IP Library › Granted Patent US 12,083,722
Granted Patent B2
US 12,083,722 · App. 17/420,715 · Granted Sep 10, 2024

Method for manufacturing film-formed molded product

Inventors: Takao Umezawa (Gunma, JP); Hitoshi Konuma (Gunma, JP); Mitsunori Sato (Gunma, JP)
Assignee: MITSUBA Corporation
B29C45/162B29C45/0053B29C45/0416B29C45/062B29C45/14778B29C45/1618B29C45/1635B29C45/1671C23C14/34C23C14/505B29C2045/0079B29C2045/1673B29K2995/0003B29L2009/008B29L2031/3456
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Quick Facts
Patent No.
US 12,083,722
App. No.
17/420,715
Granted
Sep 10, 2024
Kind
B2
Abstract

The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product between a movable mold and a fixed mold; and then forming the metal coating film which covers the molded product by a film-forming part of a second mold without taking the molded product out from between the movable mold and the fixed mold. The metal coating film is capable of transmitting electromagnetic waves therethrough as a result of generation of cracks after being formed.

Claims (21)

1. A method for manufacturing a film-formed molded product which comprises a non-conductive first molded product and a metal coating film that covers the first molded product and has an electromagnetic wave transmission performance, comprising:

a process (a) in which a first mold and a second mold are mold-clamped, a first material is injected into a first space between the first mold and the second mold, and thereby the first molded product comprising the first material is formed;

a process (b) in which after the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold between the first mold and the second mold; and

a process (c) in which after the process (b), the first mold and the second mold are mold-clamped, and the metal coating film is formed on a surface of the first molded product by a first film-forming part comprised in the second mold,

a process (c1) in which after the process (c), the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold, the first mold and the second mold are mold-clamped at a second film-forming part formed adjacent to the first film-forming part, and a protective film made of aluminum oxide, magnesium fluoride or silicon oxide is formed on a surface of the metal coating film;

a process (d) in which after the process (c1), the first molded product, the metal coating film and the protective film are heated;

wherein cracks are generated on the metal coating film when temperatures of the first molded product, the metal coating film and the protective film are changed after the process (d), and thereby an electromagnetic wave transmission performance is imparted to the metal coating film and the protective film,

wherein the first film-forming part comprises a sputtering device,

a target disposed opposite to the first molded product for forming the metal coating film is curved or bent along a surface of the first molded product.

2. The method for manufacturing a film-formed molded product according to claim 1 , wherein

the first molded product is located between the first mold and the second mold from the process (a) to the process (d).

3. The method for manufacturing a film-formed molded product according to claim 1 , wherein

the first material and a second material which constitutes the metal coating film have coefficients of thermal expansion different from each other.

4. The method for manufacturing a film-formed molded product according to claim 1 , wherein

after being formed in the process (a), the first molded product is maintained at a temperature of 100° C. or higher until the metal coating film is formed in the process (c).

5. The method for manufacturing a film-formed molded product according to claim 1 , wherein

in the process (b) to the process (c1), the first molded product supported by the first mold is moved by rotating the first mold.

6. The method for manufacturing a film-formed molded product according to claim 1 , wherein

a film thickness of the metal coating film is 800 to 1500 Å.

7. The method for manufacturing a film-formed molded product according to claim 1 , wherein

a second material constituting the metal coating film is stainless steel, chromium, or aluminum.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2021
From: UMEZAWA, TAKAO; KONUMA, HITOSHI; SATO, MITSUNORI
To: MITSUBA CORPORATION
Reel/Frame 056797/0984 →
Priority Claims (1)
JP 2019-003263 · Jan 11, 2019 · national
Continuity (1)
Related Publication 20220105667A1 · Apr 7, 2022