valve-closed state and the three-way valve is controlled to supply the heat-transfer medium to the first connection path so that the heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and

a non-circulation state where the shut-off valve is set to a valve-open state and the three-way valve is controlled to supply the heat-transfer medium to the second connection portion of the second temperature adjustment circuit so that the heat-transfer medium is not circulated through the connection circuit.

2. The temperature adjustment circuit according to claim 1 , wherein

the first cooling target is a battery,

the second cooling target is a power conversion device, and,

in the circulation state, the heat-transfer medium flows through the second cooling target, the second heat exchanging part, the first heat exchanging part, and the first cooling target in this order.

3. The temperature adjustment circuit according to claim 2 ,

wherein the first temperature adjustment circuit further includes a charger.

4. The temperature adjustment circuit according to claim 2 ,

wherein the second temperature adjustment circuit further includes a charger.

5. The temperature adjustment circuit according to claim 2 ,

wherein the second temperature adjustment circuit further includes a buffer tank that is disposed downstream of the second cooling target and upstream of the second heat exchanging part in a flow direction of the heat-transfer medium in the second temperature adjustment circuit in the non-circulation state.

6. The temperature adjustment circuit according to claim 2 ,

wherein the second temperature adjustment circuit further includes a buffer tank that is disposed downstream of the second heat exchanging part and upstream of the second pump in a flow direction of the heat-transfer medium in the second temperature adjustment circuit in the non-circulation state.

7. The temperature adjustment circuit according to claim 1 ,

wherein, in the second temperature adjustment circuit, the second pump is disposed downstream of the second heat exchanging part and upstream of the three-way valve in a flow direction of the heat-transfer medium in the second temperature adjustment circuit in the non-circulation state.

8. The temperature adjustment circuit according to claim 1 ,

wherein, in the first temperature adjustment circuit, the first pump, the first heat exchanging part, and the first cooling target are arranged in this order in a flow direction of the heat-transfer medium in the first temperature adjustment circuit in the non-circulation state.

9. The temperature adjustment circuit according to claim 1 ,

wherein, in the first temperature adjustment circuit, the first pump is disposed between the second connection portion of the first temperature adjustment circuit and the first connection portion of the first temperature adjustment circuit in a flow direction of the heat-transfer medium in the first temperature adjustment circuit in the non-circulation state.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2022
From: MIYAMOTO, TETSU; KATAGIRI, TOSHIKATSU; AOKI, KENGO; FUJIHARA, NAOKI; UNO, AYUMU; SUGITATE, KENTA; OTANI, TAKESHI
To: HONDA MOTOR CO., LTD.
Reel/Frame 058662/0151 →
Continuity (1)
Related Publication 20220063368A1 · Mar 3, 2022