IP Library › Assignment 071999/0883
Patent Assignment
Reel/Frame 071999/0883

Nunc Pro Tunc Assignment

Recorded: 2025-08-12 Pages: 4
Assignor
DEXERIALS CORPORATION
Executed: 2025-08-12
Assignee
SEKISUI CHEMICAL CO., LTD.
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 5308565, JAPAN
Covered Properties (36)
Heat Transfer Sheet, Method for Producing Heat Transfer Sheet, Heat Transfer Sheet Package, and Method for Producing Heat Transfer Sheet Package
Application: 19/023,709 →
Publication: US 2025/0153287
Thermally-Conductive Sheet and Thermally-Conductive Sheet Production Method
Application: 18/567,857 →
Publication: US 2024/0262979
Heat-Conductive Sheet, Heat-Conductive Sheet Production Method, and Electronic Equipment
Application: 18/277,122 →
Publication: US 2024/0124758
Thermally-Conductive Sheet and Electronic Device
Application: 18/276,509 →
Publication: US 2024/0120254
Heat Transfer Sheet, Method for Producing Heat Transfer Sheet, Heat Transfer Sheet Package, and Method for Producing Heat Transfer Sheet Package
Application: 18/276,497 →
Publication: US 2024/0116146
Thermally Conductive Sheet, Thermally Conductive Sheet Supply Form, Thermally Conductive Sheet Precursor, and Method for Manufacturing Thermally Conductive Sheet
Application: 18/275,450 →
Publication: US 2024/0117148
Thermally Conductive Sheet and Production Method for Thermally Conductive Sheet
Application: 18/025,687 →
Publication: US 2023/0348679
Thermally Conductive Sheet and Method for Manufacturing Thermally Conductive Sheet
Application: 18/021,595 →
Publication: US 2024/0010898
Thermally Conductive Resin Composition and Thermally Conductive Sheet Using the Same
Application: 17/626,638 →
Publication: US 2022/0298402
Thermally Conductive Resin Composition and Thermally Conductive Sheet Using the Same
Application: 17/617,845 →
Publication: US 2022/0254701
Thermally Conductive Sheet and Method for Manufacturing Thermally Conductive Sheet
Application: 17/617,238 →
Publication: US 2022/0262702
Method for Producing Thermally Conductive Sheet
Application: 17/424,596 →
Publication: US 2022/0080718
Electronic Device
Application: 17/053,248 →
Publication: US 2021/0296264
Semiconductor Device
Application: 17/041,440 →
Publication: US 2021/0020542
Semiconductor Device and Method of Producing the Same
Application: 16/973,765 →
Publication: US 2021/0225777
Semiconductor Device and Method of Producing the Same
Application: 16/973,035 →
Publication: US 2021/0272879
Semiconductor Device Having an Electromagnetic Wave Absorbing Thermal Conductive Sheet Between a Semiconductor Element and a Cooling Member
Application: 16/473,249 →
Publication: US 2020/0152581
Electromagnetic Wave Absorbing Heat Conductive Sheet, Method for Producing Electromagnetic Wave Absorbing Heat Conductive Sheet, and Semiconductor Device
Application: 16/085,263 →
Publication: US 2019/0080978
Thermally Conductive Sheet, Production Method for Thermally Conductive Sheet, Heat Dissipation Member, and Semiconductor Device
Application: 16/072,334 →
Publication: US 2019/0055443
Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
Patent: 9,922,901 →
Application: 15/521,426 →
Publication: US 2017/0309542
Heat Diffusion Sheet
Application: 15/300,400 →
Publication: US 2017/0141009
Multilayer Heat-Conductive Sheet, and Manufacturing Method for Multilayer Heat-Conductive Sheet
Application: 15/257,013 →
Publication: US 2016/0372400
Heat Conductive Sheet and Method for Producing Heat Conductive Sheet
Application: 15/117,580 →
Publication: US 2016/0355000
Thermally Conductive Sheet
Patent: 9,437,521 →
Application: 14/989,686 →
Publication: US 2016/0118316
Thermally Conductive Sheet and Method for Producing Thermally Conductive Sheet
Application: 14/962,788 →
Publication: US 2016/0091265
Method of Manufacturing Heat Conductive Sheet
Patent: 9,536,804 →
Application: 14/899,221 →
Publication: US 2016/0141223
Method of Manufacturing Heat Conductive Sheet, Heat Conductive Sheet, and Heat Dissipation Member
Patent: 9,560,791 →
Application: 14/898,858 →
Publication: US 2016/0150680
Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device
Patent: 9,966,324 →
Application: 14/892,724 →
Publication: US 2016/0104657
Thermally Conductive Sheet
Application: 14/770,794 →
Publication: US 2016/0009963
Method of Producing Heat Conductive Sheet
Application: 14/404,741 →
Publication: US 2015/0118505
Method of Producing Heat Conductive Sheet
Patent: 9,944,840 →
Application: 14/402,195 →
Publication: US 2015/0144316
Heat Conductive Sheet
Application: 14/401,954 →
Publication: US 2015/0166771
Thermally Conductive Sheet and Process for Producing Same
Patent: 9,365,001 →
Application: 14/323,423 →
Publication: US 2014/0349067
Thermally Conductive Sheet and Process for Producing Same
Patent: 9,308,695 →
Application: 14/323,313 →
Publication: US 2014/0346710
Thermally Conductive Sheet and Process for Producing Same
Patent: 8,808,607 →
Application: 13/702,438 →
Publication: US 2013/0136895
Magnetic Sheet, Method for Producing the Magnetic Sheet, Antenna, and Portable Communication Device
Patent: 8,295,786 →
Application: 12/633,393 →
Publication: US 2010/0099365
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2018
From: KANAYA, HIROKI; NOMURA, YU; UCHIDA, SHUNSUKE; UCHIDA, SHINICHI
To: DEXERIALS CORPORATION
Reel/Frame 046455/0505 →
Assignment of Assignor's Interest Sep 14, 2018
From: KUMURA, TATSUO; KUBO, YUSUKE; ARAMAKI, KEISUKE; RYOSON, HIROYUKI
To: DEXERIALS CORPORATION
Reel/Frame 046878/0151 →
Assignment of Assignor's Interest Jun 25, 2019
From: KUMURA, TATSUO; RYOSON, HIROYUKI
To: DEXERIALS CORPORATION
Reel/Frame 049572/0348 →
Assignment of Assignor's Interest Sep 25, 2020
From: KUMURA, TATSUO
To: DEXERIALS CORPORATION
Reel/Frame 053879/0763 →
Assignment of Assignor's Interest Nov 5, 2020
From: KUBO, YUSUKE; BOLOTOV, SERGEY
To: DEXERIALS CORPORATION
Reel/Frame 054288/0120 →
Assignment of Assignor's Interest Dec 8, 2020
From: KUBO, YUSUKE; BOLOTOV, SERGEY
To: DEXERIALS CORPORATION
Reel/Frame 054570/0254 →
Assignment of Assignor's Interest Dec 10, 2020
From: BOLOTOV, SERGEY; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 054599/0489 →
Assignment of Assignor's Interest Jul 21, 2021
From: KUBO, YUSUKE; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 056931/0833 →
Assignment of Assignor's Interest Dec 7, 2021
From: SATO, YUMA; ARAMAKI, KEISUKE; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 058327/0084 →
Assignment of Assignor's Interest Dec 9, 2021
From: MATSUSHIMA, MASAYUKI
To: DEXERIALS CORPORATION
Reel/Frame 058351/0819 →
Assignment of Assignor's Interest Jan 12, 2022
From: MATSUSHIMA, MASAYUKI
To: DEXERIALS CORPORATION
Reel/Frame 058631/0270 →
Assignment of Assignor's Interest Feb 16, 2023
From: SATO, YUMA; ARAMAKI, KEISUKE; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 062718/0252 →
Assignment of Assignor's Interest Mar 10, 2023
From: ARAMAKI, KEISUKE; SATO, YUMA; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 062942/0006 →
Assignment of Assignor's Interest Aug 9, 2023
From: MUKASA, KEISUKE; KUBO, YUSUKE; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 064534/0156 →
Assignment of Assignor's Interest Aug 14, 2023
From: TOBATA, MARINA; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 064576/0859 →
Assignment of Assignor's Interest Nov 14, 2023
From: ARAMAKI, KEISUKE; SATO, YUMA; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 065552/0264 →
Assignment of Assignor's Interest Nov 14, 2023
From: ARAMAKI, KEISUKE; SATO, YUMA; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 065551/0719 →
Assignment of Assignor's Interest Dec 7, 2023
From: SATO, YUMA; KUBO, YUSUKE
To: DEXERIALS CORPORATION
Reel/Frame 065794/0890 →
Change of Address Jun 30, 2025
From: DEXERIALS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 071756/0646 →