IP Library Granted Patent US 11,904,411
Granted Patent B2
US 11,904,411 · App. 17/420,233 · Granted Feb 20, 2024

Method for producing thin glass resin laminate piece

Inventors: Atsushi Kishi (Ibaraki, JP); Takeshi Murashige (Ibaraki, JP); Satoshi Hirata (Ibaraki, JP)
Assignee: NITTO DENKO CORPORATION
B23K26/402B23K26/0006B23K26/38B23K26/57B32B17/10C09J7/29C09J7/38B23K2103/172B23K2103/54C09J2400/14
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Quick Facts
Patent No.
US 11,904,411
App. No.
17/420,233
Granted
Feb 20, 2024
Kind
B2
Abstract

Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (μm) of the pressure-sensitive adhesive layer and a creep characteristic (μm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (μm)) 2 ×creep characteristic (μm/Hr)≥50×10 3 (μm 2 ·μm/Hr).

Claims (11)

1. A method of producing a thin glass resin laminate piece, comprising a step of subjecting a thin glass resin laminate including a thin glass having a thickness of 100 μm or less, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (μm) of the pressure-sensitive adhesive layer and a creep characteristic (μm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (μm)) 2 ×creep characteristic (μm/Hr)≥50×10 3 (μm 2 ·μm/Hr).

2. The method of producing a thin glass resin laminate piece according to claim 1 , wherein the thickness of the pressure-sensitive adhesive layer is 10 μm or more.

3. The method of producing a thin glass resin laminate piece according to claim 1 , wherein the creep characteristic of the pressure-sensitive adhesive layer is 100 μm/Hr or more.

4. The method of producing a thin glass resin laminate piece according to claim 1 , wherein the resin layer is a polarizing plate.

5. The method of producing a thin glass resin laminate piece according to claim 1 ,

wherein the step of subjecting the thin glass resin laminate to the laser processing to cut the laminate includes the steps of

irradiating a surface of the thin glass with laser light, and

irradiating a surface of the resin layer with laser light, and

wherein a laser to be used for the resin layer and a laser to be used for the thin glass are different lasers.

6. The method of producing a thin glass resin laminate piece according to claim 5 , wherein the laser to be used for the irradiation of the thin glass with the laser light is an ultrashort pulse laser.

7. The method of producing a thin glass resin laminate piece according to claim 5 , wherein the laser to be used for the irradiation of the resin layer with the laser light is a CO 2 laser, a CO laser, a visible light pulse laser, or a UV pulse laser.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2021
From: KISHI, ATSUSHI; MURASHIGE, TAKESHI; HIRATA, SATOSHI
To: NITTO DENKO CORPORATION
Reel/Frame 056734/0932 →
Priority Claims (1)
JP 2019-009313 · Jan 23, 2019 · national
Continuity (1)
Related Publication 20220080530A1 · Mar 17, 2022
Cited By (1)
US 12,312,511