Curable silicone composition, cured product thereof, and method for producing same
Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.
1. A curable granular silicone composition, comprising
(A) organopolysiloxane resin microparticles having a curing reactive functional group;
(B) a functional inorganic filler; and
(C) a curing agent;
wherein the curable granular silicone composition provides a cured product thereof where the value of the storage elastic modulus (G′) at 25° C. is 2,000 MPa or less,
the value of the storage elastic modulus (G′) at 150° C. is 100 MPa or less, and
the peak value of the loss tangent (tan δ) of the cured product, which is expressed by the storage elastic modulus/loss elastic modulus (G′/G″) at a frequency of 1.0 Hz, is 0.40 or more; and
wherein component (A) comprises a mixture of:
(A2-1) an organopolysiloxane resin microparticle having a softening point of 200° C. or higher and no hot-melt properties as a whole molecule, having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin microparticle is siloxane units represented by SiO 4/2 ; and
(A2-2) a straight- or branched-chain organopolysiloxane, liquid at 25° C., having at least two curing reactive functional groups containing a carbon-carbon double bond in the molecule.
2. The curable granular silicone composition according to claim 1 , wherein component (B) is a functionally inorganic filler that is one or more types selected from the group consisting of a reinforcing filler, a white pigment, a thermal conductive filler, an electrically conductive filler, and an organic filler.
3. The curable granular silicone composition according to claim 1 , wherein component (A) further comprises (A1) a hot-meltable organopolysiloxane resin microparticle having a softening point of 30° C. or higher and having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule.
4. The curable granular silicone composition according to claim 3 , wherein at least some or all of component (A1) is:
(A1-1) a hot-meltable organopolysiloxane resin microparticle with a regular spherical shape and a softening point of 30° C. or higher, having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule, and at least 10 mol % of the silicon-bonded organic groups are aryl groups, and the average primary particle diameter thereof is 1 to 10 μm.
5. The curable granular silicone composition according to claim 3 , wherein at least some or all of component (A1) is:
(A1-2) a hot-meltable organopolysiloxane resin microparticle with a softening point of 30° C. or higher, having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule, comprising:
(A 1 ) a resinoid organosiloxane,
(A 2 ) an organopolysiloxane crosslinked product comprising at least one partially crosslinked organopolysiloxane,
(A 3 ) a block copolymer comprising a resinoid organosiloxane and chain-like organosiloxane blocks,
or a mixture of at least two of these.
6. The curable granular silicone composition according to claim 1 , wherein at least some or all of component (A) is a mixture of component (A2-1) and component (A2-2), and where component (A2-1) is organopolysiloxane resin microparticles selected from:
(A2-1-1) organopolysiloxane resin microparticles having no hot-melt properties as a whole molecule, having no curing reactive functional group containing carbon-carbon double bonds in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin microparticles is siloxane units represented by SiO 4/2 , and
an organopolysiloxane resin microparticle mixture having no hot-melt properties as a whole molecule, having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin microparticle mixture is siloxane units represented by SiO 4/2 .
7. The curable granular silicone composition according to claim 6 , wherein at least some or all of component (A) is a mixture of component (A2-1) and component (A2-2), and where component (A2-2) is:
(A2-2-1) a straight-chain organopolysiloxane represented by the following structural formula:
R 4 3 SiO(SiR 4 2 O) k SiR 4 3
where each R 4 is independently a monovalent hydrocarbon group having 1 to 10 carbon atoms, except that at least two of the R 4 in one molecule are alkenyl groups, and k is a number from 20 to 5,000.
8. The curable granular silicone composition according to claim 1 , wherein at least some or all of component (A) is a mixture comprising:
(A2-1-1) 100 parts by mass of organopolysiloxane resin microparticles having no hot-melt properties as a whole molecule, having no curing reactive functional group containing a carbon-carbon double bond in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin microparticles is siloxane units represented by SiO 4/2 ,
(A2-1-2) 3 to 50 parts by mass of an organopolysiloxane resin microparticle having no hot-melt properties as a whole molecule, having at least one curing reactive functional group containing a carbon-carbon double bond in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin microparticle is siloxane units represented by SiO 4/2 , or
(A2-2-1) 15 to 100 parts by mass of a straight-chain diorganopolysiloxane represented by the following structural formula:
R 4 3 SiO(SiR 4 2 O) k SiR 4 3
where each R 4 is independently a monovalent hydrocarbon group having 1 to 10 carbon atoms, except that at least two of the R 4 in one molecule are alkenyl groups, and k is a number from 20 to 5,000.
9. The curable granular silicone composition according to claim 1 , wherein component (B) is selected from the group consisting of a reinforcing filler, a white pigment, a thermally conductive filler, an electrically conductive filler, a phosphor, and a mixture of at least two of these.
10. The curable granular silicone composition according to claim 1 , wherein the content of component (B) ranges from 10 to 50 volume % of the entire composition.
11. The curable granular silicone composition according to claim 1 , in a form of a pellet or a sheet.
12. A laminate body having a structure including a sheet-like member comprising the curable granular silicone composition according to claim 1 between two film-like substrates provided with a release layer.
13. The laminate body according to claim 12 , wherein the sheet-like member comprising the curable granular silicone composition has a thickness of 1 mm or less and is a film-like adhesive.
14. A cured product obtained by curing the curable granular silicone composition according to claim 1 .
15. A semiconductor device, comprising the cured product according to claim 14 .
16. A method for manufacturing the curable granular silicone composition according to claim 1 , wherein each component that makes up the curable granular silicone composition is granulated by mixing under temperature conditions not exceeding 50° C.
17. A method of molding a cured product, comprising the following steps:
(I) heating the curable granular silicone composition in the form of pellets or sheets according to claim 11 to a temperature of 100° C. or higher to melt;
(II) injecting the curable granular silicone composition in a liquid state obtained in step (I) into a mold or distributing the curable granular silicone composition obtained in step (I) to a mold by clamping; and
(III) curing the curable granular silicone composition injected or distributed in step (II).
18. A method for molding a cured product, comprising a coating process for overmolding and underfilling a semiconductor device using a cured product formed from the curable granular silicone composition according to claim 1 .
19. The method for molding a cured product according to claim 18 , comprising:
covering a surface of a semiconductor wafer substrate on which a single or plurality of semiconductor devices are mounted with a cured product produced by curing the curable granular silicone composition; and
overmolding so that a gap between the semiconductor devices is filled with the cured product.