IP Library Granted Patent US 11,597,196
Granted Patent B2
US 11,597,196 · App. 17/424,596 · Granted Mar 7, 2023

Method for producing thermally conductive sheet

Inventors: Yusuke Kubo (Shimotsuke, JP); Keisuke Aramaki (Shimotsuke, JP)
Assignee: DEXERIALS CORPORATION
B32B37/182B29C70/58B32B7/027B32B27/20B32B27/283B29K2083/00B29K2307/04B29K2995/0013B29L2007/002B32B2262/106B32B2307/302F28F21/06F28F2255/06H01L23/3733
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,597,196
App. No.
17/424,596
Granted
Mar 7, 2023
Kind
B2
Abstract

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm 2 /W or less.

Claims (17)

1. A method for producing a thermally conductive sheet, comprising:

forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler;

forming a silicone resin film by applying a silicone resin to a supporting body;

affixing at least one surface of the molded body sheet directly to a silicone resin side of the silicone resin film; and

transferring the silicone resin to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet, the silicone resin layer being to be attached to a heat source or a heat dissipating member;

wherein the molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm 2 /W or less.

2. The method according to claim 1 , wherein the silicone resin layer is formed on only one surface of the molded body sheet, and the thickness of the silicone resin layer is 12 μm or less.

3. The method according to claim 1 , wherein the silicone resin layer is formed on both surfaces of the molded body sheet, and a total thickness of the silicone resin layer formed on both surfaces of the molded body sheet is 12 μm or less.

4. The method according to claim 1 , wherein the silicone resin is transferred to only one surface of the molded body sheet.

5. The method according to claim 4 , wherein a surface of the molded body sheet to which the silicone resin is not transferred is non-adhesive.

6. The method according to claim 1 , wherein the molded body sheet is formed by:

molding a thermally conductive resin composition comprising a polymer matrix and the fibrous thermally conductive filler dispersed in the polymer matrix into a predetermined shape;

curing the molded thermally conductive resin composition to form a thermally conductive molded body; and

slicing the thermally conductive molded body into a sheet shape.

7. The method according to claim 6 , wherein the polymer matrix comprises a liquid silicone.

8. The method according to claim 1 , wherein the fibrous thermally conductive filler is a carbon fiber.

9. The method according to claim 1 , wherein the molded body sheet comprises a silicone resin, and the silicone resin included in the molded body sheet and the silicone resin which is transferred to the at least one surface of the molded body sheet are the same.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: KUBO, YUSUKE; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 056931/0833 →
Priority Claims (1)
JP JP2019-011143 · Jan 25, 2019 · national
Continuity (1)
Related Publication 20220080718A1 · Mar 17, 2022